公开(公告)号：US20110232348A1

公开(公告)日：2011-09-29

申请号：US13036223

申请日：2011-02-28

申请人： Hisamitu HATOU ,  Noboru Saitou ,  Kouichi Kurosawa ,  Fujio Yoshikubo ,  Yuji Matsui ,  Masashi Fukaya

发明人： Hisamitu HATOU ,  Noboru Saitou ,  Kouichi Kurosawa ,  Fujio Yoshikubo ,  Yuji Matsui ,  Masashi Fukaya

IPC分类号： B24C1/10 ,  G01L1/00 ,  G06F19/00

CPC分类号： B23P9/04 ,  C21D1/54 ,  C21D7/04 ,  C21D7/06

摘要： An evaluation method of residual stress in water jet peening includes a step of creating an analytical model including meshes according to a water jet peening (WJP) object, the shape of a nozzle, and an injection distance, a step of inputting WJP execution conditions, a step of calculating the internal pressure pBi of a cavitation bubble and a bubble number density ngi through jet flow analysis for a jet flow jetting from the nozzle, a step of calculating cavitation energy according to the internal pressure pBi of a cavitation bubble and a bubble number density ngi (S4), a step of calculating the burst energy of cavitation bubbles from the cavitation energy C, and a step of calculating the compressive residual stress of the WJP object from the collapse pressure of cavitation bubbles. Accordingly, the residual stress of the WJP object can be evaluated precisely in a shorter time.

摘要翻译： 水喷射喷丸硬化的残余应力的评价方法包括：创建包括水喷射喷丸（WJP）对象的网孔，喷嘴形状和喷射距离的分析模型的步骤，输入WJP执行条件的步骤， 通过从喷嘴喷射的喷射流的喷射流分析来计算空化气泡的内部压力pBi和气泡数密度ngi的步骤，根据空化气泡和气泡的内部压力pBi计算空化能量的步骤 数值密度ngi（S4），从空化能量C计算空化气泡的爆发能量的步骤，以及从空化气泡的塌陷压力计算WJP物体的压缩残余应力的步骤。 因此，可以在更短的时间内精确地评估WJP物体的残余应力。

公开(公告)号：US07457078B2

公开(公告)日：2008-11-25

申请号：US11223462

申请日：2005-09-09

申请人： Masashi Fukaya ,  Yoshiyuki Hirono ,  Masato Ikegawa ,  Hiroshi Mukai

发明人： Masashi Fukaya ,  Yoshiyuki Hirono ,  Masato Ikegawa ,  Hiroshi Mukai

IPC分类号： G11B33/14

CPC分类号： G11B17/028

摘要： Embodiments of the invention reduce disk fluttering while ensuring good assemblability in a magnetic disk apparatus. A magnetic disk apparatus comprises a recording disk that is an information medium configured by one or plural disks; a motor causing the recording disk to rotate; a carriage supporting a head that records information to, or plays back information from, the recording disk; a casing housing the recording disk; and a shroud disposed surrounding an outer periphery of the recording disk. A groove that extends along the recording disk is formed, vertically asymmetrical with respect to an outer peripheral surface of the recording disk, in the shroud surface at a position where a corner portion formed by the outer peripheral surface and a top surface or bottom surface of the recording disk extends in a radial direction.

摘要翻译： 本发明的实施例在确保磁盘装置中的良好的组装性的同时减少磁盘抖动。 磁盘装置包括作为由一个或多个盘配置的信息介质的记录盘; 使记录盘旋转的马达; 支撑记录盘记录信息或从记录盘重播信息的头部的支架; 容纳记录盘的外壳; 以及围绕记录盘的外周围设置的护罩。 沿着记录盘延伸的槽形成为相对于记录盘的外周表面垂直不对称的槽，在由外周表面形成的角部和顶表面或底表面的位置处的护罩表面中 记录盘沿径向延伸。

公开(公告)号：US5879788A

公开(公告)日：1999-03-09

申请号：US816032

申请日：1997-03-11

申请人： Junzo Fukuta ,  Masashi Fukaya ,  Hideaki Araki

发明人： Junzo Fukuta ,  Masashi Fukaya ,  Hideaki Araki

IPC分类号： H05K1/09 ,  H01B1/00 ,  H01B1/22 ,  H01L23/498 ,  H05K1/03 ,  H05K1/11 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46 ,  B32B7/00

CPC分类号： H01L23/49883 ,  H05K3/4061 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/035 ,  H05K3/245 ,  H05K3/248 ,  H05K3/4611 ,  H05K3/4629 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A low-temperature fired ceramic circuit substrate fired at a temperature ranging between 800.degree. and 1,000.degree. C. includes a plurality of insulating layers each formed of a low-temperature fired ceramic, an Ag conductor layer formed internally of the substrate, an Au conductor layer formed on a surface of the substrate, and an Ag-Pd layer formed between the Ag and the Au conductor layers, the Ag-Pd layer being composed of 100 parts metal composition consisting of 70 to 95 parts Ag and 5 to 30 part Pd by weight, and 2 to 10 parts lead borosilicate glass by weight. As the result of the above composition of the ceramic circuit substrate, its fabrication process can be simplified, and a defect rate in a connection between the Ag and Au layers after repeated firing is rendered approximately zero, which ensures high reliability for the connection.

摘要翻译： 在800〜1000℃的温度范围内烧制的低温烧制陶瓷电路基板包括多个绝缘层，各绝缘层由低温烧制陶瓷，由衬底内部形成的Ag导体层，Au导体 在Ag和Au导体层之间形成的Ag-Pd层，Ag-Pd层由100份由70〜95份Ag和5〜30份Pd组成的金属组合物构成， 和2至10重量份的硼硅酸铅玻璃。 作为陶瓷电路基板的上述组成的结果，可以简化其制造工艺，并且在反复烧制之后Ag和Au层之间的连接中的缺陷率大致为零，这确保了连接的高可靠性。

公开(公告)号：US5456778A

公开(公告)日：1995-10-10

申请号：US109040

申请日：1993-08-17

申请人： Junzo Fukuta ,  Masashi Fukaya ,  Hideaki Araki

发明人： Junzo Fukuta ,  Masashi Fukaya ,  Hideaki Araki

IPC分类号： H01L21/48 ,  H05K1/00

CPC分类号： H01L21/4867 ,  H01L21/486 ,  Y10T29/49155 ,  Y10T29/49158

摘要： A ceramic circuit substrate is fabricated by preparing ceramic greensheets for the fabrication of the ceramic circuit substrate, and unsintered ceramic sheets unsinterable at a sintering temperature of said ceramic greensheets, forming via holes in said ceramic greensheets and filling the via holes with via hole conductor paste, printing conductive patterns on the ceramic greensheets, stacking and laminating the ceramic greensheets to prepare a laminated body, placing said unsintered ceramic sheets on the uppermost layer and-on the lowermost layer of the laminated body, bonding the sheets together by thermocompression to prepare a compressed body, firing the compressed body at the sintering temperature of ceramic greensheets, and removing the unsintered ceramic greensheets, wherein said via hole conductors are only in connection with the conductive patterns at the upper and/or lower ends of each via hole conductor.

摘要翻译： 通过制备用于制造陶瓷电路基板的陶瓷片材和在所述陶瓷片材的烧结温度下不可烧结的未烧结的陶瓷片来制造陶瓷电路基板，在所述陶瓷片材中形成通孔并用通孔导体膏填充通孔 在陶瓷刮板上印刷导电图案，堆叠和层叠陶瓷刮板以制备层压体，将未烧结的陶瓷片放置在层压体的最上层和最下层上，通过热压将片材粘合在一起，以制备 压缩体，在陶瓷刮板的烧结温度下烧制压缩体，除去未烧结的陶瓷刮板，其中所述通孔导体仅与每个通孔导体的上端和/或下端处的导电图案相连。

公开(公告)号：US4748085A

公开(公告)日：1988-05-31

申请号：US931697

申请日：1986-11-14

申请人： Junzo Fukuda ,  Masashi Fukaya ,  Hiroshi Kawabe ,  Susumu Nishigaki

发明人： Junzo Fukuda ,  Masashi Fukaya ,  Hiroshi Kawabe ,  Susumu Nishigaki

IPC分类号： C04B35/111 ,  H01L21/48 ,  H01L23/15 ,  H05K1/00 ,  H05K1/03 ,  B32B15/00 ,  C03C8/14 ,  C03C8/24

CPC分类号： H01L21/481 ,  C04B35/111 ,  H01L23/15 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/4629 ,  H05K3/4676 ,  Y10S428/901

摘要： In a multilayer ceramic circuit board comprising a substrate, an insulating layer on the substrate, and a conductive pattern on the insulating layer, an additive of Cr.sub.2 O.sub.3 or MnO.sub.2 is added to the insulating layer to reinforce adhesion between the insulating layer and the conductive pattern. Each of the substrate and the insulating layer is manufactured by firing at a temperature between 800.degree. C. and 1000.degree. C., alumina particles and a glass composition comprising an alumina component. When a total amount of alumina in the substrate is equal to or greater than that in the insulating layer, an amount of Cr.sub.2 O.sub.3 or MnO.sub.2 is restricted to a range between 0.1% and 10.0% by weight, with a difference between the total amounts of alumina falling within a range between 0% and 30% by weight. When the total amount of alumina in the substrate is smaller than that in the insulating layer, the amounts of Cr.sub.2 O.sub.3 and MnO.sub.2 may be between 0.1% and 10.0% by weight and between 0.1% and 15% by weight, respectively. The difference between the total amounts of alumina may be between 0% and 20% by weight.

摘要翻译： 在包括基板，基板上的绝缘层和绝缘层上的导电图案的多层陶瓷电路板中，将Cr 2 O 3或MnO 2的添加剂添加到绝缘层中以增强绝缘层和导电图案之间的粘附性。 基板和绝缘层中的每一个通过在800℃至1000℃的温度下煅烧，氧化铝颗粒和包含氧化铝组分的玻璃组合物来制造。 当基材中的氧化铝总量等于或大于绝缘层中的氧化铝的总量时，Cr 2 O 3或MnO 2的量被限制在0.1重量％至10.0重量％的范围内，氧化铝的总量之间的差异 在0％至30％之间的范围内。 当基板中的氧化铝的总量小于绝缘层中的氧化铝的总量时，Cr 2 O 3和MnO 2的量可以分别在0.1重量％至10.0重量％和0.1重量％至15重量％之间。 氧化铝的总量之间的差可以在0重量％至20重量％之间。

公开(公告)号：US06558117B1

公开(公告)日：2003-05-06

申请号：US09623199

申请日：2001-12-27

申请人： Masashi Fukaya ,  Yasunori Murakami ,  Tetsuo Udagawa ,  Tsutomu Okazaki

发明人： Masashi Fukaya ,  Yasunori Murakami ,  Tetsuo Udagawa ,  Tsutomu Okazaki

IPC分类号： F01B2502

CPC分类号： F01D17/165 ,  F02B37/24 ,  Y02T10/144

摘要： A variable geometry turbocharger in which a bill-like projection portion is arranged in a part of an outer periphery of a flow passage spacer, and the projection portion is protruded to a turbine rotor side at a predetermined angle or the projection portion is movably provided. Alternatively, a rod-like member is arranged in a part of an outer periphery of a flow passage spacer and the rod-like member is arranged so as to be adjacent to the turbine rotor side at a predetermined angle. Alternatively, a guide vane in which a leading edge side of a rotational shaft is eliminated is arranged in a part of an outer periphery of a flow passage spacer and the rotational shaft is arranged so as to be adjacent to the turbine rotor side at a predetermined angle. Further, a heat resisting cast steel having a little amount of carbon is employed as a material for a casing and a guide vane table sectioning the turbine chamber, and without using the flow passage spacer and in place of the flow passage spacer, both side walls sectioning the turbine chamber themselves keep a gap with respect to the guide vane minimum. Accordingly, a high turbine efficiency can be obtained by preventing a gas stream from being separated at the back of a flow passage spacer and inside a guide vane, since a hydraulic energy loss is reduced and a uniform and high average flow speed distribution is realized at a position of an inlet of a turbine rotor.

摘要翻译： 一种可变几何形状的涡轮增压器，其中，在流路隔板的外周的一部分中布置有纸币状突起部，突出部以预定的角度突出到涡轮转子侧，或者突起部可移动地设置。 或者，杆状构件设置在流路隔离件的外周的一部分中，并且杆状构件布置成以预定角度与涡轮机转子侧相邻。 或者，在流路隔板的外周的一部分配置有排除旋转轴的前端侧的导向叶片，并且旋转轴配置成与涡轮机转子侧相邻地预定 角度。 此外，使用具有少量碳的耐热铸钢作为用于壳体的材料和对涡轮室进行切片的导向叶片台，并且不使用流动通道间隔件并且代替流动通道间隔件，两个侧壁 涡轮机室自身的分段保持相对于导向叶片最小的间隙。 因此，通过防止气流在流路隔板的后部和导向叶片内分离，可以获得高的涡轮效率，因为液压能量损失降低，并且在 涡轮转子的入口的位置。

公开(公告)号：US5665459A

公开(公告)日：1997-09-09

申请号：US606798

申请日：1996-02-26

申请人： Junzo Fukuta ,  Masashi Fukaya ,  Hideaki Araki

发明人： Junzo Fukuta ,  Masashi Fukaya ,  Hideaki Araki

IPC分类号： H05K1/09 ,  H01B1/00 ,  H01B1/22 ,  H01L23/498 ,  H05K1/03 ,  H05K1/11 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46 ,  B32B9/00

CPC分类号： H01L23/49883 ,  H05K3/4061 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/035 ,  H05K3/245 ,  H05K3/248 ,  H05K3/4611 ,  H05K3/4629 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A low-temperature fired ceramic circuit substrate fired at a temperature ranging between 800.degree. and 1,000.degree. C. includes a plurality of insulating layers each formed of a low-temperature fired ceramic, an Ag conductor layer formed internally of the substrate, an Au conductor layer formed on a surface of the substrate, and an Ag--Pd layer formed between the Ag and the Au conductor layers, the Ag--Pd layer being composed of 100 parts metal composition consisting of 70 to 95 parts Ag and 5 to 30 part Pd by weight, and 2 to 10 parts lead borosilicate glass by weight. As the result of the above composition of the ceramic circuit substrate, its fabrication process can be simplified, and a defect rate in a connection between the Ag and Au layers after repeated firing is rendered approximately zero, which ensures high reliability for the connection.

摘要翻译： 在800〜1000℃的温度范围内烧制的低温烧制陶瓷电路基板包括多个绝缘层，各绝缘层由低温烧制陶瓷，由衬底内部形成的Ag导体层，Au导体 在Ag和Au导体层之间形成的Ag-Pd层，Ag-Pd层由100份由70〜95份Ag和5〜30份Pd组成的金属组合物构成， 和2至10重量份的硼硅酸铅玻璃。 作为陶瓷电路基板的上述组成的结果，可以简化其制造工艺，并且在重复点火之后Ag和Au层之间的连接中的缺陷率大致为零，这确保了连接的高可靠性。

公开(公告)号：US5470412A

公开(公告)日：1995-11-28

申请号：US97120

申请日：1993-07-27

申请人： Junzo Fukuta ,  Masashi Fukaya ,  Hideaki Araki

发明人： Junzo Fukuta ,  Masashi Fukaya ,  Hideaki Araki

IPC分类号： H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/20 ,  H05K3/46 ,  B32B31/04 ,  B32B31/20 ,  B32B31/26 ,  C04B33/32

CPC分类号： H05K3/207 ,  H01L21/4857 ,  H05K1/0306 ,  H05K1/092 ,  H05K2203/016 ,  H05K3/4611 ,  H05K3/4629

摘要： A process for producing circuit substrate is prepared by preparing at least one ceramic greensheet containing glass and sinterable at a low temperature for forming the circuit substrate, and at least one unsintered transfer sheet unsinterable at a sintering temperature of the ceramic greensheet, printing a wiring pattern on the unsintered transfer sheet, stacking the unsintered transfer sheet on the ceramic greensheet to form a laminated body and thermocompressing the laminated body to form a compressed body, firing the compressed body at a sintering temperature of the ceramic greensheet to form a ceramic substrate, thereby preparing a fired body by transferring the wiring pattern on the unsintered transfer sheet to the ceramic substrate, and removing the unsintered transfer sheet from the fired body to prepare a circuit substrate.

摘要翻译： 制备电路基板的方法是通过制备至少一种含有玻璃的陶瓷毛坯，并在低温下烧结以形成电路基板，以及至少一种未烧结的转印片，其在陶瓷毛坯的烧结温度下不能反应，印刷布线图案 在未烧结的转印片上，将未烧结的转印片层叠在陶瓷毛坯上，形成层叠体，热压层叠体，形成压缩体，在陶瓷毛坯的烧结温度下烧成压缩体，形成陶瓷基板 通过将未烧结的转印片上的布线图案转印到陶瓷基片上，从烧结体除去未烧结的转印片，制备电路基板。