公开(公告)号：US20170186927A1

公开(公告)日：2017-06-29

申请号：US15388568

申请日：2016-12-22

Applicant: NICHIA CORPORATION

Inventor： Ryoji NAKA ,  Atsushi BANDO

IPC: H01L33/60 ,  H01L33/32 ,  H01L33/00 ,  H01L33/48 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L33/0095 ,  H01L33/32 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A method of manufacturing a plurality of light emitting devices includes providing a collective substrate including a plurality of packages, each of the packages including: a recess defined by lateral surfaces and a bottom surface, a first electrode and a second electrode that are disposed at the bottom surface of the recess, and a light-reflective first resin member surrounding an element-mounting region of the bottom surface of the recess, the first resin member having an upper surface located at a position higher than the element-mounting region; mounting a light emitting element in the element-mounting region; forming a light-reflective second resin member having a light reflective surface; and singulating the collective substrate to obtain the plurality of light emitting devices.