公开(公告)号：US07637311B2

公开(公告)日：2009-12-29

申请号：US11769664

申请日：2007-06-27

申请人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

发明人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0275 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device for at least two heat-generating electronic components, includes a base for contacting with the heat-generating electronic components, a first fin set arranged on one part of the base, a second fin set arranged on another part of the base and at least a heat pipe sandwiched between the base and the first and second fin sets. The first fin set includes a plurality of fins defining a plurality of air passages therebetween. The second fin set includes a plurality of fins. Every two neighboring fins define therebetween an air passage communicating with a corresponding air passage of the first fin set. A channel which is parallel to and has a width larger than that of the air passages of the first and second fin sets is defined in a middle of the second fin set.

摘要翻译： 一种用于至少两个发热电子部件的散热装置，包括用于与发热电子部件接触的基座，布置在基座的一部分上的第一翅片组，布置在基座的另一部分上的第二翅片组 以及至少夹在基座与第一和第二翅片组之间的热管。 第一翅片组包括在其间限定多个空气通道的多个翅片。 第二翅片组包括多个翅片。 每两个相邻的翅片在其间限定有与第一翅片组的相应空气通道连通的空气通道。 与第一和第二翅片组的空气通道平行并具有宽度的通道限定在第二翅片组的中间。

公开(公告)号：US20090314465A1

公开(公告)日：2009-12-24

申请号：US12202404

申请日：2008-09-01

申请人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

发明人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： F28F13/00

CPC分类号： H01L23/38 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a base, a fin group mounted on a top of the base, a fan mounted on a top of the fin group, a hollow fan duct mounted on the fan and a thermoelectric cooler secured on the fan duct. The thermoelectric cooler includes a cooling module having the Peltier effect and extending through a sidewall of the fan duct, and a heat sink enclosed by the fan duct and thermally contacting with the cooling module. The cooling module has a cold surface located at an inner side of the fan duct, and the heat sink thermally contacts with the cold surface of the cooling module. An airflow generated by the fan first flows through the heat sink and then reaches the fin group via the fan.

摘要翻译： 散热装置包括基座，安装在基座顶部的翅片组，安装在翼片组顶部的风扇，安装在风扇上的中空风扇导管和固定在风扇导管上的热电冷却器。 热电冷却器包括具有珀尔帖效应并延伸通过风扇管道的侧壁的冷却模块和由风扇管道封闭并与冷却模块热接触的散热器。 冷却模块具有位于风扇管道内侧的冷表面，并且散热器与冷却模块的冷表面热接触。 风扇产生的气流首先流过散热器，然后通过风扇到达散热片组。

公开(公告)号：US07631850B2

公开(公告)日：2009-12-15

申请号：US11135745

申请日：2005-05-24

申请人： Hsieh-Kun Lee ,  Chun-Chi Chen ,  Shi-Wen Zhou ,  Ping-An Yang ,  Meng Fu

发明人： Hsieh-Kun Lee ,  Chun-Chi Chen ,  Shi-Wen Zhou ,  Ping-An Yang ,  Meng Fu

IPC分类号： H05K7/20

CPC分类号： H05K7/20172

摘要： An apparatus (1) for supporting a cooling device (30) thereon includes a bracket (10) and a saddle (20) carrying the cooling device (30) thereon. The bracket (10) defines two opposing rails (12), (13) and a washboard-like member (14) extending along a direction in which the rails (12), (13) extend. The saddle (20) includes a positioning member (26) engaged in the washboard-like member (14) to position the saddle (20) to the bracket (10) and two blocks (24) slidable on the rails (12), (13) of the bracket (10) under condition that the positioning member (26) is disengaged from the washboard-like member (14).

摘要翻译： 一种用于在其上支撑冷却装置（30）的装置（1）包括托架（10）和在其上承载冷却装置（30）的鞍座（20）。 支架（10）限定了两个相对的轨道（12），（13）和沿轨道（12），（13）延伸的方向延伸的洗衣板状构件（14）。 所述鞍座（20）包括定位构件（26），所述定位构件（26）接合在所述盥洗板状构件（14）中，以将所述鞍座（20）定位到所述支架（10）以及可在所述轨道（12）上滑动的两个块（24）， 在定位构件（26）与盥洗板状构件（14）分离的条件下，支架（10）的底面（13）是13。

公开(公告)号：US20090303718A1

公开(公告)日：2009-12-10

申请号：US12134163

申请日：2008-06-05

申请人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

发明人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： F21V21/14

CPC分类号： F21V14/02 ,  F21K9/00 ,  F21K9/65 ,  F21V14/04 ,  F21V29/505 ,  F21V29/74 ,  F21V29/77 ,  F21V29/83 ,  F21Y2107/10 ,  F21Y2115/10 ,  Y10S362/80

摘要： An LED lamp includes a lamp cover consisting of a plurality of sector-shaped connecting bodies, a plurality of fins attached to the lamp cover and a plurality of LED modules attached to the lamp cover and opposing the fins. A locking device is pivotably mounted to the lamp cover and comprises a supporting pole extending in the lamp cover, a plurality of branches pivotably mounted to the lamp cover and the supporting pole. The branches are movable along the supporting pole to be locked at a desired position, whereby an illumination angle of the LED modules of the lamp cover relative to the supporting pole is changeable via movement of the branches along the supporting pole of the locking device. Thus, an illumination area and an illumination intensity of the LED lamp are adjustable.

摘要翻译： LED灯包括由多个扇形连接体组成的灯罩，附接到灯罩的多个灯片和附接到灯罩并与散热片相对的多个LED组件。 锁定装置可枢转地安装到灯罩，并且包括在灯罩中延伸的支撑杆，可枢转地安装到灯罩和支撑杆的多个分支。 分支可沿着支撑杆移动以被锁定在期望的位置，由此灯罩的LED模块相对于支撑杆的照明角度可以通过分支沿着锁定装置的支撑杆的移动而改变。 因此，LED灯的照明区域和照明强度是可调节的。

公开(公告)号：US20090244849A1

公开(公告)日：2009-10-01

申请号：US12248004

申请日：2008-10-08

申请人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

发明人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device attached to a top surface of an electronic device mounted on a printed circuit board, includes a heat sink and a retainer securing the heat sink onto the electronic device. The retainer includes a frame, a plurality of baffle walls and protrusion posts extending downwardly from the frame. Lower ends of the baffle walls of the retainer extend downwardly through the heat sink and engage with engaging edges of the electronic device. The heat dissipation device is further provided with a plurality of elastic members which respectively surround the protrusion posts of the retainer and are compressed between the retainer and the heat sink, thereby pushing the heat sink downwardly toward the electronic device.

摘要翻译： 安装在安装在印刷电路板上的电子装置的顶表面上的散热装置包括散热器和将散热器固定在电子装置上的保持架。 保持器包括框架，多个挡板壁和从框架向下延伸的突出柱。 保持器的挡板壁的下端向下延伸穿过散热器并与电子设备的接合边缘接合。 散热装置还设置有分别围绕保持器的突出支柱的多个弹性构件，并且在保持器和散热器之间被压缩，从而将散热器向下推向电子装置。

公开(公告)号：US07296617B2

公开(公告)日：2007-11-20

申请号：US11221285

申请日：2005-09-07

申请人： Hsieh-Kun Lee ,  Chun-Chi Chen ,  Shi-Wen Zhou ,  Meng Fu

发明人： Hsieh-Kun Lee ,  Chun-Chi Chen ,  Shi-Wen Zhou ,  Meng Fu

IPC分类号： F28D15/04

CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink for dissipating heat of an electronic device comprises a base, a first fin group comprising a plurality of fins stacked together, a second fin group comprising a plurality of fins and overlapping the first fin group, and a sinuous heat pipe attached to the base. The first and second fin groups are respectively engaged with the heat pipe twice at different locations of the first and second fin groups.

摘要翻译： 一种用于散热电子装置的散热器包括：基座，包括堆叠在一起的多个翅片的第一翅片组，包括多个翅片并与第一翅片组重叠的第二翅片组，以及连接到第一翅片组的弯曲热管 基础。 第一和第二翅片组分别在第一和第二翅片组的不同位置与热管接合两次。

公开(公告)号：US20060104036A1

公开(公告)日：2006-05-18

申请号：US11135593

申请日：2005-05-23

申请人： Chun-Chi Chen ,  Shi-Wen Zhuo ,  Meng Fu ,  Chi Liang

发明人： Chun-Chi Chen ,  Shi-Wen Zhuo ,  Meng Fu ,  Chi Liang

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipating device includes a heat sink (60), a radiator (70) and heat-transfer pipes (80). The heat sink includes a chassis (62), a plate (64) separate from the chassis and a plurality of fins (66) extending between the chassis and the plate. The radiator includes a base (72) parallel to the fins. Each heat-transfer pipe includes a heat-absorbing portion (82) thermally positioned to the chassis, a heat-releasing portion (84) thermally positioned to the plate and a heat-transfer portion (86) disposed between the heat-absorbing portion and the heat-releasing portion. The heat-transfer portion is thermally received in the base of the radiator.

摘要翻译： 散热装置包括散热器（60），散热器（70）和传热管（80）。 散热器包括底盘（62），与底盘分离的板（64）和在底盘和板之间延伸的多个翅片（66）。 散热器包括平行于翅片的基座（72）。 每个传热管包括热定位到底盘的热吸收部分（82），热定位于板的散热部分（84）和设置在吸热部分和 散热部。 热传递部分被热接收在散热器的基座中。

公开(公告)号：US06942020B2

公开(公告)日：2005-09-13

申请号：US10890049

申请日：2004-07-12

申请人： Chun-Chi Chen ,  Meng Fu

发明人： Chun-Chi Chen ,  Meng Fu

IPC分类号： H01L23/427 ,  F28D15/00

CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a plurality of fins (40), a post (20) and a plurality of heat pipes (30). Each fin defines an opening (42) and a plurality of punctures (44) spaced from the opening. The post is received in the openings of the fins. The heat pipes are engaged at opposite portions thereof with the post and the punctures of the fins.

摘要翻译： 散热装置包括多个翅片（40），柱（20）和多个热管（30）。 每个翅片限定开口（42）和与开口间隔开的多个穿孔（44）。 该柱被容纳在翅片的开口中。 热管在其与柱的相对部分处接合并且翅片的穿刺。

公开(公告)号：US09138840B2

公开(公告)日：2015-09-22

申请号：US13650499

申请日：2012-10-12

申请人： Qiao-Long Chen ,  Meng Fu ,  Zi-Fu Yang ,  Chun-Chi Chen

发明人： Qiao-Long Chen ,  Meng Fu ,  Zi-Fu Yang ,  Chun-Chi Chen

IPC分类号： B23P15/26 ,  B23P11/00 ,  H01L23/367 ,  H01L21/48 ,  F28F3/04 ,  F28F3/06

CPC分类号： B23P15/26 ,  B23P11/00 ,  B23P2700/10 ,  F28F3/048 ,  F28F3/06 ,  F28F2275/122 ,  H01L21/4878 ,  H01L23/3672 ,  H01L2924/0002 ,  Y10T29/49908 ,  H01L2924/00

摘要： An exemplary method for manufacturing a heat sink includes steps: providing a base with a plurality of spaced protrusions formed thereon; providing a plurality of fins and bending a distal end of each fin to form a connecting end; fitting each fin between two adjacent protrusions correspondingly and attaching the connecting end of each fin to the base; and deforming each protrusion to press the connecting ends of two adjacent fins.

摘要翻译： 用于制造散热器的示例性方法包括以下步骤：提供具有在其上形成的多个间隔开的突起的基部; 提供多个翅片并弯曲每个翅片的远端以形成连接端; 将两个相邻突起之间的每个翅片相应地安装，并将每个翅片的连接端连接到基座; 并且使每个突起变形以按压两个相邻翅片的连接端。

公开(公告)号：US08199508B2

公开(公告)日：2012-06-12

申请号：US12503021

申请日：2009-07-14

申请人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

发明人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20 ,  H05K5/00 ,  H01L23/10 ,  F28F7/00

CPC分类号： H01L23/427 ,  F28D15/0275 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device dissipates heat generated by a heat-generating electronic element mounted on a top surface printed circuit board. The printed circuit board defines a plurality of first through holes. The heat dissipation device comprises a heat spreader located at a top side of the printed circuit board. The heat spreader defines a plurality of second through holes corresponding to the first through holes, respectively. A first heat sink is located over the heat spreader, and a plurality of second heat sinks is located at a bottom side of the printed circuit board. A plurality of heat pipes extending through the second through holes of the heat spreader and the first through holes of the printed circuit board to thermally connect the first and second heat sinks to the heat spreader.

摘要翻译： 散热装置散发由安装在顶面印刷电路板上的发热电子元件产生的热量。 印刷电路板限定多个第一通孔。 散热装置包括位于印刷电路板顶侧的散热器。 散热器分别限定与第一通孔相对应的多个第二通孔。 第一散热器位于散热器上方，并且多个第二散热器位于印刷电路板的底侧。 多个热管延伸穿过散热器的第二通孔和印刷电路板的第一通孔，以将第一和第二散热器热连接到散热器。