公开(公告)号：US20180044244A1

公开(公告)日：2018-02-15

申请号：US15790267

申请日：2017-10-23

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yasutaka Sugimoto ,  Kazuhiro Kaneko

IPC: C04B35/195 ,  C04B35/64 ,  C04B35/63 ,  H05K3/46 ,  H03H7/01 ,  H05K1/09 ,  H05K1/03 ,  H01B3/12 ,  C04B35/16 ,  H05K1/11

CPC classification number: C04B35/195 ,  B32B18/00 ,  C03C3/064 ,  C03C3/089 ,  C03C14/004 ,  C04B35/14 ,  C04B35/16 ,  C04B35/6303 ,  C04B35/64 ,  C04B2235/3206 ,  C04B2235/3215 ,  C04B2235/3232 ,  C04B2235/3244 ,  C04B2235/3262 ,  C04B2235/3418 ,  C04B2235/3436 ,  C04B2235/3481 ,  C04B2235/36 ,  C04B2235/365 ,  C04B2235/6584 ,  C04B2235/80 ,  C04B2235/96 ,  C04B2237/341 ,  C04B2237/68 ,  H01B3/12 ,  H03H7/0115 ,  H03H7/0138 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/113 ,  H05K3/4605 ,  H05K3/4664

Abstract: A mixed powder for a low temperature cofired ceramic material that contains 65 to 80 parts by weight of SiO2, 5 to 25 parts by weight of BaO, 1 to 10 parts by weight of Al2O3, 0.1 to 5 parts by weight of MnO, 0.1 to 5 parts by weight of B2O3, and 0.1 to less than 3 parts by weight of Li2O. The ceramic sintered body is used for, for example, ceramic electronic components, e.g., a multilayer circuit board or a coupler.

公开(公告)号：US20140347782A1

公开(公告)日：2014-11-27

申请号：US14452595

申请日：2014-08-06

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Seiji Fujita ,  Hiroshige Adachi ,  Kazuhiro Kaneko ,  Satoru Adachi ,  Sadaaki Sakamoto

IPC: H01G4/12 ,  H01G4/10 ,  H01G4/30

CPC classification number: H01G4/129 ,  B32B18/00 ,  C03C3/064 ,  C03C12/00 ,  C03C14/004 ,  C04B35/20 ,  C04B35/443 ,  C04B35/462 ,  C04B2235/3206 ,  C04B2235/3215 ,  C04B2235/3222 ,  C04B2235/3224 ,  C04B2235/3232 ,  C04B2235/3262 ,  C04B2235/3281 ,  C04B2235/3445 ,  C04B2235/3481 ,  C04B2235/36 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/346 ,  C04B2237/62 ,  H01G4/105 ,  H01G4/12 ,  H01G4/1209 ,  H01G4/1218 ,  H01G4/30 ,  H01G4/40 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/1531 ,  H01L2924/19041 ,  H01L2924/19105

Abstract: A composite laminated ceramic electronic component that includes co-fired low dielectric-constant ceramic layers and high dielectric-constant ceramic layers. The low dielectric-constant ceramic layers and high dielectric-constant ceramic layers are each composed of a glass ceramic containing: a first ceramic composed of MgAl2O4 and/or Mg2SiO4; a second ceramic composed of BaO, RE2O3 (RE is a rare-earth element), and TiO2; glass containing each of 44.0 to 69.0 weight % of RO (R is an alkaline-earth metal), 14.2 to 30.0 weight % of SiO2, 10.0 to 20.0 weight % of B2O3, 0.5 to 4.0 weight % of Al2O3, 0.3 to 7.5 weight % of Li2O, and 0.1 to 5.5 weight % of MgO; and MnO, and the content ratios of the glass, etc. are varied between the low dielectric-constant ceramic layers and the high dielectric-constant ceramic layers.

Abstract translation: 一种复合层压陶瓷电子元件，包括共烧低介电常数陶瓷层和高介电常数陶瓷层。 低介电常数陶瓷层和高介电常数陶瓷层各自由玻璃陶瓷组成，该陶瓷含有：由MgAl 2 O 4和/或Mg 2 SiO 4组成的第一陶瓷; 由BaO，RE2O3（RE为稀土元素）和TiO2组成的第二陶瓷; 含有44.0〜69.0重量％的RO（R为碱土金属），14.2〜30.0重量％的SiO 2，10.0〜20.0重量％的B 2 O 3，0.5〜4.0重量％的Al 2 O 3，0.3〜7.5重量％ 的Li 2 O和0.1〜5.5重量％的MgO; 和MnO，并且玻璃等的含量比在低介电常数陶瓷层和高介电常数陶瓷层之间变化。