公开(公告)号：US20220236619A1

公开(公告)日：2022-07-28

申请号：US17617603

申请日：2019-06-10

Applicant: Mellanox Technologies, Ltd. ,  ETH ZURICH ,  ARISTOTLE UNIVERSITY OF THESSALONIKI

Inventor： Claudia Hoessbacher ,  Juerg Leuthold ,  Elad Mentovich ,  Paraskevas Bakopoulos ,  Dimitrios Kalavrouziotis ,  Dimitrios Tsiokos

IPC: G02F1/225 ,  G02F1/21

Abstract: An optoelectronic device (20) includes thin film structures (56) disposed on a semiconductor substrate (54) and patterned to define components of an integrated drive circuit, which is configured to generate a drive signal. A back end of line (BEOL) stack (42) of alternating metal layers (44, 46) and dielectric layers (50) is disposed over the thin film structures. The metal layers include a modulator layer (48), which contains a plasmonic waveguide (36, 99, 105) and a plurality of electrodes (30, 32, 34, 96, 98, 106), which apply a modulation to surface plasmons polaritons (SPPs) propagating in the plasmonic waveguide in response to the drive signal. A plurality of interconnect layers are patterned to connect the thin film structures to the electrodes. An optical input coupler (38, 82) is configured to couple light into the modulator layer, whereby the light is modulated by the modulation of the SPPs, and an optical output coupler (38, 82) is configured to couple the modulated light out of the modulator layer.

公开(公告)号：US20220216919A1

公开(公告)日：2022-07-07

申请号：US17608170

申请日：2019-05-13

Applicant: MELLANOX TECHNOLOGIES, LTD.

Inventor： Elad Mentovich ,  Dimitrios Kalavrouziotis ,  Paraskevas Bakopoulos ,  Eyal Waldman

IPC: H04B10/524 ,  G02F1/21 ,  G02F1/225

Abstract: A multi-chip module (MCM-10) includes a substrate (11), one or more photonic chips (14) disposed on the substrate, and an electronic chip (12) disposed on the substrate. The one or more photonic chips include one or more optical channels (22), which are configured to guide propagating optical signals, and two or more photonic modulator-segments (18) coupled to each of the optical channels, each photonic modulator-segment configured to modulate the propagating optical signals responsively to digitally modulated driving electrical signals provided thereto. The electronic chip is configured to generate the digitally modulated driving electrical signals on multiple different lanes (16) of the electronic chip, synchronize the driving electrical signals on the multiple lanes to a same clock, separately control respective phases of the driving electrical signals, fine-tune the voltages of the driving electrical signals on the multiple lanes, and drive the photonic modulator-segments on the photonic chips with the synchronized and phase-controlled driving electrical signals.

公开(公告)号：US11336374B1

公开(公告)日：2022-05-17

申请号：US17168488

申请日：2021-02-05

Applicant: Mellanox Technologies, Ltd.

Inventor： Yaakov Gridish ,  Lion Bassat ,  Elad Mentovich ,  Dimitrios Kalavrouziotis ,  Hanan Shumacher

IPC: H04B10/40

Abstract: Optical communication modules, optical communication cables, and associated methods of manufacturing are provided. An example optical communication module includes a substrate supporting a first optical transceiver and a second optical transceiver. The first optical transceiver includes a first optical transmitter that generates optical signals having a first wavelength and a first optical receiver that receives optical signals having a second wavelength. The second optical transceiver includes a second optical transmitter that generates optical signals having the second wavelength and a second optical receiver that receives optical signals having the first wavelength. One or more lens assemblies coupled with the respective transceivers may be used to direct optical signal generated by and directed to the respective transceivers.

公开(公告)号：US11303379B1

公开(公告)日：2022-04-12

申请号：US17160422

申请日：2021-01-28

Applicant: MELLANOX TECHNOLOGIES, LTD.

Inventor： Donald Becker ,  Dimitrios Kalavrouziotis ,  Boaz Atias ,  Itshak Kalifa ,  Tamir Sharkaz ,  Paraskevas Bakopoulos ,  Elad Mentovich

IPC: H04J14/02 ,  H04B10/2581 ,  H04Q11/00 ,  H04J14/08

Abstract: A system includes a pair of network devices, a universal multi-core fiber (UMCF) interconnect, and a pair of wavelength-division multiplexing (WDM) devices. Each network device includes (i) first optical communication devices configured to communicate first optical signals having a first carrier wavelength and (ii) second optical communication devices configured to communicate second optical signals having a second carrier wavelength. The universal multi-core fiber (UMCF) interconnect includes multiple cores that are configured to convey the first optical signals and the second optical signals between the network devices, using single-mode propagation for the first optical signals and multi-mode propagation for the second optical signals. Each WDM device is connected between a respective network device and the UMCF interconnect and configured to couple the first and second optical communication devices of the respective network device to the cores in accordance with a defined channel assignment.

公开(公告)号：US20210364718A1

公开(公告)日：2021-11-25

申请号：US16928045

申请日：2020-07-14

Applicant: Mellanox Technologies, Ltd.

Inventor： Donald Becker ,  Dimitrios Kalavrouziotis ,  Boaz Atias ,  Itshak Kalifa ,  Tamir Sharkaz ,  Elad Mentovich

IPC: G02B6/43 ,  G02B6/02 ,  G02B6/42 ,  H04B10/2581 ,  H04J14/02

Abstract: A universal multi-core fiber (UMCF) interconnect includes multiple optical fiber cores and a shared cladding. Each of the optical fiber cores is configured to convey first optical communication signals having a first carrier wavelength using multi-mode propagation, and to convey second optical communication signals having a second carrier wavelength using single-mode propagation. The shared cladding encloses the multiple optical fiber cores.

公开(公告)号：US12176945B2

公开(公告)日：2024-12-24

申请号：US17869997

申请日：2022-07-21

Applicant: Mellanox Technologies, Ltd.

Inventor： Paraskevas Bakopoulos ,  Ioannis (Giannis) Patronas ,  Nikolaos Argyris ,  Dimitrios Syrivelis ,  Elad Mentovich ,  Dimitrios Kalavrouziotis ,  Avraham Ganor ,  Nimer Hazin

IPC: H04B10/00 ,  H04B10/038 ,  H04B10/112 ,  H04B10/40

Abstract: A transceiver module for providing operational resilience is presented. The transceiver module is configured to receive first data via a first optical module in a first configuration of operation and detect, using an adapter that is operationally connected to the first optical module, an operational failure of the first optical module. In response to detecting the operational failure, the transceiver module is configured to switch, via the adapter, from the first configuration of operation to a second configuration of operation by: automatically engaging a second optical module; triggering the first data that was initially directed into a first input port of the first optical module to be directed into a second input port of the second optical module; and receiving the first data from a second output port of the second optical module.

公开(公告)号：US12130473B2

公开(公告)日：2024-10-29

申请号：US17421004

申请日：2020-01-02

Applicant: Mellanox Technologies, Ltd.

Inventor： Jonathan Luff ,  Wei Qian ,  Dimitrios Kalavrouziotis ,  Elad Mentovich ,  Dazeng Feng

IPC: G02B6/122 ,  G02B6/12 ,  G02B6/30 ,  G02F1/015

CPC classification number: G02B6/1228 ,  G02B6/30 ,  G02F1/0157 ,  G02B2006/12121 ,  G02B2006/12142 ,  G02B2006/12147

Abstract: An optical interconnect device and the method of fabricating it are described. The device includes an in-plane laser cavity transmitting a light beam along a first direction, a Franz Keldysh (FK) optical modulator transmitting the light beam along the first direction, a mode-transfer module including a tapered structure disposed after the FK optical modulator along the first direction to enlarge the spot size of the light beam to match an external optical fiber and a universal coupler controlling the light direction. The tapered structure can be made linear or non-linear along the first direction. The universal coupler passes the laser light to an in-plane external optical fiber if the fiber is placed along the first direction, or it is a vertical coupler in the case that the external optical fiber is placed perpendicularly to the substrate surface. The coupler is coated with highly reflective material.

公开(公告)号：US12055774B2

公开(公告)日：2024-08-06

申请号：US17453222

申请日：2021-11-02

Applicant: Mellanox Technologies, Ltd.

Inventor： Dimitrios Kalavrouziotis ,  Yuri Berk ,  Vladimir Iakovlev ,  Elad Mentovich ,  Tamir Sharkaz

IPC: G02B6/42 ,  B29D11/00

CPC classification number: G02B6/4239 ,  B29D11/00009 ,  G02B6/4244

Abstract: Various embodiments provide methods for fabricating a couplable electro-optical device. An example method comprises fabricating a pillar on a substrate by forming a lens spacer portion about an electro-optical component fabricated on the substrate; and adhering unshaped lens material to an exposed surface of the pillar. The exposed surface of the pillar is disposed opposite the substrate. The example method further comprises maintaining the unshaped lens material at a reflow temperature for a reflow time to allow the lens material to reflow into a formed lens shape, and curing the lens material to form an integrated lens having the formed lens shape secured to the lens spacer portion and formed about the electro-optical component on the substrate.

公开(公告)号：US20240121158A1

公开(公告)日：2024-04-11

申请号：US17984424

申请日：2022-11-10

Applicant: Mellanox Technologies, Ltd.

Inventor： Paraskevas Bakopoulos ,  Dimitrios Kalavrouziotis ,  Nikolaos Argyris ,  Ioannis (Giannis) Patronas ,  Elad Mentovich ,  Eitan Zahavi ,  Prethvi Ramesh Kashinkunti ,  Louis Bennie Capps, JR. ,  Julie Irene Marcelle Bernauer ,  James Steven Fields, JR.

IPC: H04L41/12 ,  H04L49/45

CPC classification number: H04L41/12 ,  H04L49/45

Abstract: Apparatuses, systems, and methods are provided for scalable networking systems. An example system includes a plurality of core switches and a first stage patch panel associated with operation of a first set of network ports. In an operational configuration in which the first stage patch panel is coupled with the plurality of core switches, the first stage patch panel is configured to operatively couple the first set of network ports and a first portion of the plurality of core switches such that signals may pass therebetween. Furthermore, the first stage patch panel may preclude communication to a remaining portion of the plurality of core switches. The system may include a second stage patch panel associated with a second set of network ports that is operatively coupled with the plurality of core switches in the absence of the first stage patch panel so as to scale the networking system.

公开(公告)号：US11711147B2

公开(公告)日：2023-07-25

申请号：US17326770

申请日：2021-05-21

Applicant: MELLANOX TECHNOLOGIES, LTD.

Inventor： Nikolaos (Nikos) Argyris ,  Yoav Rosenberg ,  Dimitrios Kalavrouziotis ,  Paraskevas Bakopoulos ,  Elad Mentovich

IPC: H04B10/40 ,  H04B10/61 ,  H04B10/112 ,  H04B10/50

CPC classification number: H04B10/40 ,  H04B10/1127 ,  H04B10/503 ,  H04B10/613

Abstract: A transceiver comprises a transmitter including a light source, a modulator coupled to the light source, a driver that drives the modulator according to a set of driving conditions to cause the modulator to output optical signals based on light from the light source, and an output that passes first portions of the optical signals output by the modulator. The transceiver further comprises a first detector that detects second portions of the optical signals output from the modulator, and a receiver including a second detector that detects optical signals from an external transmitter.