METHODS OF SELECTIVELY DEPOSITING SILICON-CONTAINING FILMS
    12.
    发明申请
    METHODS OF SELECTIVELY DEPOSITING SILICON-CONTAINING FILMS 有权
    选择性沉积含硅膜的方法

    公开(公告)号:US20090117717A1

    公开(公告)日:2009-05-07

    申请号:US11935174

    申请日:2007-11-05

    IPC分类号: H01L21/36 H01L21/306

    摘要: An embodiment provides a method for selectively depositing a single crystalline film. The method includes providing a substrate, which includes a first surface having a first surface morphology and a second surface having a second surface morphology different from the first surface morphology. A silicon precursor and BCl3 are intermixed to thereby form a feed gas. The feed gas is introduced to the substrate under chemical vapor deposition conditions. A Si-containing layer is selectively deposited onto the first surface without depositing on the second surface by introducing the feed gas.

    摘要翻译: 一个实施方案提供了选择性沉积单晶膜的方法。 该方法包括提供基底,其包括具有第一表面形态的第一表面和具有不同于第一表面形态的第二表面形态的第二表面。 将硅前体和BCl 3混合,从而形成进料气体。 在化学气相沉积条件下将进料气体引入基板。 通过引入进料气体,在第一表面上选择性地沉积含Si层而不沉积在第二表面上。

    Semiconductor buffer structures
    13.
    发明申请
    Semiconductor buffer structures 有权
    半导体缓冲结构

    公开(公告)号:US20070264801A1

    公开(公告)日:2007-11-15

    申请号:US11431336

    申请日:2006-05-09

    IPC分类号: H01L21/20

    摘要: Pile ups of threading dislocations in thick graded buffer layer are reduced by enhancing dislocation gliding. During formation of a graded SiGe buffer layer, deposition of SiGe from a silicon precursor and a germanium precursor is interrupted one or more times with periods in which the flow of the silicon precursor to the substrate is stopped while the flow of the germanium precursor to the substrate is maintained.

    摘要翻译: 通过增强位错滑行,减少厚度梯度缓冲层穿透位错的堆积。 在形成渐变的SiGe缓冲层期间,SiGe从硅前体和锗前体的沉积被中断一次或多次,其中停止向硅衬底的硅前体的流动,同时锗前体流向 保持底物。

    Methods of selectively depositing silicon-containing films
    14.
    发明授权
    Methods of selectively depositing silicon-containing films 有权
    选择性沉积含硅膜的方法

    公开(公告)号:US07772097B2

    公开(公告)日:2010-08-10

    申请号:US11935174

    申请日:2007-11-05

    IPC分类号: H01L21/00

    摘要: An embodiment provides a method for selectively depositing a single crystalline film. The method includes providing a substrate, which includes a first surface having a first surface morphology and a second surface having a second surface morphology different from the first surface morphology. A silicon precursor and BCl3 are intermixed to thereby form a feed gas. The feed gas is introduced to the substrate under chemical vapor deposition conditions. A Si-containing layer is selectively deposited onto the first surface without depositing on the second surface by introducing the feed gas.

    摘要翻译: 一个实施方案提供了选择性沉积单晶膜的方法。 该方法包括提供基底,其包括具有第一表面形态的第一表面和具有不同于第一表面形态的第二表面形态的第二表面。 将硅前体和BCl 3混合,从而形成进料气体。 在化学气相沉积条件下将进料气体引入基板。 通过引入进料气体,在第一表面上选择性地沉积含Si层而不沉积在第二表面上。