公开(公告)号：US20200212255A1

公开(公告)日：2020-07-02

申请号：US16727463

申请日：2019-12-26

Applicant: Nichia Corporation

Inventor： Kensuke YAMAOKA

IPC: H01L33/00 ,  H01L33/58 ,  H01L33/20 ,  H01L25/075 ,  F21K9/90

Abstract: A light emitting device manufacturing method includes: disposing n pieces of light emitting elements in m rows on a substrate block, where an interval between a kth light emitting element from one end of rows and a (k+1)th light emitting element has a first distance; disposing a phosphor member on the light emitting elements; disposing a frame member to surround the light emitting elements; disposing a cover member in each area surrounded by the frame member to cover lateral surfaces of the light emitting elements and the phosphor members while forming recesses at an upper surface between the kth light emitting elements and the (k+1)th light emitting elements apart by the first distance; disposing a light shielding member in each recess; and cutting the light shielding members, the cover members, and the substrate block between the light emitting elements that are apart by the first distance.

公开(公告)号：US20190302350A1

公开(公告)日：2019-10-03

申请号：US16370000

申请日：2019-03-29

Applicant: NICHIA CORPORATION

Inventor： Kensuke YAMAOKA ,  Hiroki NAKAI

IPC: F21V8/00 ,  B29C45/14 ,  B29C45/00

Abstract: A method of manufacturing a light emitting device includes: mounting a light emitting element on a substrate; disposing a light shielding frame on a sheet, the light shielding frame having an opening; disposing a plate-shaped light transmissive member in the opening, the plate-shaped light transmissive member having a first face and a second face opposite the first face, wherein an outer perimeter of the first face is smaller than an inner perimeter of the opening; forming a light guide support member by filling the space with a first light reflecting member; bonding the light guide support member by bonding an upper face of the light emitting element and the second face of the light transmissive member; and forming a second light reflecting member surrounding the light emitting element by filling the space between the substrate and the light shielding frame with a second reflecting resin.

公开(公告)号：US20230420284A1

公开(公告)日：2023-12-28

申请号：US18329646

申请日：2023-06-06

Applicant: NICHIA CORPORATION

Inventor： Kensuke YAMAOKA ,  Hiroki YUU

IPC: H01L21/683 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L21/6835 ,  H01L25/0753 ,  H01L33/62 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2933/0066

Abstract: A method for manufacturing a light-emitting device includes: preparing a first structure comprising: a first substrate having a first surface and a second surface on a side opposite the first surface, a release layer disposed on the first surface, and one or more light-emitting elements fixed to the first surface of the first substrate via the release layer, the one or more light-emitting elements each having a third surface facing the release layer and a fourth surface on a side opposite the third surface, the fourth surface being larger than the third surface in a plan view, wherein: the release layer encloses the fourth surface in the plan view; preparing a second structure comprising a second substrate having an upper surface; and transferring the one or more light-emitting elements from the first substrate to the second substrate by removing the release layer.

公开(公告)号：US20230228930A1

公开(公告)日：2023-07-20

申请号：US18156855

申请日：2023-01-19

Applicant: NICHIA CORPORATION

Inventor： Kensuke YAMAOKA ,  Hiroaki KURODA ,  Daisuke SANGA

IPC: F21V8/00 ,  A01G7/04 ,  C09K11/61 ,  C09K11/64

CPC classification number: G02B6/001 ,  G02B6/0006 ,  A01G7/045 ,  C09K11/617 ,  C09K11/645

Abstract: An optical member includes a first light guide member having an elongated shape and comprising an end surface and a lateral surface extending in a longitudinal direction from the end surface; and a wavelength conversion layer disposed on the lateral surface of the first light guide member and containing a phosphor.

公开(公告)号：US20220416140A1

公开(公告)日：2022-12-29

申请号：US17834571

申请日：2022-06-07

Applicant: NICHIA CORPORATION

Inventor： Kensuke YAMAOKA ,  Daisuke SANGA

IPC: H01L33/62 ,  H01L33/38 ,  H01L33/00

Abstract: A method for manufacturing a light emitting module includes: providing an intermediate body including: a wiring substrate including a metal layer, a first conductive member, and a second conductive member; disposing a resist layer on the intermediate body; disposing a light-emitting element on the resist layer, the light-emitting element comprising: a first electrode, and a second electrode; forming on the metal layer: a first bonding member in contact with the first conductive member and the first electrode, and a second bonding member separated from the first conductive member and in contact with the second conductive member and the second electrode; and removing the resist layer.

公开(公告)号：US20220209079A1

公开(公告)日：2022-06-30

申请号：US17557235

申请日：2021-12-21

Applicant: NICHIA CORPORATION

Inventor： Kensuke YAMAOKA ,  Kenji OZEKI

IPC: H01L33/60 ,  H01L33/62 ,  H01L33/52 ,  H01L33/00 ,  H01L33/50

Abstract: A light-emitting module includes: a plurality of light-emitting elements; a first substrate having an upper surface that includes an element mounting region on which the light-emitting elements are mounted, the first substrate including a plurality of first terminals; a second substrate having an upper surface that includes a substrate mounting region on which the first substrate is mounted, the second substrate including a plurality of second terminals; a plurality of wires each connected to corresponding ones of the first terminals and the second terminals; a light-shielding covering member disposed outward of the element mounting region so as to cover the plurality of wires; and a light-transmissive first projection disposed along the element mounting region between the element mounting region and the first terminals so as to be in contact with the covering member.

公开(公告)号：US20190165218A1

公开(公告)日：2019-05-30

申请号：US16203459

申请日：2018-11-28

Applicant: Nichia Corporation

Inventor： Hiroki NAKAI ,  Kensuke YAMAOKA

IPC: H01L33/48 ,  H01L33/60 ,  H01L33/50 ,  H01L25/075

Abstract: A light emitting device includes: a substrate; a light emitting element disposed on the substrate; a light transmissive member having a plate shape and having an upper face and a lower face disposed such that the lower face opposes a light emission face of the light emitting element; a light reflecting member covering lateral faces of the light emitting element and lateral faces of the light transmissive member; and a light shielding frame disposed on the upper face of the light reflecting member surrounding the light transmissive member. The light shielding frame has an opening, an inner perimeter of the opening is positioned at a distance apart from an outer perimeter of the upper face of the light transmissive member in a plan view as seen from above, and the light reflecting member is interposed between the inner perimeter of the opening and the outer perimeter of the upper face of the light transmissive member.