公开(公告)号：US11029561B2

公开(公告)日：2021-06-08

申请号：US16911264

申请日：2020-06-24

Applicant: NICHIA CORPORATION

Inventor： Mamoru Imada

IPC: G02F1/13357 ,  F21V8/00

Abstract: An upper face of a light guide includes a projected portion that has a planar face, and a wall portion that surrounds the projected portion, wherein a top part of the wall portion is positioned higher than the planar face. A lower face of the light guide has a recessed portion. A light transmitting part that has a lower refractive index than a reflective index of the light guide is disposed on the projected portion in an area surrounded by the wall portion. A light source is disposed in the recessed portion. The projected portion has an oblique face which is oblique to the planar face and disposed between the planar face and the wall portion. In a plan view of the planar face of the projected portion, the oblique face of the projected portion is positioned outward of a lateral face of the recessed portion at least in part.

公开(公告)号：US11973171B2

公开(公告)日：2024-04-30

申请号：US17137778

申请日：2020-12-30

Applicant: NICHIA CORPORATION

Inventor： Mamoru Imada

IPC: H01L33/60 ,  F21V8/00 ,  F21V23/00 ,  H01L33/38

CPC classification number: H01L33/60 ,  F21V23/002 ,  G02B6/0055 ,  H01L33/38

Abstract: According to one embodiment, the light guide plate has a first major surface, a second major surface, a side surface, and a recess. The recess is provided in the second major surface. The fluorescent layer is provided in the recess. The light-emitting element is bonded to the fluorescent layer and includes an electrode on a surface of the light-emitting element on a side opposite to a surface of the light-emitting element bonded to the fluorescent layer. The module side surface includes at least a portion of the side surface of the light guide plate. The first interconnect is provided along the second major surface and connected to the electrode of the light-emitting element. The second interconnect is provided on the module side surface and connected to the first interconnect.

公开(公告)号：US11353645B2

公开(公告)日：2022-06-07

申请号：US17189198

申请日：2021-03-01

Applicant: NICHIA CORPORATION

Inventor： Mamoru Imada

IPC: F21V8/00 ,  F21V9/30 ,  G02F1/1335 ,  G02F1/13357 ,  F21Y105/16

Abstract: A light-emitting module includes a two-dimensional array of a plurality of light-emitting units. Each of the light-emitting units includes a lightguide plate, a light source, and a light diffusing layer. The light guide plate has a first surface and a first hole portion. The first hole portion has at least one lateral surface and an opening at the first surface. The light source is provided at least partially inside the first hole portion. The light source includes a light-emitting element. The light diffusing layer covers part of the at least one lateral surface of the first hole portion.

公开(公告)号：US10971657B2

公开(公告)日：2021-04-06

申请号：US16529005

申请日：2019-08-01

Applicant: NICHIA CORPORATION

Inventor： Mamoru Imada ,  Toshiaki Moriwaki ,  Yusaku Achi ,  Ryohei Yamashita

IPC: H01L33/50 ,  H01L33/10 ,  H01L33/36 ,  H01L33/54 ,  G02F1/13357 ,  H01L33/62 ,  F21V8/00

Abstract: A light emitting module includes: a plurality of light emitting elements each having a primary light emitting surface and a lateral surface; a plurality of wavelength conversion members arranged respectively on the primary light emitting surfaces of the plurality of light emitting elements; and a lightguide plate having a first primary surface and a second primary surface and arranged continuously on the plurality of wavelength conversion members so that the second primary surface faces the plurality of wavelength conversion members, wherein the lightguide plate includes a plurality of recessed portions located on the second primary surface, and a lateral surface of at least one of the plurality of wavelength conversion members is partially in contact with an inner lateral surface of at least one of the plurality of recessed portions.

公开(公告)号：US10910534B2

公开(公告)日：2021-02-02

申请号：US16430176

申请日：2019-06-03

Applicant: NICHIA CORPORATION

Inventor： Mamoru Imada

IPC: H01L33/00 ,  H01L33/60 ,  F21V23/00 ,  F21V8/00 ,  H01L33/38

Abstract: According to one embodiment, the light guide plate has a first major surface, a second major surface, a side surface, and a recess. The recess is provided in the second major surface. The fluorescent layer is provided in the recess. The light-emitting element is bonded to the fluorescent layer and includes an electrode on a surface of the light-emitting element on a side opposite to a surface of the light-emitting element bonded to the fluorescent layer. The module side surface includes at least a portion of the side surface of the light guide plate. The first interconnect is provided along the second major surface and connected to the electrode of the light-emitting element. The second interconnect is provided on the module side surface and connected to the first interconnect.

公开(公告)号：US10775669B2

公开(公告)日：2020-09-15

申请号：US16365037

申请日：2019-03-26

Applicant: NICHIA CORPORATION

Inventor： Mamoru Imada ,  Toshiaki Moriwaki ,  Yusaku Achi

IPC: G02F1/13357 ,  F21V8/00 ,  H01L33/52 ,  H01L25/075 ,  G02B6/00 ,  H01L33/50 ,  H01L33/58

Abstract: A light emitting module includes a light transmissive light guiding plate, a light adjustment portion, and a light emitting element. The light guiding plate has a first main surface serving as a light emitting surface which emits light outside, and a second main surface opposite to the first main surface. The second main surface is provided with a recess. The light adjustment portion is disposed in the recess of the light guiding plate. The light emitting element is bonded to the light adjustment portion. The light adjustment portion includes a wavelength conversion portion and a light diffusion portion. The light diffusion portion has a wavelength conversion portion side on which the wavelength conversion portion is bonded. The light diffusion portion is disposed on a bottom of the recess. The wavelength conversion portion is bonded to the light emitting element.

公开(公告)号：US10768353B2

公开(公告)日：2020-09-08

申请号：US16024018

申请日：2018-06-29

Applicant: NICHIA CORPORATION

Inventor： Tadao Hayashi ,  Ryohei Yamashita ,  Yusaku Achi ,  Mamoru Imada

IPC: G02B6/00 ,  F21V8/00 ,  H01L33/50 ,  H01L25/075 ,  G02F1/13357 ,  H01L33/58

Abstract: A method of manufacturing a light emitting module according to the present disclosure includes: preparing a light guide plate that comprises a first main surface serving as a light-emitting surface and a second main surface opposite to the first main surface; respectively providing light emitting elements on the second main surface so as to correspond to each of a plurality of optically functional portions provided on the first main surface of the light guide plate; and forming wires electrically connecting the plurality of light emitting elements.