公开(公告)号：US20190081414A1

公开(公告)日：2019-03-14

申请号：US16103057

申请日：2018-08-14

Applicant: MEDIATEK Inc.

Inventor： Yeh-Chun KAO ,  Wun-Jian LIN ,  Chen-Fang TAI ,  Shao-Yu HUANG ,  Shih-Huang YEH

IPC: H01Q21/30 ,  H01Q5/15 ,  H01Q5/28 ,  H01Q5/378

Abstract: A multi-band antenna array includes a plurality of first antennas for resonating at a first band, and a plurality of second antennas for resonating at a second band. A frequency of the second band is higher than a frequency of the first band. Locations of the plurality of first antennas project to a plurality of grid-one positions on a surface; locations of the plurality of second antennas project to a plurality of grid-two positions on the surface. Among the grid-one positions, a second grid-one position is nearest to a first grid-one position by a first distance along a first direction. Among the grid-two positions, a first grid-two position and a second grid-two position are closest two to the first grid-one position. The first and second grid-two positions are separated by a second distance along a second direction; and, the first direction and the second direction are nonparallel.

公开(公告)号：US20240079767A1

公开(公告)日：2024-03-07

申请号：US18455037

申请日：2023-08-24

Applicant: MEDIATEK INC.

Inventor： Yen-Ju LIN ,  Wun-Jian LIN ,  Shih-Huang YEH ,  Nai-Chen LIU

IPC: H01Q1/42 ,  H01Q1/22 ,  H01Q21/00 ,  H01Q23/00

CPC classification number: H01Q1/422 ,  H01Q1/2208 ,  H01Q21/0025 ,  H01Q23/00

Abstract: An antenna module is provided. The antenna module includes a dielectric substrate, a radio frequency integrated circuit (RFIC) and a first number of first antennas. The radio frequency integrated circuit (RFIC) is disposed on the dielectric substrate, wherein the RFIC comprises a single first antenna port group and second antenna port groups to receive or transmit signals. The first number of first antennas is arranged in a first row on the dielectric substrate, wherein at least two of the first antennas are connected to the first antenna port group of the RFIC.

公开(公告)号：US20230207499A1

公开(公告)日：2023-06-29

申请号：US18067221

申请日：2022-12-16

Applicant: MEDIATEK INC.

Inventor： Wun-Jian LIN ,  Shih-Huang YEH ,  Chen-Hao HSU

IPC: H01L23/66 ,  H01L23/498 ,  H01Q1/42 ,  H01Q1/22

CPC classification number: H01L23/66 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49833 ,  H01Q1/422 ,  H01Q1/2283 ,  H01L2223/6622 ,  H01L2223/6677 ,  H01L24/16

Abstract: A semiconductor package structure is provided. The structure includes a package substrate having a first surface and a second surface opposite to the first surface and including a ground layer embedded therein. A semiconductor die is formed on the first surface of the package substrate and an antenna pattern layer is formed on the second surface of the package substrate and electrically coupled to the semiconductor die. The structure also includes a first connector and a second connector formed on the second surface of the package substrate and arranged adjacent to the antenna pattern layer. The first connector is electrically coupled to the semiconductor die and electrically isolated to the ground layer, and the second connector is electrically coupled to the ground layer. A wireless communication device including the semiconductor package structure is also provided.

公开(公告)号：US20240072426A1

公开(公告)日：2024-02-29

申请号：US18453455

申请日：2023-08-22

Applicant: MEDIATEK INC.

Inventor： Nai-Chen LIU ,  Chung-Hsin CHIANG ,  Wun-Jian LIN ,  Shih-Huang YEH

IPC: H01Q1/36 ,  H01Q1/12 ,  H01Q1/46 ,  H01Q21/06

CPC classification number: H01Q1/36 ,  H01Q1/125 ,  H01Q1/46 ,  H01Q21/062

Abstract: An antenna and an electronic device including the antenna are provided. The antenna includes a pair of radiators, a pair of feeding elements, first and second feeding ports. The radiators are located beside a geometric origin and separated from each other. The geometric origin is located between the radiators. The feeding elements are located below the pair of radiators and are configured to feed signals to the radiators. The pair of feeding elements includes a first feeding element and a second feeding element that are separated from each other. The first feeding element has a first geometric configuration. The second feeding element has a second geometric configuration that is asymmetric to the first geometric configuration. The first feeding port is electrically connected to the first feeding element. The second feeding port is separated from the first feeding port and electrically connected to the second feeding element.

公开(公告)号：US20240039165A1

公开(公告)日：2024-02-01

申请号：US18344113

申请日：2023-06-29

Applicant: MEDIATEK INC.

Inventor： Hsuan-Jui CHANG ,  Nai-Chen LIU ,  Shih-Huang YEH ,  Chung-Hsin CHIANG ,  Wun-Jian LIN

IPC: H01Q13/16 ,  H01Q1/42

CPC classification number: H01Q13/16 ,  H01Q1/42

Abstract: An antenna is provided. The antenna includes a first radiator and a second radiator. The first radiator includes a first section and a second section. The first section includes a first grounding edge and a first bending edge. The second section is connected to the first bending edge. The first grounding edge is grounded. The first section is not parallel to the second section. A first slot is formed on the first section. The second radiator includes a third section and a fourth section. The third section includes a second grounding edge and a second bending edge. The fourth section is connected to the second bending edge. The second grounding edge is grounded. The third section is not parallel to the fourth section. The first section is parallel to the third section.

公开(公告)号：US20250038412A1

公开(公告)日：2025-01-30

申请号：US18547211

申请日：2023-04-23

Applicant: MEDIATEK INC.

Inventor： Nai-Chen LIU ,  Shih-Huang YEH ,  Chung-Hsin CHIANG ,  Wun-Jian LIN

IPC: H01Q9/04 ,  H01Q1/22 ,  H01Q9/06 ,  H01Q13/10

Abstract: A semiconductor package is provided. The semiconductor package includes a first passive component module, a first antenna module, a first conductive structure and a second conductive structure. The first passive component module has a top surface, a bottom surface and a first side surface between the top surface and the bottom surface. The passive component module has a first size. The first antenna module is separated from the first passive component module and stacked on the top surface of the first passive component module. The antenna module has a second size. The first conductive structure is in contact with the top surface of the first passive component module and electrically connected to the first antenna module. The second conductive structure is in contact with the bottom surface of the first passive component module.

公开(公告)号：US20240088561A1

公开(公告)日：2024-03-14

申请号：US18457543

申请日：2023-08-29

Applicant: MEDIATEK INC.

Inventor： Yen-Ju LIN ,  Chung-Hsin CHIANG ,  Wun-Jian LIN ,  Shih-Huang YEH

IPC: H01Q5/307 ,  H01Q1/38 ,  H01Q1/48

CPC classification number: H01Q5/307 ,  H01Q1/38 ,  H01Q1/48

Abstract: An antenna structure is provided. The antenna structure includes a first metal layer and a second metal layer disposed over the first metal layer. The second metal layer forms a first antenna resonating element operating at a first band and has a first opening. The antenna structure also includes a third metal layer disposed over the second metal layer. The third metal layer forms a second antenna resonating element operating at a second band, which is different from the first band. The antenna structure further includes a first transmission line extending from the first metal layer to the second metal layer and a second transmission line extending from the first metal layer through the first opening to the third metal layer.