摘要:
A memory redundancy circuit is described incorporating a sequential row or column counter associated with a plurality of programmable row or column decoders. The sequential row counter includes a sequence circuit for each programmable row decoder.The sequence circuit and programmable row decoder incorporate fixed and variable threshold transistors such as metal nitride oxide semiconductor (MNOS) transistors. The threshold of the variable threshold transistors are switched in response to address signals and control signals to permit redundancy. A disable circuit is also described to permit removal of the redundancy circuits to permit retest of the other circuits.
摘要:
An improved electrically alterable non-volatile memory for storing information is described incorporating an array of memory cells composed of variable threshold field effect transistors, means for writing and reading information into and out of the array which includes precharged circuitry to provide predetermined voltages on the gate, source and drain electrodes of the transistors in the array before writing or reading and row decode circuitry on both sides of the array to permit closer spacing of the variable threshold transistors in the array.
摘要:
A method of manufacturing a micro-electrical-mechanical system with thermally isolated active elements. Such a system may embody a bolometer, which is well suited for detecting electromagnetic radiation between 90 GHz and 30 THz while operating at room temperature. The method also discloses a generalized process for manufacturing circuitry incorporating active and passive micro-electrical-mechanical systems in a silicon wafer.
摘要:
A semiconductor device structure incorporating the edge of silicon island as a surface for diffusing impurities is described to form the drain and source of an MOS transistor and interconnections therebetween to form semiconductor devices such as MOS transistors, variable threshold MNOS transistors, row decoders for use in memories, memory arrays, interconnect crossovers, and high-voltage transistors. A semiconductor process is described for fabricating the above devices utilizing four or five masks.The invention overcomes the problem of high-density integrated circuits by utilizing the edges of silicon islands on an insulating substrate as well as the upper surface of the islands. In addition, contact metallizations are non-critical because of the Schottky barrier diode formed between aluminum and n-type silicon. Both n and p-type semiconductor devices are described.