MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING A PAIR OF SIDE OUTER ELECTRODES AND A CENTER ELECTRODE
    11.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING A PAIR OF SIDE OUTER ELECTRODES AND A CENTER ELECTRODE 有权
    多层陶瓷电子元件,包括一对外部电极和一个中心电极

    公开(公告)号:US20160049242A1

    公开(公告)日:2016-02-18

    申请号:US14823184

    申请日:2015-08-11

    CPC classification number: H01G4/008 H01G4/012 H01G4/12 H01G4/2325 H01G4/30

    Abstract: A multilayer ceramic electronic component includes a multilayer ceramic element with first through sixth surfaces, a center outer electrode located between a first-side outer electrode and a second-side outer electrode on the multilayer ceramic element. A first plated film is provided on the center outer electrode, second plated films are provided on the first-side outer electrode and the second-side outer electrode, respectively, and a thickness of each of the second plated films is greater than a thickness of the first plated film.

    Abstract translation: 多层陶瓷电子部件包括具有第一至第六表面的多层陶瓷元件,位于多层陶瓷元件上的第一侧外电极和第二侧外电极之间的中心外电极。 在中心外电极上设置第一镀膜,第二镀膜分别设置在第一侧外电极和第二侧电极上,第二电镀膜的厚度大于 第一个镀膜。

    LAMINATED CERAMIC ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREFOR, SERIAL TAPING ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREFOR, AND DIRECTION IDENTIFICATION METHOD FOR LAMINATED CERAMIC ELECTRONIC COMPONENT
    12.
    发明申请
    LAMINATED CERAMIC ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREFOR, SERIAL TAPING ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREFOR, AND DIRECTION IDENTIFICATION METHOD FOR LAMINATED CERAMIC ELECTRONIC COMPONENT 有权
    层压陶瓷电子元件,其制造方法,串行电子元件,其制造方法和层状陶瓷电子元件的方向识别方法

    公开(公告)号:US20140126106A1

    公开(公告)日:2014-05-08

    申请号:US14063077

    申请日:2013-10-25

    Inventor: Takashi SAWADA

    CPC classification number: H05K13/0084 H01G2/06 H01G4/232 H01G4/30 Y10T29/43

    Abstract: In a laminated ceramic electronic component, a side surface outer electrode circles around a ceramic element body, a first electrode portion includes a first side surface electrode portion on first and second side surfaces of the ceramic element body and a first wrap-around electrode portion extending from the first side surface electrode portion and wraps around portions of third and fourth side surfaces, and a second electrode portion includes a second side surface electrode portion on the third and fourth side surfaces and a second wrap-around electrode portion extending from the second side surface electrode portion and wrap around portions of the first and second side surfaces. External appearance configurations in which the first and second wrap-around electrode portions are recognizable from outside are provided to the first and second wrap-around electrode portions.

    Abstract translation: 在层叠陶瓷电子部件中,侧面外部电极围绕陶瓷元件本体环绕,第一电极部分包括在陶瓷元件主体的第一和第二侧表面上的第一侧表面电极部分和第一环绕电极部分 从第一侧面电极部分卷绕第三和第四侧面的一部分,第二电极部分包括在第三和第四侧表面上的第二侧面电极部分和从第二侧表面电极部分延伸的第二缠绕电极部分 表面电极部分并包围第一和第二侧表面的部分。 第一和第二环绕电极部分从外部可识别的外观结构设置在第一和第二环绕电极部分上。

    THROUGH-TYPE MULTILAYER CERAMIC CAPACITOR

    公开(公告)号:US20250054703A1

    公开(公告)日:2025-02-13

    申请号:US18931158

    申请日:2024-10-30

    Abstract: A through-type multilayer ceramic capacitor includes a multilayer body including laminated dielectric layers, inner electrode layers laminated on the dielectric layers, first and second inner electrode layer, a first outer electrode on a first end surface of the multilayer body and connected to the first inner electrode layer, a second outer electrode on a second end surface of the multilayer body and connected to the first inner electrode layer, a third outer electrode on a first side surface of the multilayer body and connected to the second inner electrode layer, and a fourth outer electrode on a second side surface of the multilayer body and connected to the second inner electrode layer. The first outer electrode includes a first plating layer and a first charging electrode, and the second outer electrode includes a second plating layer and a second charging electrode.

    MULTILAYER CERAMIC ELECTRONIC COMPONENT

    公开(公告)号:US20250054694A1

    公开(公告)日:2025-02-13

    申请号:US18932732

    申请日:2024-10-31

    Abstract: A multilayer ceramic electronic component includes a multilayer body including laminated ceramic layers and internal electrode layers. The internal electrode layers include a first internal electrode layer laminated alternately with the ceramic layers and exposed at a first and second end and a second internal electrode layer laminated alternately with the ceramic layers and exposed at a first and second side surface, the multilayer ceramic electronic component further includes a dummy electrode spaced apart from the first and second internal electrode layers and exposed at one of the first and second end surfaces and the first and second side surfaces. A line coverage of a conductive component is smaller than about 50% in a region separated from an exposed portion of the dummy electrode toward a center of the multilayer body by about 50% or more.

    CERAMIC LAMINATE AND MULTILAYER CERAMIC CAPACITOR

    公开(公告)号:US20200152392A1

    公开(公告)日:2020-05-14

    申请号:US16740716

    申请日:2020-01-13

    Abstract: A method of manufacturing a multilayer ceramic capacitor includes preparing a laminate by providing ceramic layers and internal electrode layers arranged in a stacking direction, and providing two or more exposure regions at which the internal electrode layers and the ceramic layer interposed between the internal electrode layers are both exposed, and transferring a first conductive paste to the laminate. In the preparing, forming the laminate to have a rectangular parallelepiped configuration or shape and to include two longitudinal end surfaces, and four surfaces orthogonal to the end surfaces and, on at least one of the four surfaces, a protrusion in which the exposure region protrudes outward. In the transferring, the first conductive paste is applied to a transfer jig including a groove, and the first conductive paste in the groove is transferred to a surface of the protrusion.

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    16.
    发明申请

    公开(公告)号:US20170352487A1

    公开(公告)日:2017-12-07

    申请号:US15611887

    申请日:2017-06-02

    Abstract: A multilayer ceramic electronic component includes a laminated body, a first external electrode, a pair of second external electrodes, and a pair of insulating coating portions. The pair of insulating coating portions extends in a laminating direction between each of the pair of second external electrodes and the first external electrode on a second principal surface, from the second principal surface to respective portions of a first side surface and a second side surface. A maximum thickness of the first external electrode on the second principal surface is larger than a maximum thickness of the pair of second external electrodes on the second principal surface. The maximum thickness of the pair of second external electrodes on the second principal surface is larger than a maximum thickness of the pair of insulating coating portions on the second principal surface.

    ELECTRONIC COMPONENT
    18.
    发明申请

    公开(公告)号:US20170229245A1

    公开(公告)日:2017-08-10

    申请号:US15427134

    申请日:2017-02-08

    CPC classification number: H01G4/30 H01G4/012 H01G4/12 H01G4/232 H01G4/2325

    Abstract: An electronic component having excellent reliability includes a first lateral surface and two external electrodes on an outermost side in a length direction among three or more external electrodes on the first lateral surface that are thicker than the other external electrode. On a second lateral surface, two external electrodes that are located on the outermost side in the length direction among three or more external electrodes disposed on the second lateral surface are thicker than the other external electrode.

    MULTILAYER CAPACITOR AND INSTALLATION STRUCTURE OF MULTILAYER CAPACITOR

    公开(公告)号:US20170110249A1

    公开(公告)日:2017-04-20

    申请号:US15393347

    申请日:2016-12-29

    CPC classification number: H01G4/30 H01G4/012 H01G4/232

    Abstract: In a multilayer capacitor, a multilayer capacitor main body includes first and second main surfaces, first and second side surfaces, and first and second end surfaces, the first and second main surfaces extending in a length direction and a width direction, the first and second side surfaces extending in the length direction and a thickness direction, and the first and second end surfaces extending in the width direction and the thickness direction. The second main surface is depressed in a portion extending from opposite ends of the second main surface toward a center of the second main surface in the length direction.

    MULTILAYER CAPACITOR AND INSTALLATION STRUCTURE OF MULTILAYER CAPACITOR
    20.
    发明申请
    MULTILAYER CAPACITOR AND INSTALLATION STRUCTURE OF MULTILAYER CAPACITOR 有权
    多层电容器的多层电容器和安装结构

    公开(公告)号:US20160049243A1

    公开(公告)日:2016-02-18

    申请号:US14701758

    申请日:2015-05-01

    CPC classification number: H01G4/30 H01G4/012 H01G4/232

    Abstract: In a multilayer capacitor, a multilayer capacitor main body includes first and second main surfaces, first and second side surfaces, and first and second end surfaces, the first and second main surfaces extending in a length direction and a width direction, the first and second side surfaces extending in the length direction and a thickness direction, and the first and second end surfaces extending in the width direction and the thickness direction. The second main surface is depressed in a portion extending from opposite ends of the second main surface toward a center of the second main surface in the length direction.

    Abstract translation: 在层叠电容器中,层叠电容器主体包括第一主表面和第二主表面,第一和第二侧表面以及第一和第二主表面,第一和第二主表面沿长度方向和宽度方向延伸,第一和第二表面 在长度方向和厚度方向上延伸的侧面,以及沿宽度方向和厚度方向延伸的第一和第二端面。 第二主表面在从第二主表面的相对端向长度方向的第二主表面的中心延伸的部分中被压下。

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