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公开(公告)号：US09681532B2
公开(公告)日：2017-06-13
申请号：US14901485
申请日：2014-05-08
Applicant: LG INNOTEK CO., LTD.
Inventor： Sang In Yoon , Eun Jin Kim , Jeung Ook Park , Hyun Gu Im
CPC classification number: H05K1/0204 , H01L33/62 , H01L33/641 , H01S5/02469 , H05K1/053 , H05K3/321 , H05K3/388 , H05K2201/0323 , H05K2201/10106
Abstract: A light emitting element module according to an embodiment of the present invention includes a first metal substrate; a second metal substrate on the first metal substrate; an insulation layer on the second metal substrate and including at least one of a carbide-based insulation material and a nitride-based insulation material; a circuit pattern on the insulation layer; and a light emitting element on the insulation layer.
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公开(公告)号：US09241399B2
公开(公告)日：2016-01-19
申请号：US14580491
申请日：2014-12-23
Applicant: LG INNOTEK CO., LTD.
Inventor： Sang In Yoon , Jeong Han Kim , Jeung Ook Park , Hyun Gu Im
CPC classification number: H05K1/0201 , H01L33/62 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/8592 , H05K1/05 , H05K1/053 , H05K1/056 , H05K1/09 , H05K3/243 , H05K2201/0338 , H05K2201/10106 , H01L2924/00014
Abstract: A printed circuit board according to an embodiment of the present invention includes a substrate including a first metal layer, a second metal layer formed on one surface of the first metal layer, and a third metal layer formed on the other surface of the first metal layer, an insulating layer formed on the second metal layer, and a circuit pattern formed on the insulating layer. A cavity configured to accommodate a light emitting element package is formed in the insulating layer. A thermal conductivity of the first metal layer is greater than thermal conductivities of the second metal layer and the third metal layer.
Abstract translation: 根据本发明的实施例的印刷电路板包括：第一金属层，形成在第一金属层的一个表面上的第二金属层和形成在第一金属层的另一个表面上的第三金属层的基板; 形成在第二金属层上的绝缘层和形成在绝缘层上的电路图案。 构造成容纳发光元件封装的空腔形成在绝缘层中。 第一金属层的热导率大于第二金属层和第三金属层的热导率。
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