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    Light emitting device including external connection electrodes, and method thereof
    1.
    发明授权
    Light emitting device including external connection electrodes, and method thereof 有权

    公开(公告)号：US11165006B2

    公开(公告)日：2021-11-02

    申请号：US16582197

    申请日：2019-09-25

    Applicant: NICHIA CORPORATION

    Inventor： Toru Hashimoto ,  Yoichi Bando ,  Tadaaki Ikeda ,  Gensui Tamura

    IPC: H01L33/62 ,  H01L33/40 ,  H01L25/075

    Abstract: The method of manufacturing a light emitting device includes: providing a first intermediate body, the first intermediate body including a temporary substrate including a base and a pair of first wirings, and a light emitting element including a pair of element electrodes, each of the pair of element electrodes connected to a respective one of the first wirings via a respective one of a plurality of solders; removing a portion of the temporary substrate to form a second intermediate body having a second lower surface in which a lower surface of each of the element electrodes and a lower surface of each of the plurality of solders are located; and forming a pair of external connection electrodes on the second lower surface such that each of the pair of external connection electrodes cover a respective one of the element electrodes and a respective one of the plurality of solders.

    Method for manufacturing light emitting device using reinforcement member
    4.
    发明授权
    Method for manufacturing light emitting device using reinforcement member 有权

    公开(公告)号：US11757062B2

    公开(公告)日：2023-09-12

    申请号：US17016207

    申请日：2020-09-09

    Applicant: NICHIA CORPORATION

    Inventor： Yoichi Bando

    IPC: H01L21/00 ,  H01L33/00 ,  H01L25/075

    CPC classification number: H01L33/0095 ,  H01L25/0753 ,  H01L2933/005

    Abstract: A method for manufacturing a light emitting device includes: preparing a substrate having a first region and a second region surrounding the first region; mounting a plurality of light emitting elements in the first region; mounting a reinforcement member on the second region; forming and curing a sealing member in contact with the reinforcement member and with the light emitting elements, the sealing member having a lower rigidity than the reinforcement member; and cutting the substrate, the reinforcement member, and the sealing member to separate into individual light emitting devices each including one or more of the light emitting elements.

    Light emitting device and method for producing the same
    5.
    发明授权
    Light emitting device and method for producing the same 有权

    公开(公告)号：US10600942B2

    公开(公告)日：2020-03-24

    申请号：US16218292

    申请日：2018-12-12

    Applicant: NICHIA CORPORATION

    Inventor： Suguru Beppu ,  Yoichi Bando ,  Hiroto Tamaki ,  Takuya Nakabayashi

    IPC: H01L33/60 ,  H01L33/50 ,  H01L21/3213

    Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.

    Method of producing light emitting device
    6.
    发明授权
    Method of producing light emitting device 有权

    公开(公告)号：US09735326B2

    公开(公告)日：2017-08-15

    申请号：US15257067

    申请日：2016-09-06

    Applicant: NICHIA CORPORATION

    Inventor： Takeshi Ikegami ,  Suguru Beppu ,  Tatsuya Kanazawa ,  Yoichi Bando

    IPC: H01L33/58 ,  H01L33/56 ,  H01L33/62 ,  H01L33/48 ,  H01L33/50 ,  H01L27/15

    Abstract: A method of producing a light emitting device includes providing a light emitting element on a base member, the base member including an insulating member and a pair of connection terminals at least on an upper surface thereof. The connection terminals have an exposed portion exposed to outside, with the light emitting element electrically connected to the connection terminals. A covering member is disposed to cover at least a portion of the upper surface of the light emitting element, and a protective layer is disposed to cover at least a portion of the exposed portions of the connection terminals. The covering member is removed, and material from the upper surface side of the base member is supplied to dispose a light-transmissive member on the upper surface of the light emitting element. At least a portion of the light-transmissive member present on the protective layer is then removed.

    Light emitting module and planar light source
    7.
    发明授权
    Light emitting module and planar light source 有权

    公开(公告)号：US12001044B2

    公开(公告)日：2024-06-04

    申请号：US18046907

    申请日：2022-10-14

    Applicant: NICHIA CORPORATION

    Inventor： Takuya Nakabayashi ,  Daisuke Iwakura ,  Yoichi Bando ,  Yasunori Shinomiya ,  Satoshi Yoshinaga

    IPC: F21V8/00

    CPC classification number: G02B6/0045 ,  G02B6/0055

    Abstract: A light emitting module includes a light source, a light guide member, and first and second light reflective members. The light guide member is configured to transmit light from the light source. The light guide member having an upper surface and a lower surface opposite to the upper surface. The first light reflective member is arranged on a lower surface side of the light guide member. The first light reflective member has a lower surface. The first light reflective member includes a first resin, and a first reflective body having a refractive index higher than a refractive index of the first resin. The second light reflective member is arranged on a lower surface side of the first light reflective member. The second light reflective member includes a second resin, and a second reflective body having a refractive index lower than a refractive index of the second resin.

    Planar light source including light adjustment members
    8.
    发明授权
    Planar light source including light adjustment members 有权

    公开(公告)号：US11709312B2

    公开(公告)日：2023-07-25

    申请号：US17864066

    申请日：2022-07-13

    Applicant: NICHIA CORPORATION

    Inventor： Satoshi Yoshinaga ,  Takuya Nakabayashi ,  Yuki Shibutani ,  Yoichi Bando ,  Yasushi Okamoto

    IPC: F21V8/00

    CPC classification number: G02B6/0088 ,  G02B6/0021 ,  G02B6/0035 ,  G02B6/0055 ,  G02B6/0058 ,  G02B6/009 ,  G02B6/0066 ,  G02B6/0091

    Abstract: A planar light source includes: a light guide member, a light source including a light-emitting element and a first light adjustment member and being disposed in a first hole of the light guide member, a first light-transmissive member disposed in the first hole between a lateral surface of the light source and the light guide member and on the light source, and a second light adjustment member disposed on the first light-transmissive member. A transmittance of the first light-transmissive member is higher than a transmittance of the first light adjustment member and a transmittance of the second light adjustment member with respect to light emitted from the light source. The first light-transmissive member includes a first light-transmissive portion 1ocated between the first light adjustment member and the second light adjustment member, and a second light-transmissive portion 1ocated between the lateral surface of the light source and the light guide member.

    Light emitting device and method for producing the same
    9.
    发明授权
    Light emitting device and method for producing the same 有权

    公开(公告)号：US10193036B2

    公开(公告)日：2019-01-29

    申请号：US15879812

    申请日：2018-01-25

    Applicant: NICHIA CORPORATION

    Inventor： Suguru Beppu ,  Yoichi Bando ,  Hiroto Tamaki ,  Takuya Nakabayashi

    IPC: H01L33/60 ,  H01L33/50

    Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.

    Method of producing light emitting device
    10.
    发明授权
    Method of producing light emitting device 有权
    制造发光器件的方法

    公开(公告)号：US09461219B2

    公开(公告)日：2016-10-04

    申请号：US14718292

    申请日：2015-05-21

    Applicant: NICHIA CORPORATION

    Inventor： Takeshi Ikegami ,  Suguru Beppu ,  Tatsuya Kanazawa ,  Yoichi Bando

    IPC: H01L33/58 ,  H01L33/56 ,  H01L33/62 ,  H01L33/48 ,  H01L33/50

    CPC classification number: H01L33/58 ,  H01L27/156 ,  H01L33/486 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2924/18161 ,  H01L2933/0041 ,  H01L2933/0058

    Abstract: A method of producing a light emitting device includes providing a light emitting element on a base member, the base member including an insulating member and a pair of connection terminals at least on an upper surface thereof. The connection terminals have an exposed portion exposed to outside, with the light emitting element electrically connected to the connection terminals. A covering member is disposed to cover at least a portion of the upper surface of the light emitting element, and a protective layer is disposed to cover at least a portion of the exposed portions of the connection terminals. The covering member is removed, and material from the upper surface side of the base member is supplied to dispose a light-transmissive member on the upper surface of the light emitting element. At least a portion of the light-transmissive member present on the protective layer is then removed.

    Abstract translation: 一种制造发光器件的方法包括在基底构件上设置发光元件，所述基底构件至少在其上表面上包括绝缘构件和一对连接端子。 连接端子具有暴露于外部的暴露部分，其中发光元件电连接到连接端子。 覆盖构件设置成覆盖发光元件的上表面的至少一部分，并且设置保护层以覆盖连接端子的暴露部分的至少一部分。 除去覆盖部件，从基材的上表面侧供给材料，在发光元件的上表面设置透光性部件。 然后去除保护层上存在的透光部件的至少一部分。

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