公开(公告)号：US08994259B2

公开(公告)日：2015-03-31

申请号：US13852332

申请日：2013-03-28

Applicant: Nichia Corporation

Inventor： Hiroto Tamaki ,  Takayoshi Wakaki ,  Tadao Hayashi ,  Yoshiki Sato ,  Daisuke Oyamatsu ,  Takafumi Sugiyama ,  Takao Kosugi

IPC: H01L33/50 ,  H01J1/62 ,  H01J1/70 ,  H01J63/04 ,  H01L31/055 ,  B05D5/06 ,  F21V7/00 ,  H05B33/12

CPC classification number: F21V9/30 ,  B05D5/06 ,  C23C16/45525 ,  F21K9/60 ,  F21V7/00 ,  F21V13/08 ,  F21Y2115/10 ,  F21Y2115/30 ,  H01L31/055 ,  H01L33/502 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H05B33/12 ,  Y02E10/52 ,  Y10T428/24364 ,  Y10T428/24372 ,  Y10T428/24413 ,  Y10T428/24421 ,  H01L2924/00014

Abstract: A wave-length conversion inorganic member can includes a base body and an inorganic particle layer on the base body. The inorganic particle layer can include particles of an inorganic wave-length conversion substance which is configured to absorb light of a first wave-length and to emit light of a second wave-length different from the first wave-length. The inorganic particle layer can include an agglomerate of a plurality of the particles. Each of the plurality of the particles are in contact with at least one of the other particles or the base body. A cover layer comprises an inorganic material, and the cover layer continuously covers a surface of the base body and surfaces of the particles. The inorganic particle layer has an interstice enclosed by the particles, or by the particles and one of the base body and the cover layer.

Abstract translation: 波长转换无机部件可以在基体上包括基体和无机粒子层。 无机粒子层可以包括被配置为吸收第一波长的光并发射与第一波长不同的第二波长的光的无机波长转换物质的粒子。 无机颗粒层可以包括多个颗粒的附聚物。 多个颗粒中的每一个与至少一个其它颗粒或基体接触。 覆盖层包括无机材料，并且覆盖层连续地覆盖基体的表面和颗粒的表面。 无机颗粒层具有由颗粒包围的空隙，或由颗粒和基体和覆盖层之一组成的间隙。

公开(公告)号：US11227981B2

公开(公告)日：2022-01-18

申请号：US16270137

申请日：2019-02-07

Applicant: NICHIA CORPORATION

Inventor： Yoshiki Sato ,  Kazuya Tamura

IPC: H01L33/56 ,  H01L33/62 ,  H01L33/60 ,  H01L23/544 ,  H01L33/50

Abstract: A method for manufacturing a light emitting device includes: a substrate preparation step for preparing a substrate having a first region on which a plurality of light emitting devices are formed, and a second region surrounding the first region; a reinforcing member forming step for forming a reinforcing member by applying a resin material on the second region and hardening the resin material; a mounting step for mounting a plurality of light emitting elements on the first region; a light-transmissive member placing step for forming a plurality of light-transmissive members respectively on the light emitting elements; a sealing member forming step for sealing the plurality of light emitting elements and the plurality of light-transmissive members using a sealing member; and a cutting step for cutting the substrate and the sealing member and separating into individual light emitting devices.

公开(公告)号：US11063192B2

公开(公告)日：2021-07-13

申请号：US15220681

申请日：2016-07-27

Applicant: NICHIA CORPORATION

Inventor： Hiroto Tamaki ,  Yoshiki Sato ,  Yoichi Bando

IPC: H01L33/52 ,  H01L33/50 ,  H01L33/46 ,  H01L33/60 ,  H01L33/56

Abstract: A light emitting device is provided. The light emitting device includes a light emitting element, a wavelength converting member, a light transmissive member, an adhesive member, and a light reflective member. The wavelength converting member has an upper surface and lateral surfaces, contains a fluorescent substance, and is placed on the light emitting element. The light transmissive member covers the upper surface of the wavelength converting member. The adhesive member is interposed between the light emitting element and the wavelength converting member, and covers the lateral surfaces of the wavelength converting member. The light reflective member covers the lateral surfaces of the wavelength converting member via the adhesive member.

公开(公告)号：US10586898B2

公开(公告)日：2020-03-10

申请号：US16146521

申请日：2018-09-28

Applicant: NICHIA CORPORATION

Inventor： Yoshiki Sato

IPC: H01L33/56 ,  H01L33/50 ,  H01L33/48 ,  H01L33/00 ,  H01L33/60 ,  H01L33/62 ,  H01L21/78 ,  H01L23/544

Abstract: A method of manufacturing a light emitting device in which a plurality of light emitting devices are formed collectively and then separated into individual light emitting devices, wherein each light emitting device includes a light emitting element, the method including, a base member providing step of providing a base member including: a wiring electrode to be connected to the light emitting elements, and an alignment mark, wherein the wiring electrode and the alignment mark are disposed on an upper surface of the base member; a mounting step of mounting each of the light emitting elements at a predetermined position; an alignment mark covering step of covering the alignment mark with a light-transmissive resin; a reflective resin forming step of forming a reflective resin surrounding the light emitting element so as to expose at least a part of a surface of the light-transmissive resin, the reflective resin reflecting light from the light emitting element; and a cutting step of recognizing the alignment mark through the exposed surface of the light-transmissive resin, and cutting the reflective resin and the base member with reference to the alignment mark to perform singulation into individual light emitting devices.