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    Apparatuses and methods for dynamic frame rate adjustment
    11.
    发明授权
    Apparatuses and methods for dynamic frame rate adjustment 有权

    公开(公告)号：US10425615B2

    公开(公告)日：2019-09-24

    申请号：US15806718

    申请日：2017-11-08

    Applicant: MEDIATEK INC.

    Inventor： Wei-Ting Wang ,  Han-Lin Li ,  Yu-Jen Chen ,  Yu-Ming Lin

    IPC: H04N7/01 ,  G09G5/00

    Abstract: An image processing apparatus including first circuitry, second circuitry, third circuitry, and fourth circuitry is provided. The first circuitry determines a frame miss rate according to a current frame rate and a target frame rate of an image signal. The second circuitry decreases the target frame rate to the current frame rate when the frame miss rate is greater than a first threshold. The third circuitry increases the target frame rate to an upper-limit frame rate which is determined according to the frame rendering time or memory bandwidth capability, when the frame miss rate is less than a second threshold which is smaller than the first threshold. The fourth circuitry applies the decreased or increased target frame rate for an image to be displayed.

    METHOD FOR CONTROLLING CIRCUIT MODULES WITHIN CHIP AND ASSOCIATED SYSTEM ON CHIP
    15.
    发明申请
    METHOD FOR CONTROLLING CIRCUIT MODULES WITHIN CHIP AND ASSOCIATED SYSTEM ON CHIP 有权
    用于控制芯片中的电路模块的方法和芯片上的相关系统

    公开(公告)号：US20160291665A1

    公开(公告)日：2016-10-06

    申请号：US14863426

    申请日：2015-09-23

    Applicant: MEDIATEK INC.

    Inventor： Wei-Ting Wang ,  Chia-Feng Yeh

    IPC: G06F1/28 ,  G05D23/19

    CPC classification number: G05D23/1917 ,  G06F1/206 ,  G06F1/3209 ,  G06F1/3215 ,  G06F1/325 ,  G06F1/329 ,  Y02D10/24

    Abstract: A method for controlling circuit modules within a chip is provided, wherein the circuit modules includes at least one processor and at least one network module, and the method includes: obtaining a plurality of temperature-related information of the circuit modules; and allocating power limits or throughput limits of the circuit modules according to the temperature-related information of the circuit modules, respectively.

    Abstract translation: 提供了一种用于控制芯片内的电路模块的方法，其中电路模块包括至少一个处理器和至少一个网络模块，该方法包括：获得电路模块的多个温度相关信息; 以及分别根据电路模块的温度相关信息分配电路模块的功率限制或吞吐量极限。

    THERMAL PROTECTION METHOD FOR REFERRING TO THERMAL HEADROOM TO CONTROL SELECTION OF COMPUTING POWER SETTING OF PROCESSOR-BASED SYSTEM AND RELATED MACHINE READABLE MEDIUM
    16.
    发明申请
    THERMAL PROTECTION METHOD FOR REFERRING TO THERMAL HEADROOM TO CONTROL SELECTION OF COMPUTING POWER SETTING OF PROCESSOR-BASED SYSTEM AND RELATED MACHINE READABLE MEDIUM 审中-公开
    用于引导热源的热保护方法以控制基于处理器的系统的计算功率选择和相关机器可读介质的选择

    公开(公告)号：US20160034009A1

    公开(公告)日：2016-02-04

    申请号：US14700111

    申请日：2015-04-29

    Applicant: Mediatek Inc.

    Inventor： Wei-Ting Wang ,  Chien-Tse Fang ,  Chia-Feng Yeh

    IPC: G06F1/20

    CPC classification number: G06F1/206

    Abstract: A thermal protection method includes: determining a thermal headroom based on a difference between a current temperature and a predetermined threshold temperature; determining a power budget based on the thermal headroom; and utilizing a processor-based system to employ a target computing power setting according to at least the power budget, wherein selection of the target computing power setting is constrained by the power budget to ensure that the target computing power setting does not make the current temperature exceed the predetermined threshold temperature when employed by the processor-based system.

    Abstract translation: 热保护方法包括：基于当前温度和预定阈值温度之间的差来确定热余量; 基于热余量确定功率预算; 并且利用基于处理器的系统来根据至少功率预算来采用目标计算能力设置，其中目标计算能力设置的选择受功率预算约束，以确保目标计算功率设置不使当前温度 在基于处理器的系统使用时超过预定阈值温度。

    THERMAL CONTROL METHOD AND THERMAL CONTROL SYSTEM
    17.
    发明申请
    THERMAL CONTROL METHOD AND THERMAL CONTROL SYSTEM 有权
    热控制方法和热控制系统

    公开(公告)号：US20150350407A1

    公开(公告)日：2015-12-03

    申请号：US14670418

    申请日：2015-03-27

    Applicant: Mediatek Inc.

    Inventor： Jih-Ming Hsu ,  Wei-Ting Wang ,  Wen-Tsan Hsieh ,  Tai-Yu Chen ,  Chia-Feng Yeh ,  Chien-Tse Fang

    IPC: H04M1/725

    CPC classification number: H04M1/72569 ,  G06F1/206 ,  H04M1/72525 ,  H04M1/72577

    Abstract: The invention provides a thermal control method and a thermal control system. The thermal control method comprises: detecting a temperature variance of a component of the electronic device to generate a detecting result; and determining a temperature threshold value for the integrated circuit as a throttling point according to the detecting result. The thermal control system comprises: a detecting unit, for detecting a temperature variance of a component of the electronic device to generate a detecting result; and a determining unit, for determining a temperature threshold value for the integrated circuit as a throttling point according to the detecting result.

    Abstract translation: 本发明提供一种热控制方法和热控制系统。 热控制方法包括：检测电子设备的部件的温度变化以产生检测结果; 以及根据检测结果确定集成电路的温度阈值作为节流点。 热控制系统包括：检测单元，用于检测电子设备的部件的温度变化以产生检测结果; 以及确定单元，用于根据检测结果将集成电路的温度阈值确定为节流点。

    WEIGHT SKIPPING DEEP LEARNING ACCELERATOR
    18.
    发明申请
    WEIGHT SKIPPING DEEP LEARNING ACCELERATOR 审中-公开

    公开(公告)号：US20190303757A1

    公开(公告)日：2019-10-03

    申请号：US16221295

    申请日：2018-12-14

    Applicant: MediaTek Inc.

    Inventor： Wei-Ting Wang ,  Han-Lin Li ,  Chih Chung Cheng ,  Shao-Yu Wang

    IPC: G06N3/08 ,  G06F9/50 ,  G06N3/063 ,  G06F9/38

    Abstract: A deep learning accelerator (DLA) includes processing elements (PEs) grouped into PE groups to perform convolutional neural network (CNN) computations, by applying multi-dimensional weights on an input activation to produce an output activation. The DLA also includes a dispatcher which dispatches input data in the input activation and non-zero weights in the multi-dimensional weights to the processing elements according to a control mask. The DLA also includes a buffer memory which stores the control mask which specifies positions of zero weights in the multi-dimensional weights. The PE groups generate output data of respective output channels in the output activation, and share a same control mask specifying same positions of the zero weights.

    Chip aware thermal policy
    20.
    发明授权
    Chip aware thermal policy 有权

    公开(公告)号：US09900424B2

    公开(公告)日：2018-02-20

    申请号：US15097429

    申请日：2016-04-13

    Applicant: MEDIATEK INC.

    Inventor： Wei-Ting Wang ,  Han-Lin Li ,  Hong-Jie Huang

    IPC: G08B17/00 ,  H04M1/725

    CPC classification number: H04M1/72569 ,  G06F1/206 ,  G06F1/3203 ,  G06F1/324 ,  G06F1/3296

    Abstract: Methods and apparatus are provided for chip aware thermal policies. The thermal performance mapping information is generated. The process obtains a set of process-dependent power data for each process corner of a semiconductor chip, profiles performance data, and selects an operating thermal policy based on the performance data. The thermal policy, based on the process-dependent power data is a mapping formula, or a combination of a mapping formula and a mapping table. The chip aware thermal control is based on process-dependent power data of process corners. The mapping information of process-dependent power data to a corresponding thermal policy is stored in a memory. A thermal policy is applied based on the stored mapping information and an obtained process corner information. The mapping information is applied every time the thermal policy is needed or at boot-up time.

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