Programmable redundancy circuit
    11.
    发明授权
    Programmable redundancy circuit 失效
    可编程冗余电路

    公开(公告)号:US4672240A

    公开(公告)日:1987-06-09

    申请号:US770486

    申请日:1985-08-29

    CPC分类号: G11C29/789

    摘要: A memory redundancy circuit is described incorporating a sequential row or column counter associated with a plurality of programmable row or column decoders. The sequential row counter includes a sequence circuit for each programmable row decoder.The sequence circuit and programmable row decoder incorporate fixed and variable threshold transistors such as metal nitride oxide semiconductor (MNOS) transistors. The threshold of the variable threshold transistors are switched in response to address signals and control signals to permit redundancy. A disable circuit is also described to permit removal of the redundancy circuits to permit retest of the other circuits.

    摘要翻译: 描述存储器冗余电路,其结合有与多个可编程行或列解码器相关联的顺序行或列计数器。 顺序行计数器包括用于每个可编程行解码器的序列电路。序列电路和可编程行解码器包括诸如金属氮化物半导体(MNOS)晶体管的固定和可变阈值晶体管。 响应于地址信号和控制信号来切换可变阈值晶体管的阈值以允许冗余。 还描述了禁用电路以允许去除冗余电路以允许其他电路的重新测试。

    Device structures for high density integrated circuits
    14.
    发明授权
    Device structures for high density integrated circuits 失效
    高密度集成电路的器件结构

    公开(公告)号:US4533934A

    公开(公告)日:1985-08-06

    申请号:US192961

    申请日:1980-10-02

    申请人: Philip C. Smith

    发明人: Philip C. Smith

    摘要: A semiconductor device structure incorporating the edge of silicon island as a surface for diffusing impurities is described to form the drain and source of an MOS transistor and interconnections therebetween to form semiconductor devices such as MOS transistors, variable threshold MNOS transistors, row decoders for use in memories, memory arrays, interconnect crossovers, and high-voltage transistors. A semiconductor process is described for fabricating the above devices utilizing four or five masks.The invention overcomes the problem of high-density integrated circuits by utilizing the edges of silicon islands on an insulating substrate as well as the upper surface of the islands. In addition, contact metallizations are non-critical because of the Schottky barrier diode formed between aluminum and n-type silicon. Both n and p-type semiconductor devices are described.

    摘要翻译: 描述了包含硅岛边缘作为扩散杂质的表面的半导体器件结构,以形成MOS晶体管的漏极和源极以及它们之间的互连,以形成半导体器件,例如MOS晶体管,可变阈值MNOS晶体管,行解码器,用于 存储器,存储器阵列,互连交叉和高压晶体管。 描述了使用四个或五个掩模来制造上述器件的半导体工艺。 本发明通过利用绝缘基板上的硅岛的边缘以及岛的上表面来克服高密度集成电路的问题。 此外,由于在铝和n型硅之间形成肖特基势垒二极管,接触金属化是非关键的。 描述n型和p型半导体器件。