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    INTEGRATED MULTI-CHAMBER HEAT EXCHANGER
    11.
    发明申请
    INTEGRATED MULTI-CHAMBER HEAT EXCHANGER 审中-公开

    公开(公告)号：US20170082372A1

    公开(公告)日：2017-03-23

    申请号：US14860527

    申请日：2015-09-21

    Applicant: Lockheed Martin Corporation

    Inventor： David L. Vos ,  Ryan M. Alderfer ,  Matthew Daniel Miller

    IPC: F28D7/00 ,  B23P15/26 ,  F28F1/12

    Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.

    Fluid-flow-through cooling of circuit boards
    12.
    发明授权
    Fluid-flow-through cooling of circuit boards 有权
    电路板的流体流通冷却

    公开(公告)号：US09426931B2

    公开(公告)日：2016-08-23

    申请号：US14175377

    申请日：2014-02-07

    Applicant: Lockheed Martin Corporation

    Inventor： Brian W. Kaplun ,  James S. Eiche ,  David L. Vos

    IPC: H05K7/20 ,  B23P15/26

    CPC classification number: H05K7/20563 ,  B23P15/26 ,  H05K7/20272 ,  H05K7/2039 ,  H05K7/20763 ,  Y10T29/4935

    Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.

    Abstract translation: 用于传导冷却卡组件的公开的装置可以包括框架，该框架包括适于接合用于至少一个电路卡的导电冷却框架的相对侧上的相应热管理接口的第一和第二导热部分。 该装置还可以包括在框架中在第一和第二开口之间延伸的通道，以便使冷却流体流入第一开口，通过该通道，并流出第二开口。 根据所公开的方法，插入件可以安装在夹层连接器的部件之间，以便增加连接器的高度。 在一些实施方式中，可以在夹层连接器的第一和第二部件分别安装在主机卡和夹层卡上的同时执行插入件的安装，使得插入件在第一和第二部件之间的安装增加间隔 主机卡和夹层卡之间。

    Sensor array packaging solution
    13.
    发明授权
    Sensor array packaging solution 有权
    传感器阵列封装解决方案

    公开(公告)号：US09389103B1

    公开(公告)日：2016-07-12

    申请号：US14573496

    申请日：2014-12-17

    Applicant: LOCKHEED MARTIN CORPORATION

    Inventor： James E. Bishop ,  Allan Johnson ,  Brian Kaplun ,  Steven E. McElwain, Jr. ,  David L. Vos

    IPC: G01D11/00 ,  G01D11/24

    CPC classification number: G01D11/245 ,  G02B6/04 ,  G02B6/4298

    Abstract: A gigahertz sensor array packaging solution for harsh operating environments is disclosed. The sensor array packaging system includes a structural core body comprising sensor mounting features on a surface thereof and an alignment through hole extending from the surface to a backside thereof which incorporates finned features providing cooling and stiffness. The sensor array packaging system further includes one or more electro-optical components mounted to the backside of the structural core body. The sensor array packaging system further includes a wiring board comprising a plurality of sensor array elements contacting walls of the spiral ribbon configuration, each having a cable extending through the through hole to at least one of the one or more electro-optical components.

    Abstract translation: 公开了用于恶劣操作环境的千兆赫传感器阵列封装解决方案。 传感器阵列封装系统包括结构芯体，其包括在其表面上的传感器安装特征和从表面延伸到其背面的对准通孔，其包括提供冷却和刚度的翅片特征。 传感器阵列封装系统还包括安装在结构芯体的背面的一个或多个电光部件。 传感器阵列封装系统还包括布线板，该布线板包括接触螺旋带构造的壁的多个传感器阵列元件，每个传感器阵列元件具有穿过通孔延伸至至少一个或多个电光部件之一的电缆。

    Process for installing an insert for fluid-flow-through cooling of circuit boards
    15.
    发明授权
    Process for installing an insert for fluid-flow-through cooling of circuit boards 有权

    公开(公告)号：US10548243B2

    公开(公告)日：2020-01-28

    申请号：US15169869

    申请日：2016-06-01

    Applicant: Lockheed Martin Corporation

    Inventor： Brian W. Kaplun ,  James S. Eiche ,  David L. Vos

    IPC: H05K7/20 ,  B23P15/26

    Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.

    FLUID-FLOW-THROUGH COOLING OF CIRCUIT BOARDS
    19.
    发明申请
    FLUID-FLOW-THROUGH COOLING OF CIRCUIT BOARDS 审中-公开

    公开(公告)号：US20160278241A1

    公开(公告)日：2016-09-22

    申请号：US15169869

    申请日：2016-06-01

    Applicant: Lockheed Martin Corporation

    Inventor： Brian W. Kaplun ,  James S. Eiche ,  David L. Vos

    IPC: H05K7/20

    CPC classification number: H05K7/20563 ,  B23P15/26 ,  H05K7/20272 ,  H05K7/2039 ,  H05K7/20763 ,  Y10T29/4935

    Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.

    FLUID-COOLED MODULE FOR INTEGRATED CIRCUIT DEVICES
    20.
    发明申请
    FLUID-COOLED MODULE FOR INTEGRATED CIRCUIT DEVICES 有权
    用于集成电路设备的流体冷却模块

    公开(公告)号：US20140340848A1

    公开(公告)日：2014-11-20

    申请号：US14273684

    申请日：2014-05-09

    Applicant: Lockheed Martin Corporation

    Inventor： David L. Vos

    IPC: H05K7/20

    CPC classification number: H05K7/20 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K3/0061 ,  H05K2201/064 ,  H05K2201/10378 ,  H01L2924/00

    Abstract: A self-contained fluid-cooled electro-optical plug in type module capable of being exchangeably mounted in an external chassis incorporates electronic or electro-optical devices mounted on one or more interposers which provide electrical power and electric and optical signal connections to the devices and are also provided with fluid conduits through which a cooling fluid is circulated in a closed-loop cooling path to a heat exchanger for transferring the heat generated in the devices to external heat disposal equipment in the mounting chassis.

    Abstract translation: 能够可交换地安装在外部机架中的独立的流体冷却的电光插头型模块包括安装在一个或多个内插器上的电子或电光器件，其提供电力和与设备的电和光信号连接， 还设置有流体管道，冷却流体通过该流体管道在闭环冷却路径中循环到热交换器，用于将装置中产生的热量转移到安装底盘中的外部热处理设备。

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