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公开(公告)号：US20210152198A1
公开(公告)日：2021-05-20
申请号：US17155987
申请日：2021-01-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takashi WATANABE
Abstract: A radio frequency module has a substrate, a first chip inductor, an integrated circuit, and a first amplifier connected to the first chip inductor. The first chip inductor is on a first main surface of the substrate and the integrated circuit is on a second main surface of the substrate, the second main surface being opposite the first main surface. The integrated circuit includes the first amplifier. When the substrate is viewed from a direction perpendicular to the first main surface of the substrate, the first chip inductor at least partially overlaps the integrated circuit.
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公开(公告)号：US20200228074A1
公开(公告)日：2020-07-16
申请号：US16832295
申请日：2020-03-27
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yusuke NANIWA , Hideki MUTO , Hiroshi NISHIKAWA , Takashi WATANABE , Akiko ITABASHI
Abstract: A radio frequency circuit includes a substrate, a first terminal disposed on a first principal surface of the substrate, a second terminal disposed on the first principal surface, a first-surface mounted component disposed on the first principal surface or inside the substrate, and a second-surface mounted component disposed on a second principal surface of the substrate which is opposite the first principal surface. A radio-frequency signal, which is input to the first terminal, is transmitted, for output from the second terminal, so as to make at least one round trip between the first principal surface and the second-surface mounted component, which is disposed on the second principal surface, through wiring lines disposed in the substrate.
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公开(公告)号：US20190273528A1
公开(公告)日：2019-09-05
申请号：US16413712
申请日：2019-05-16
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takashi WATANABE
IPC: H04B1/44 , H03K17/693
Abstract: A radio-frequency switch includes a first switch circuit including a first common terminal, at least two first selection terminals, a first switch that selectively connects the first common terminal and the at least two first selection terminals to each other, and a first shunt switch that switches the first common terminal and ground between a conductive state and a non-conductive state with each other, and a second switch circuit including a second common terminal that is connected to the first common terminal, at least two second selection terminals, and a second switch that selectively connects the second common terminal and the at least two selection terminals to each other.
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公开(公告)号：US20230381612A1
公开(公告)日：2023-11-30
申请号：US18446090
申请日：2023-08-08
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Tomoshige FURUHI , Nobuyuki NOZAWA , Koji KAWANO , Takehiko IIZUKA , Jun MAKINO , Takashi WATANABE , Kenta AGO
IPC: A63B60/46
CPC classification number: A63B60/46 , A63B2060/464 , A63B2102/32
Abstract: A grip force estimation device includes a sensor that is attached to sports equipment including a columnar portion having a grip portion at one end and a hitting portion connected to the columnar portion and is attached not at the grip portion but at the columnar portion, and that is configured to detect at least one of bending and twisting of the sports equipment and output detected bending and/or twisting as a sensor signal, a feature data extraction unit configured to extract feature data including a feature when a waveform generated by the hitting portion being externally applied with pressure is attenuated by using the sensor signal, and a grip force estimation unit configured to estimate pressure applied to the grip portion by using the feature data.
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公开(公告)号：US20230246009A1
公开(公告)日：2023-08-03
申请号：US18298421
申请日：2023-04-11
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takashi WATANABE
CPC classification number: H01L25/16 , H03F3/19 , H01L23/5381
Abstract: A radio-frequency module includes: a filter for band A; a filter for band B; a filter for band C; a filter for band D; a switch having a terminal connected to an antenna connection terminal, a terminal connected to the filters, and a terminal connected to the filters; low-noise amplifiers respectively connected to the filters; and low-noise amplifiers respectively connected to the filters. The filters are included in one integrated circuit disposed on a main surface of a module substrate. The filters are included in one integrated circuit disposed on the main surface. The integrated circuit and the low-noise amplifiers at least partially overlap in plan view.
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Patent Agency Ranking
公开(公告)号：US20200007174A1
公开(公告)日：2020-01-02
申请号：US16567201
申请日：2019-09-11
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takashi WATANABE
Abstract: An amplifier circuit unit of a radio frequency module is mounted on a substrate with a first external terminal interposed therebetween, a switch circuit unit is mounted on the substrate with a second external terminal interposed therebetween, and a matching circuit unit is mounted on the substrate with a first terminal and a second terminal interposed therebetween. The first terminal is electrically connected to the second external terminal of the switch circuit unit, and the second terminal is electrically connected to the first external terminal of the amplifier circuit unit. When viewed from a direction perpendicular to one main surface of the substrate, the first terminal is superposed with the second external terminal of the switch circuit unit, and the second terminal is superposed with the first external terminal of the amplifier circuit unit.
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公开(公告)号：US20190140678A1
公开(公告)日：2019-05-09
申请号：US16237785
申请日：2019-01-02
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takashi WATANABE
CPC classification number: H04B1/16 , H03H7/38 , H03H9/64 , H03H9/72 , H03H11/362 , H03H2007/386 , H03H2250/00
Abstract: A radio-frequency module includes a multilayer substrate, an input switch, an output switch, and filters. A switch IC is disposed on a main surface of the multilayer substrate. The input switch is disposed in the switch IC and includes a first input terminal and first output terminals. The output switch is disposed in the switch IC and includes second input terminals and a second output terminal. The filters are disposed outside the switch IC and are connected to the first output terminals and the second input terminals. In a plan view of the multilayer substrate, the first input terminal and the first output terminals are disposed close to a first side of an exterior of the switch IC, and the second input terminals and the second output terminal are disposed close to a second side different from the first side of the exterior of the switch IC.
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公开(公告)号：US20170194993A1
公开(公告)日：2017-07-06
申请号：US15296126
申请日：2016-10-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takashi WATANABE
CPC classification number: H04B1/16 , H03H7/38 , H03H9/64 , H03H9/72 , H03H11/362 , H03H2007/386 , H03H2250/00
Abstract: A radio-frequency module includes a multilayer substrate, an input switch, an output switch, and filters. A switch IC is disposed on a main surface of the multilayer substrate. The input switch is disposed in the switch IC and includes a first input terminal and first output terminals. The output switch is disposed in the switch IC and includes second input terminals and a second output terminal. The filters are disposed outside the switch IC and are connected to the first output terminals and the second input terminals. In a plan view of the multilayer substrate, the first input terminal and the first output terminals are disposed close to a first side of an exterior of the switch IC, and the second input terminals and the second output terminal are disposed close to a second side different from the first side of the exterior of the switch IC.
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公开(公告)号：US20170141801A1
公开(公告)日：2017-05-18
申请号：US15297321
申请日：2016-10-19
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takashi WATANABE
CPC classification number: H04B1/006 , H03H7/0115 , H03H7/38 , H03H7/46 , H03H9/54 , H03H9/64 , H03H9/70 , H03H2250/00
Abstract: A radio-frequency module includes switch elements, first signal paths, band pass filters, first matching circuits, second signal paths, and second matching circuits. Each of the first signal paths is connected between one end of a corresponding one of the switch elements and an antenna terminal. Each of the band pass filters is connected to a corresponding one of the first signal paths and allows a radio-frequency signal of one of the plurality of frequency bands to pass therethrough. Each of the first matching circuits is connected to a corresponding one of the first signal paths. Each of the second signal paths is connected to a corresponding one of the switch elements. Each of the second matching circuits is connected to a corresponding one of the second signal paths. A component included in the first matching circuits and a component included in the second matching circuits are electromagnetically coupled.
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公开(公告)号：US20230291427A1
公开(公告)日：2023-09-14
申请号：US18319072
申请日：2023-05-17
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yuudai TANOUE , Minoru IWANAGA , Takashi WATANABE
Abstract: A high-frequency module includes a mounting substrate, a first filter, a second filter, and a third filter. The mounting substrate has a first main surface and a second main surface opposite to each other. Simultaneous communication is enabled for the first filter and the second filter, and the third filter is not used in the simultaneous communication using the first filter and the second filter. The first filter, the second filter, and the third filter are mounted on the first main surface of the mounting substrate. A first substrate of the first filter, a second substrate of the second filter, and a third substrate of the third filter are common to each other. The third filter is disposed between the first filter and the second filter in plan view from a thickness direction of the mounting substrate.
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