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    Electrode structure for implantable medical leads
    11.
    发明授权
    Electrode structure for implantable medical leads 有权

    公开(公告)号：US11154713B2

    公开(公告)日：2021-10-26

    申请号：US16348661

    申请日：2017-10-13

    Applicant: Medtronic, Inc.

    Inventor： Richard T. Stone ,  Robert J. Davies ,  Seth M. Humphrys ,  Darren A. Janzig

    IPC: A61N1/36 ,  A61N1/05

    Abstract: An implantable segmented electrode structure may be configured to conduct electrical signals between elongated conductors of an implantable medical lead and respective portions of tissue of a patient. The implantable medical lead may extend from an implantable medical device that is implanted within the patient. The segmented electrode structure includes a plurality of separate electrode surfaces. The electrode surfaces are at a plurality of different axial positions and angular positions within the implantable segmented electrode structure. The segmented electrode structure additionally includes a plurality of prongs. The prongs extend axially from a proximal end of the segmented electrode structure through the segmented electrode structure. Each prong may electrically connect to one of the electrode surfaces. The prongs may terminate distally at respective electrode surfaces. Each prong may be configured to electrically connect to one of the elongated conductors.

    Structures and techniques for medical lead fabrication
    12.
    发明授权
    Structures and techniques for medical lead fabrication 有权

    公开(公告)号：US10549088B2

    公开(公告)日：2020-02-04

    申请号：US14396326

    申请日：2013-03-15

    Applicant: Medtronic, Inc.

    Inventor： Dale F. Seeley ,  Evan Mark Gustafson ,  Michael T. Hegland ,  Seth M. Humphrys ,  Darren A. Janzig ,  Gerald G. Lindner

    IPC: A61N1/05

    Abstract: A medical lead may be fabricated using an electrode fixture ((130A)-(130D)) configured to facilitate circumferential and axial alignment between electrodes of the lead. In one example, a method includes positioning an electrode fixture around at least one conductor of a plurality of conductors (122) for a medical lead, wherein the electrode fixture at least partially retains an electrode assembly. The method also includes electrically coupling a portion of the at least one conductor with at least a portion of the electrode assembly at an attachment area defined by the electrode assembly when the electrode assembly is at least partially retained by the electrode fixture.

    METHODS OF MANUFACTURING A HERMETIC LEAD CONNECTOR
    13.
    发明申请
    METHODS OF MANUFACTURING A HERMETIC LEAD CONNECTOR 审中-公开

    公开(公告)号：US20190329048A1

    公开(公告)日：2019-10-31

    申请号：US16507310

    申请日：2019-07-10

    Applicant: Medtronic, Inc.

    Inventor： Darren A. Janzig ,  Gerald G. Lindner ,  Chris J. Paidosh

    IPC: A61N1/375 ,  H01R43/20

    Abstract: A method of manufacturing a hermetic lead connector includes fixing an electrically insulating ring between an electrically conducting contact ring and an electrically conducting spacer ring to form a hermetic ring subassembly, and fixing a plurality of the hermetic ring subassemblies in axial alignment to form a hermetic lead connector. The hermetic lead connector includes an open end, an outer surface, and an inner surface defining a lead aperture. The hermetic lead connector provides a hermetic seal between the outer surface and the inner surface.

    Medical leads and techniques for manufacturing the same
    14.
    发明授权
    Medical leads and techniques for manufacturing the same 有权

    公开(公告)号：US10406349B2

    公开(公告)日：2019-09-10

    申请号：US14206650

    申请日：2014-03-12

    Applicant: Medtronic, Inc.

    Inventor： Alan Shi ,  Darren A. Janzig ,  Bernard Q. Li ,  Richard T. Stone ,  Dale F. Seeley ,  Peng Cong

    IPC: A61N1/05 ,  A61N1/375

    Abstract: In some examples, the disclosure relates to a medical device comprising a lead including an electrically conductive lead wire; and an electrode electrically coupled to the lead wire, the electrode including a substrate and a coating on an outer surface of the substrate, wherein the lead wire is formed of a composition comprising titanium or titanium alloys, wherein the substrate is formed of a composition comprising one or more of titanium, tantalum, niobium, and alloys thereof, wherein the coating comprises at least one of Pt, TiN, IrOx, and poly(dioctyl-bithiophene) (PDOT). In some examples, the lead wire may be coupled to the lead wire via a weld, such as, e.g., a laser weld.

    Implantable device with internal lead connector
    15.
    发明授权
    Implantable device with internal lead connector 有权

    公开(公告)号：US10071253B2

    公开(公告)日：2018-09-11

    申请号：US14210889

    申请日：2014-03-14

    Applicant: MEDTRONIC, INC.

    Inventor： Darren A. Janzig

    IPC: A61N1/375

    CPC classification number: A61N1/3752

    Abstract: An implantable active medical device includes a hermetic housing defining an exterior surface and a hermetic cavity of an implantable active medical device. An elongate lead connector extends into the hermetic cavity. The elongate lead connector includes a closed end, an open end extending through and hermetically joined to the hermetic housing, an outer surface at least partially defining the hermetic cavity, and an inner surface defining a lead aperture.

    Implantable device with shield integrated lead connector
    17.
    发明授权
    Implantable device with shield integrated lead connector 有权
    带有屏蔽集成导线连接器的可植入设备

    公开(公告)号：US09283396B2

    公开(公告)日：2016-03-15

    申请号：US14210901

    申请日：2014-03-14

    Applicant: MEDTRONIC, INC.

    Inventor： Darren A. Janzig

    IPC: A61N1/375

    CPC classification number: A61N1/3752

    Abstract: An implantable active medical device includes a hermetic housing defining an exterior surface and a hermetic cavity of an implantable active medical device. The hermetic housing has a first major surface, an opposing second major surface and a side surface extending between them. An elongate lead connector is recessed into the first major surface. The elongate lead connector has a top surface and a bottom surface and a side surface extending between them. The top surface forms only a portion of the first major surface.

    Abstract translation: 可植入有源医疗装置包括限定可植入的有源医疗装置的外表面和密封腔的密封壳体。 密封壳体具有第一主表面，相对的第二主表面和在它们之间延伸的侧表面。 细长的导线连接器凹入第一主表面。 细长导线连接器具有顶表面和底表面以及在它们之间延伸的侧表面。 顶表面仅形成第一主表面的一部分。

    Implantable medical devices having modular lead bores
    20.
    发明授权
    Implantable medical devices having modular lead bores 有权

    公开(公告)号：US11559695B2

    公开(公告)日：2023-01-24

    申请号：US16717912

    申请日：2019-12-17

    Applicant: MEDTRONIC, INC.

    Inventor： Darren A. Janzig ,  Andrew Thom ,  Brad Tischendorf ,  Randy S. Roles ,  Steven T. Deininger ,  Nicholas R. Whitehead

    IPC: A61N1/375

    Abstract: Implantable medical devices have modular lead bores that are constructed from individual lead bore modules. A given modular lead bore utilizes the number of individual lead bore modules necessary for the particular implantable medical device. Each lead bore module has a lead bore passageway and a feedthrough passageway. An electrical contact is present within the lead bore passageway of each lead bore module and the electrical contact is aligned to the lead bore passageway of a lead bore module. Hermetic feedthrough assemblies are also present within the lead bore passageway of each lead bore module. A feedthrough pin passes through a hermetic feedthrough assembly within a feedthrough passageway of each lead bore module. Each feedthrough pin is electrically coupled to a corresponding electrical contact and the medical device circuitry.

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