公开(公告)号：US20200076092A1

公开(公告)日：2020-03-05

申请号：US16524282

申请日：2019-07-29

Applicant: MEDIATEK Inc.

Inventor： Chung-Hsin CHIANG ,  Shih-Huang YEH

IPC: H01Q21/06 ,  H01Q19/00 ,  H01Q5/50

Abstract: The invention provides an antenna module of improved performances; the antenna module may comprise a plurality of first antennas for signaling at a first band, and a plurality of second antennas for signaling at a second band different from the first band. Each said first antenna may comprise a main radiator which resonates at a mode-one frequency and a mode-two frequency different from the mode-one frequency; and the main radiator may be configured such that the mode-one frequency may be in the first band, and the mode-two frequency may not be in the first band and the second band.

公开(公告)号：US20190081414A1

公开(公告)日：2019-03-14

申请号：US16103057

申请日：2018-08-14

Applicant: MEDIATEK Inc.

Inventor： Yeh-Chun KAO ,  Wun-Jian LIN ,  Chen-Fang TAI ,  Shao-Yu HUANG ,  Shih-Huang YEH

IPC: H01Q21/30 ,  H01Q5/15 ,  H01Q5/28 ,  H01Q5/378

Abstract: A multi-band antenna array includes a plurality of first antennas for resonating at a first band, and a plurality of second antennas for resonating at a second band. A frequency of the second band is higher than a frequency of the first band. Locations of the plurality of first antennas project to a plurality of grid-one positions on a surface; locations of the plurality of second antennas project to a plurality of grid-two positions on the surface. Among the grid-one positions, a second grid-one position is nearest to a first grid-one position by a first distance along a first direction. Among the grid-two positions, a first grid-two position and a second grid-two position are closest two to the first grid-one position. The first and second grid-two positions are separated by a second distance along a second direction; and, the first direction and the second direction are nonparallel.

公开(公告)号：US20240079767A1

公开(公告)日：2024-03-07

申请号：US18455037

申请日：2023-08-24

Applicant: MEDIATEK INC.

Inventor： Yen-Ju LIN ,  Wun-Jian LIN ,  Shih-Huang YEH ,  Nai-Chen LIU

IPC: H01Q1/42 ,  H01Q1/22 ,  H01Q21/00 ,  H01Q23/00

CPC classification number: H01Q1/422 ,  H01Q1/2208 ,  H01Q21/0025 ,  H01Q23/00

Abstract: An antenna module is provided. The antenna module includes a dielectric substrate, a radio frequency integrated circuit (RFIC) and a first number of first antennas. The radio frequency integrated circuit (RFIC) is disposed on the dielectric substrate, wherein the RFIC comprises a single first antenna port group and second antenna port groups to receive or transmit signals. The first number of first antennas is arranged in a first row on the dielectric substrate, wherein at least two of the first antennas are connected to the first antenna port group of the RFIC.

公开(公告)号：US20230207499A1

公开(公告)日：2023-06-29

申请号：US18067221

申请日：2022-12-16

Applicant: MEDIATEK INC.

Inventor： Wun-Jian LIN ,  Shih-Huang YEH ,  Chen-Hao HSU

IPC: H01L23/66 ,  H01L23/498 ,  H01Q1/42 ,  H01Q1/22

CPC classification number: H01L23/66 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49833 ,  H01Q1/422 ,  H01Q1/2283 ,  H01L2223/6622 ,  H01L2223/6677 ,  H01L24/16

Abstract: A semiconductor package structure is provided. The structure includes a package substrate having a first surface and a second surface opposite to the first surface and including a ground layer embedded therein. A semiconductor die is formed on the first surface of the package substrate and an antenna pattern layer is formed on the second surface of the package substrate and electrically coupled to the semiconductor die. The structure also includes a first connector and a second connector formed on the second surface of the package substrate and arranged adjacent to the antenna pattern layer. The first connector is electrically coupled to the semiconductor die and electrically isolated to the ground layer, and the second connector is electrically coupled to the ground layer. A wireless communication device including the semiconductor package structure is also provided.

公开(公告)号：US20200350671A1

公开(公告)日：2020-11-05

申请号：US16398455

申请日：2019-04-30

Applicant: MEDIATEK INC.

Inventor： Ting-Wei KANG ,  Shih-Huang YEH ,  Chen-Fang TAI

IPC: H01Q1/44 ,  H01Q1/24

Abstract: The invention is directed to a communication device. The communication device includes a millimeter-wave antenna array and an appearance metal element. The appearance metal element has an antenna window. The millimeter-wave antenna array is configured to transmit or receive a wireless signal. The wireless signal is transferred through the antenna window of the appearance metal element.

公开(公告)号：US20190386393A1

公开(公告)日：2019-12-19

申请号：US16408582

申请日：2019-05-10

Applicant: MEDIATEK Inc.

Inventor： Chung-Hsin CHIANG ,  Ching-Hsiang WANG ,  Yeh-Chun KAO ,  Shih-Huang YEH

IPC: H01Q5/42 ,  H01Q21/06 ,  H01Q21/24 ,  H01Q5/28

Abstract: A multi-band dual-polarized antenna structure is provided. The multi-band dual-polarized antenna structure includes a first antenna array, a second antenna array and a third antenna array. The first antenna array is arranged in a first row and operating at a first frequency. The second antenna array is arranged in a second row, operates at a second frequency and has a first polarized direction. The third antenna array is arranged in the second row, operates at the second frequency and has a second polarized direction different from the first polarized direction.

公开(公告)号：US20170026103A1

公开(公告)日：2017-01-26

申请号：US15184616

申请日：2016-06-16

Applicant: MediaTek Inc.

Inventor： Shao-Yu HUANG ,  Chung-Yu HUNG ,  Shih-Huang YEH

IPC: H04B7/08

CPC classification number: H04B7/08 ,  H01Q5/50 ,  H01Q21/30 ,  H04B1/0064

Abstract: A multi-antenna system is provided. The multi-antenna system includes a first antenna, a second antenna, a tunable circuit, and a frequency-divisional circuit. The first antenna is utilized to implement signals of a first frequency band. The second antenna is utilized to implement signals of a second frequency band. The second antenna is different from the first antenna, and frequencies of the second frequency band are greater than frequencies of the first frequency band. The tunable circuit is utilized to switch the signals of the first frequency band. The frequency-divisional circuit is utilized to suppress harmonics caused by the tunable circuit.

Abstract translation: 提供多天线系统。 多天线系统包括第一天线，第二天线，可调谐电路和分频电路。 第一天线用于实现第一频带的信号。 第二天线用于实现第二频带的信号。 第二天线与第一天线不同，第二频带的频率大于第一频带的频率。 可调谐电路用于切换第一频带的信号。 分频电路用于抑制由可调电路引起的谐波。