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公开(公告)号:US20210074482A1
公开(公告)日:2021-03-11
申请号:US17000517
申请日:2020-08-24
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Shinichi KOKAWA , Yasuyuki SHIMADA , Naoto MURANISHI , Takehisa SASABAYASHI
Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and layered internal electrodes, first and second main surfaces, first and second side surfaces, first and second end surfaces, and an external electrode connected to the internal electrodes and provided on each of the first and second end surfaces. A region where the internal electrodes are superimposed is defined as an effective region, regions respectively located on sides of the first and second end surfaces relative to the effective region are defined as first and second regions, and a bent portion where the dielectric layers and the internal electrodes are bent is located in the first region. In the bent portion, all vertices in the stacking direction are located within a range that extends by about 25 μm to about 35 μm in a length direction from the effective region of the multilayer body.
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公开(公告)号:US20180108483A1
公开(公告)日:2018-04-19
申请号:US15784235
申请日:2017-10-16
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Takehisa SASABAYASHI , Yasuhiro NISHISAKA , Satoshi MATSUNO , Yoko OKABE
CPC classification number: H01G4/30 , H01G4/008 , H01G4/0085 , H01G4/1209 , H01G4/2325 , H01G4/248 , H01G13/006
Abstract: A method for manufacturing a multilayer ceramic capacitor includes preparing a green multilayer body including a stack of dielectric sheets printed with inner electrodes, coating the green multilayer body with a conductive paste that is connected to the inner electrodes, and firing the conductive paste and the green multilayer body at the same time, wherein a rate of temperature increase from about 800° C. to about 1,100° C. during the firing is about 15° C. per minute or more.
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公开(公告)号:US20160093440A1
公开(公告)日:2016-03-31
申请号:US14867270
申请日:2015-09-28
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Yasuhiro NISHISAKA , Takehisa SASABAYASHI , Satoshi MURAMATSU
CPC classification number: H01G4/248 , H01G4/12 , H01G4/2325 , H01G4/30
Abstract: A multilayer ceramic capacitor includes an external electrode that is unlikely to be peeled. First and second external electrodes each include base layers provided over a ceramic body and including a metal and glass, and Cu plated layers provided over the base layers. The multilayer ceramic capacitor includes a reactive layer. The reactive layer contains about 5 atomic % to about 15 atomic % of Ti, about 5 atomic % to about 15 atomic % of Si, and about 2 atomic % to about 10 atomic % of V.
Abstract translation: 多层陶瓷电容器包括不可能剥离的外部电极。 第一外部电极和第二外部电极各自包括设置在陶瓷体上并包括金属和玻璃的基底层,以及设置在基底层上的Cu镀层。 多层陶瓷电容器包括反应层。 反应层含有约5原子%至约15原子%的Ti,约5原子%至约15原子%的Si和约2原子%至约10原子%的V.
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公开(公告)号:US20160093438A1
公开(公告)日:2016-03-31
申请号:US14867288
申请日:2015-09-28
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Takehisa SASABAYASHI
CPC classification number: H01G4/12 , H01G4/012 , H01G4/232 , H01G4/2325 , H01G4/30 , H05K1/115 , H05K1/185 , H05K2201/10015
Abstract: A multilayer ceramic capacitor provided in a multilayer printed wiring board includes a ceramic body with a plurality of ceramic layers and internal electrodes stacked, and an external electrode including a base layer that includes a sintered metal containing a metal and glass and a plated layer provided on the surface of the base layer, which is provided on an end surface of the ceramic body to be connected to the internal electrodes. The external electrode includes a principal surface portion disposed on a principal surface of the ceramic body. The outermost layer of the plated layer includes a Cu plated layer. The ratio of arithmetic mean roughness (Ra) at the surface of the ceramic body/arithmetic mean roughness (Ra) at the surface of the external electrode satisfies a condition: about 0.06 the arithmetic mean roughness (Ra) at the surface of the ceramic body/the arithmetic mean roughness (Ra) at the surface of the external electrode about 0.97.
Abstract translation: 设置在多层印刷布线板中的多层陶瓷电容器包括具有堆叠的多个陶瓷层和内部电极的陶瓷体,以及包括基底层的外部电极,所述基底层包括含有金属和玻璃的烧结金属和设置在其上的镀层 设置在陶瓷体的与内部电极连接的端面上的基底层的表面。 外部电极包括设置在陶瓷体的主表面上的主表面部分。 镀层的最外层包括Cu镀层。 陶瓷体表面的算术平均粗糙度(Ra)/外部电极表面的算术平均粗糙度(Ra)的比例满足条件:陶瓷体表面的算术平均粗糙度(Ra)为约0.06 /外部电极表面的算术平均粗糙度(Ra)约为0.97。
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