公开(公告)号：US10833230B2

公开(公告)日：2020-11-10

申请号：US16793018

申请日：2020-02-18

Applicant: NICHIA CORPORATION

Inventor： Kenichi Aoyagi ,  Takashi Kaide ,  Takuya Nakabayashi ,  Tetsuya Ishikawa ,  Shoji Hosokawa

IPC: H01L33/50 ,  C09K11/77 ,  C09K11/08

Abstract: A wavelength converting member comprising a first wavelength converting layer containing: a first fluorescent material having a light emission peak wavelength in a range of 620 nm or more and 660 nm or less; a second fluorescent material having a light emission peak wavelength in a range of 510 nm or more and 560 nm or less; and a resin, wherein the average particle diameter, as measured according to a Fisher Sub-Sieve Sizer method, of the first fluorescent material is in a range of 2 μm or more and 30 μm or less, wherein the second fluorescent material comprises a β-SiAlON fluorescent material, the circularity of the β-SiAlON fluorescent material is 0.7 or more, and the volume average particle diameter, as measured according to a laser diffraction scattering particle size distribution measuring method, of the β-SiAlON fluorescent material is in a range of 2 μm or more and 30 μm or less, and wherein the thickness of the first wavelength converting layer is in a range of 50 μm or more and 200 μm or less.

公开(公告)号：US10804442B2

公开(公告)日：2020-10-13

申请号：US16257714

申请日：2019-01-25

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi ,  Tetsuya Ishikawa

IPC: H01L33/50 ,  H01L33/60

Abstract: A light emitting device includes a light emitting element including a first surface; a light guide member covering at least a part of a lateral surface of the light emitting element; a first wavelength conversion member covering the first surface and including a first wavelength conversion particles; and a reflective member being in contact with the light emitting element. The first wavelength conversion member has a thickness of 60 μm or more and 120 μm or less. The first wavelength conversion particles have an average particle size of 4 μm or longer and 12 μm or smaller; the first wavelength conversion particles have a central particle size of 4 μm or longer and 12 μm or smaller. A weight ratio of the first wavelength conversion particles is 60% by weight or more and 75% by weight or less with respect to the total weight of the first wavelength conversion member.

公开(公告)号：US10608149B2

公开(公告)日：2020-03-31

申请号：US16369046

申请日：2019-03-29

Applicant: NICHIA CORPORATION

Inventor： Kenichi Aoyagi ,  Takashi Kaide ,  Takuya Nakabayashi ,  Tetsuya Ishikawa ,  Shoji Hosokawa

IPC: H01L33/50 ,  C09K11/77 ,  C09K11/08

Abstract: A wavelength converting member comprising a first wavelength converting layer containing: a first fluorescent material having a light emission peak wavelength in a range of 620 nm or more and 660 nm or less; a second fluorescent material having a light emission peak wavelength in a range of 510 nm or more and 560 nm or less; and a resin, wherein the average particle diameter, as measured according to a Fisher Sub-Sieve Sizer method, of the first fluorescent material is in a range of 2 μm or more and 30 μm or less, wherein the second fluorescent material comprises a β-SiAlON fluorescent material, the circularity of the β-SiAlON fluorescent material is 0.7 or more, and the volume average particle diameter, as measured according to a laser diffraction scattering particle size distribution measuring method, of the β-SiAlON fluorescent material is in a range of 2 μm or more and 30 μm or less, and wherein the thickness of the first wavelength converting layer is in a range of 50 μm or more and 200 μm or less.

公开(公告)号：US10243107B2

公开(公告)日：2019-03-26

申请号：US15717183

申请日：2017-09-27

Applicant: NICHIA CORPORATION

Inventor： Tetsuya Ishikawa ,  Gensui Tamura

IPC: H01L33/38 ,  H01L33/54 ,  H01L33/62

Abstract: A light emitting device includes a resin molding, first and second leads, and a light emitting element. The resin molding includes a front surface defining an opening, and a lower surface adjacent to the front surface. The first and second leads each includes an outer lead portion and an inner lead portion. The outer lead portion protrudes from the lower surface of the resin molding, and includes a bent portion bent along the lower surface. A surface on an inner side of the bent portion including a first recessed section. The inner lead portion includes an embedded portion embedded in the resin molding, and an exposed portion exposed in the opening. A surface of the embedded portion opposite from the surface where the first recessed section is provided includes a second recessed with a part of the resin molding being positioned in the second recessed section.