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公开(公告)号：US20170040512A1
公开(公告)日：2017-02-09
申请号：US15218323
申请日：2016-07-25
Applicant: NICHIA CORPORATION
Inventor： Takahiro TANI , Hiroki YUU , Toshiaki MORIWAKI
CPC classification number: H01L33/58 , H01L33/486 , H01L33/56 , H01L33/62 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01S5/005 , H01S5/0425
Abstract: A method of manufacturing a light emitting device includes: arranging a first light emitting element and a second light emitting element, each having a pair of first and second electrodes disposed on a surface opposite to a main light emitting surface, on a base body adjacent to each other with the pair of electrodes facing upward; forming a pair of electrically conductive members each extending between one of the pair of electrodes of the first light emitting element and a corresponding one of the pair of electrodes of the second light emitting element; forming a light shielding member at least covering between the first and second light emitting elements; and cutting the pair of electrically conductive members and the light shielding member between the first and second light emitting elements, along a direction substantially perpendicular to the main light emitting surface of each of the first and second light emitting elements.
Abstract translation: 一种制造发光器件的方法包括：将与第一发光元件和第二发光元件相配合的第一发光元件和第二发光元件配置在与主发光表面相对的表面上的一对第一和第二电极上， 彼此面对着电极对; 形成一对导电构件，每个导电构件在第一发光元件的一对电极之一和第二发光元件的一对电极中的对应一个之间延伸; 形成至少覆盖在第一和第二发光元件之间的遮光构件; 以及沿着与所述第一和第二发光元件的每一个的主发光表面基本垂直的方向切割所述一对导电构件和所述遮光构件在所述第一和第二发光元件之间。
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公开(公告)号：US20230420284A1
公开(公告)日：2023-12-28
申请号：US18329646
申请日：2023-06-06
Applicant: NICHIA CORPORATION
Inventor： Kensuke YAMAOKA , Hiroki YUU
IPC: H01L21/683 , H01L25/075 , H01L33/62
CPC classification number: H01L21/6835 , H01L25/0753 , H01L33/62 , H01L2221/68354 , H01L2221/68368 , H01L2221/68381 , H01L2933/0066
Abstract: A method for manufacturing a light-emitting device includes: preparing a first structure comprising: a first substrate having a first surface and a second surface on a side opposite the first surface, a release layer disposed on the first surface, and one or more light-emitting elements fixed to the first surface of the first substrate via the release layer, the one or more light-emitting elements each having a third surface facing the release layer and a fourth surface on a side opposite the third surface, the fourth surface being larger than the third surface in a plan view, wherein: the release layer encloses the fourth surface in the plan view; preparing a second structure comprising a second substrate having an upper surface; and transferring the one or more light-emitting elements from the first substrate to the second substrate by removing the release layer.
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公开(公告)号：US20220384405A1
公开(公告)日：2022-12-01
申请号：US17825842
申请日：2022-05-26
Applicant: NICHIA CORPORATION
Inventor： Hiroki YUU
Abstract: A method for manufacturing a light emitting device includes: preparing a first substrate having an upper surface comprising an element placement region; placing a light emitting element in the element placement region; disposing an uncured, sheet-like light-transmissive member on the light emitting element and bringing an outer edge of a lower surface of the light-transmissive member into contact with an outer upper surface of the element placement region of the first substrate by pressing the light-transmissive member; and disposing a first protrusion portion along an outer edge of an upper surface of the light-transmissive member so that the first protrusion portion extends over the upper surface of the first substrate and the upper surface of the light-transmissive member.
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公开(公告)号：US20190214535A1
公开(公告)日：2019-07-11
申请号：US16353785
申请日：2019-03-14
Applicant: NICHIA CORPORATION
Inventor： Hiroki YUU
CPC classification number: H01L33/52 , H01L21/82 , H01L33/005 , H01L33/0095 , H01L33/44 , H01L33/60 , H01L33/62 , H01L2933/0025 , H01L2933/0033 , H01L2933/005 , H01L2933/0066
Abstract: A light emitting device includes a light emitting element, a covering member and a metal layer. The light emitting element includes a semiconductor layer having a main light emission surface and an electrode formation surface on an opposite side of the main light emission surface, and a pair of electrodes disposed on the electrode formation surface. The covering member covers a side surface of the light emitting element. An outer surface of the covering member defines a recess. The metal layer is connected to the pair of electrodes. The metal layer is arranged in the recess.
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公开(公告)号：US20180315904A1
公开(公告)日：2018-11-01
申请号：US16030014
申请日：2018-07-09
Applicant: NICHIA CORPORATION
Inventor： Hiroki YUU
CPC classification number: H01L33/52 , H01L21/82 , H01L33/005 , H01L33/0095 , H01L33/44 , H01L33/60 , H01L33/62 , H01L2933/0025 , H01L2933/0033 , H01L2933/005 , H01L2933/0066
Abstract: A light emitting device includes a light emitting element, a covering member and a metal layer. The light emitting element includes a semiconductor layer having a main light emission surface and an electrode formation surface on an opposite side of the main light emission surface, and a pair of electrodes disposed on the electrode formation surface. The covering member covers a side surface of the light emitting element. The metal layer is connected to the pair of electrodes. The metal layer covers an outer surface of the covering member.
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Patent Agency Ranking
公开(公告)号：US20180090648A1
公开(公告)日：2018-03-29
申请号：US15717242
申请日：2017-09-27
Applicant: NICHIA CORPORATION
Inventor： Hiroki YUU
CPC classification number: H01L33/52 , H01L21/82 , H01L33/005 , H01L33/44 , H01L33/62 , H01L2933/0025 , H01L2933/005 , H01L2933/0066
Abstract: A method for manufacturing a light emitting device includes: preparing an intermediate body including a plurality of light emitting elements spaced apart from each other, each of the light emitting elements having a pair of electrodes disposed on the same side, and a covering member covering side surfaces of the light emitting elements while a part of a surface of each of the electrodes is exposed from the covering member, the covering member having a recess between adjacent ones of the light emitting elements; forming a metal layer that continuously covers the surface of each of the electrodes of the light emitting elements and an inner surface of the recess of the covering member; and cutting the metal layer and the covering member at the inner surface of the recess.
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公开(公告)号：US20250133869A1
公开(公告)日：2025-04-24
申请号：US18916707
申请日：2024-10-16
Applicant: NICHIA CORPORATION
Inventor： Hiroki YUU
IPC: H01L33/00 , H01L25/075
Abstract: A method for manufacturing a light-emitting device including providing a first structure having a support substrate, a first bonding member on a surface thereof, and light-emitting elements having a first surface in contact with the first bonding member, an opposite second surface, and electrodes on a second surface side. The method includes providing a second structure having a substrate including a base member and terminal portions on a surface thereof, and a second bonding member between the terminal portions and thicker than the terminal portions. The method includes disposing the first structure on the second bonding member such that respective electrodes and respective terminal portions are spaced apart from and facing each other, connecting the respective electrodes and the respective terminal portions, and after the connecting, exposing the first and second bonding members to a solution to remove them to separate off the support substrate from the light-emitting elements.
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公开(公告)号：US20200209458A1
公开(公告)日：2020-07-02
申请号：US16728346
申请日：2019-12-27
Applicant: NICHIA CORPORATION
Inventor： Hiroki YUU
Abstract: Provided is a light emitting module, including: a light guide plate having a first main surface and a second main surface opposite to the first main surface; a plurality of light source members disposed on a second main surface side, each of the light source members including a light emitting element having a main light emitting surface, an electrode formation surface located opposite to the main light emitting surface, and a side surface between the main light emitting surface and the electrode formation surface, and a wavelength conversion member covering the main light emitting surface and the side surface of the light emitting element; and a sealing member covering the plurality of light source members and the second main surface of the light guide plate. The light guide plate has a plurality of first recesses located at the second main surface, and each of the plurality of light source members is disposed such that at least a part of the side surface of the light emitting element is located in the first recess in a cross-sectional view.
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公开(公告)号：US20190157528A1
公开(公告)日：2019-05-23
申请号：US16250725
申请日：2019-01-17
Applicant: NICHIA CORPORATION
Inventor： Takahiro TANI , Hiroki YUU , Toshiaki MORIWAKI
Abstract: A light emitting device includes a light emitting surface, a back surface arranged on an opposite side of the light emitting surface, a mounting surface arranged between the light emitting surface and the back surface, and includes a light emitting element, a light shielding member, first and second terminal coating films, and first and second electrically conductive members. The light emitting element has first and second electrodes arranged on the second main surface. The light shielding member covers the lateral surface of the light emitting element and does not cover the first main surface of the light emitting element. The first and second terminal coating films are electrically connected to the first and second electrodes respectively, and arranged continuously on the back surface and the mounting surface of the light emitting device. The first and second electrically conductive members are in contact with the first and second electrodes respectively.
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公开(公告)号：US20180175263A1
公开(公告)日：2018-06-21
申请号：US15883348
申请日：2018-01-30
Applicant: NICHIA CORPORATION
Inventor： Takahiro TANI , Hiroki YUU , Toshiaki MORIWAKI
CPC classification number: H01L33/58 , H01L33/486 , H01L33/56 , H01L33/62 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01S5/005 , H01S5/0425
Abstract: A method of manufacturing a light emitting device includes: arranging first and second light emitting elements, each having a pair of electrodes disposed on a surface opposite to a main light emitting surface, on a base body adjacent to each other with the electrodes facing upward; forming a light shielding member at least covering the electrodes of each of the first and second light emitting elements and a portion between the first and second light emitting elements; forming recesses by removing portions of the light shielding member so that at least a portion of each of the electrodes of the first and second light emitting elements are exposed from the light shielding member; and forming electrically conductive members in the recesses so that each of the electrically conductive members is in contact with a corresponding one of the electrodes of the first and second light emitting elements.
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