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    Light-emitting device having a plurality of support layers and light-emitting device package including the same
    3.
    发明授权
    Light-emitting device having a plurality of support layers and light-emitting device package including the same 有权

    公开(公告)号：US10468554B2

    公开(公告)日：2019-11-05

    申请号：US15740167

    申请日：2016-06-17

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Young Ju Han ,  Jina Gu ,  Hyun Gu Im

    IPC: H01L33/36 ,  H01L33/52 ,  H01L33/64 ,  H01L33/62

    Abstract: A light-emitting device according to an embodiment of the present invention includes a substrate; a light-emitting structure provided on the substrate, and including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer provided between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode provided on the light-emitting structure; a first connecting electrode provided on the first electrode; a second electrode provided on the light-emitting structure; a second connecting electrode provided on the second electrode; and a support layer provided around the first electrode, the first connecting electrode, the second electrode and the second connecting electrode. The support layer includes a first support layer having a first coefficient of thermal expansion, and a second support layer provided on the first support layer and having a second coefficient of thermal expansion.

    Circuit board
    6.
    发明授权
    Circuit board 有权

    公开(公告)号：US10932362B2

    公开(公告)日：2021-02-23

    申请号：US16649913

    申请日：2018-09-18

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jong Sik Lee ,  Jin A Gu ,  Soo Jung Yoon ,  Gyung Seok Lee ,  Hyun Gu Im

    IPC: H05K1/03 ,  H05K1/09 ,  C08K3/38 ,  C08K9/06 ,  C09C1/00 ,  C09C3/12 ,  H01L33/64 ,  H05K1/02 ,  H05K3/46

    Abstract: A circuit board according to an embodiment of the present invention comprises: a first metal layer; an insulating layer disposed on the first metal layer and comprising boron nitride agglomerate particles coated with a resin; and a second metal layer disposed on the insulating layer, wherein: one of both surfaces of the first metal layer, on which the insulating layer is disposed, is in at least partial contact with one surface of the insulating layer; one of both surfaces of the second metal layer, on which the insulating layer is disposed, is in at least partial contact with the other surface of the insulating layer; a plurality of grooves are formed on a surface which is one of both surfaces of at least one of the first metal layer and the second metal layer and which has the insulating layer disposed thereon; at least some of the particles are arranged in at least some of the plurality of grooves; the width (W) of at least one of the plurality of grooves is 1 to 1.8 times D50 of the particles; and a ratio (D/W) of the depth (D) to the width (W) of at least one of the plurality of grooves is 0.2 to 0.3.

    Circuit board
    9.
    发明授权
    Circuit board 有权

    公开(公告)号：US11974388B2

    公开(公告)日：2024-04-30

    申请号：US17310657

    申请日：2020-02-13

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Byeong Kyun Choi ,  Min Young Hwang ,  Hyun Gu Im

    IPC: H05K1/03 ,  H05K1/02

    CPC classification number: H05K1/0237 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/036 ,  H05K2201/09481

    Abstract: A circuit board, according to an embodiment, comprises: a first insulating layer; a second insulating layer disposed on one surface of the first insulating layer; and a third insulating layer disposed on the other surface of the first insulating layer. A circuit pattern is disposed on at least one insulating layer from among the first to third insulating layers, at least one insulating layer from among the first to third insulating layers comprises glass fiber, at least one insulating layer from among the first to third insulating layers does not comprise glass fiber, and the thicknesses of the first to third insulating layers are different from each other.

    Printed circuit board
    10.
    发明授权
    Printed circuit board 有权

    公开(公告)号：US11528801B2

    公开(公告)日：2022-12-13

    申请号：US17413427

    申请日：2019-12-12

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Yong Suk Kim ,  Hyun Gu Im ,  Byeong Kyun Choi

    IPC: H05K1/02

    Abstract: A printed circuit board according to an embodiment includes: an insulating layer; and a circuit pattern disposed on the insulating layer, wherein the circuit pattern includes an upper surface, a lower surface, a first side surface, and a second side surface, and surface roughness Ra of at least three surfaces of the upper surface, the lower surface, the first side surface, and the second side surface of the circuit pattern is 0.1 μm to 0.31 μm.

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