公开(公告)号：US11888088B2

公开(公告)日：2024-01-30

申请号：US17830148

申请日：2022-06-01

Applicant: NICHIA CORPORATION

Inventor： Yoshiki Sato ,  Masaaki Katsumata ,  Shinichi Daikoku ,  Yoshikazu Matsuda ,  Ryuma Marume ,  Eiko Minato

IPC: H01L23/00 ,  H01L33/48 ,  H01L33/58 ,  H01L33/62 ,  H01L33/10 ,  H01L33/36 ,  H01L33/60 ,  H01L33/44 ,  H01L33/00 ,  H01L25/075

CPC classification number: H01L33/0095 ,  H01L25/0753 ,  H01L2933/0016 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A light-emitting device comprising a package comprising a light-emitting element comprising a first surface and a second surface opposite to the first surface, a first light-transmissive member arranged on the second surface of the light-emitting element, paired electrodes at the first surface of the light-emitting element, and a first covering member covering the light-emitting element such that the paired electrodes are exposed from the first covering member. The light-emitting device further comprises a light-guiding plate on which the package is placed, and a second covering member arranged on the light-guiding plate and covering laterally the package. The light-emitting device further comprises paired wirings continuously covering the paired electrodes exposed and the first covering members and being connected to the paired electrodes respectively. The paired wirings are formed by irradiation of laser light on a metal paste layer continuously covering the paired electrodes and the first covering member to remove the metal paste layer between the paired electrodes, the metal paste layer comprising a mixture of a resin and metal powder.

公开(公告)号：US10553768B2

公开(公告)日：2020-02-04

申请号：US16380601

申请日：2019-04-10

Applicant: NICHIA CORPORATION

Inventor： Yoshiki Sato

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/50 ,  H01L33/58 ,  F21V8/00 ,  H01L33/62

Abstract: A light-emitting device includes: a light-emitting element which includes an upper surface and a first lateral surface; a light-transmitting member disposed above the light-emitting element, the light-transmitting member having a substantially rectangular shape with a pair of first sides and a pair of second sides; a wavelength conversion member having a plurality of lateral surfaces; and a reflecting member. The light-transmitting member has a pair of second lateral surfaces each including a corresponding one of the first sides, and a pair of third lateral surfaces each including a corresponding one of the second sides. The reflecting member covers the first lateral surface, an entirety of the plurality of lateral surfaces of the wavelength conversion member, and an entirety of the pair of second lateral surfaces of the light-transmitting member. Each of the pair of third lateral surfaces of the light-transmitting member is partially exposed out of the reflecting member.

公开(公告)号：US10355173B2

公开(公告)日：2019-07-16

申请号：US15837434

申请日：2017-12-11

Applicant: NICHIA CORPORATION

Inventor： Yukiko Oshima ,  Yoshiki Sato ,  Toshiyuki Okazaki ,  Takayoshi Wakaki

IPC: H01L33/44 ,  H01L33/64 ,  H01L33/48

Abstract: A method for manufacturing a light emitting device includes: integrally molding a package and a lead, the package arranged to form at least part of an inner peripheral face of a recess portion in which the light emitting element is housed, the package including a base material and a plurality of particles, the base material including a resin, a coefficient of thermal expansion of the particles being different from a coefficient of thermal expansion of the base material; and covering the inner peripheral face of the recess portion with a cover film, the cover film having light transmissive and electrical insulation.

公开(公告)号：US09966513B2

公开(公告)日：2018-05-08

申请号：US14332274

申请日：2014-07-15

Applicant: Nichia Corporation

Inventor： Masakazu Sakamoto ,  Yoshiki Sato ,  Yasuo Kato

IPC: F21V21/00 ,  H01L33/60 ,  H01L33/44 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L33/44 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01004

Abstract: A light emitting device includes a light emitting element; a light reflecting member having an Ag-containing layer on a surface thereof; and a protective film having a thickness of 1 nm to 300 nm and covering a surface of the light reflecting member, the protective film covering a surface of the light reflecting member, in which the Ag-containing layer has a thickness of 0.1 μm to 0.5 μm.

公开(公告)号：US09882103B2

公开(公告)日：2018-01-30

申请号：US15439948

申请日：2017-02-23

Applicant: NICHIA CORPORATION

Inventor： Yoshiki Sato

IPC: H01L33/54 ,  H01L33/56 ,  H01L33/44 ,  H01L33/50

CPC classification number: H01L33/56 ,  H01L33/44 ,  H01L33/507 ,  H01L33/54 ,  H01L2933/0041 ,  H01L2933/005

Abstract: A method for producing a light emitting device includes spraying a resin mixture onto a light emitting element using a pulse spraying method to deposit the resin mixture on the light emitting element. The resin mixture includes a thixotropy imparting agent. The resin mixture is cured to form a light transmissive member via which light emitted from the light emitting element is to transmit to an outside of the light emitting device.

公开(公告)号：US09871170B2

公开(公告)日：2018-01-16

申请号：US14299065

申请日：2014-06-09

Applicant: NICHIA CORPORATION

Inventor： Yukiko Oshima ,  Yoshiki Sato ,  Toshiyuki Okazaki ,  Takayoshi Wakaki

IPC: H01L33/44 ,  H01L33/64 ,  H01L33/48

CPC classification number: H01L33/44 ,  H01L33/486 ,  H01L33/644 ,  H01L2224/48247 ,  H01L2224/48257 ,  Y10T29/49002

Abstract: A light emitting device has a light emitting element, a package, a lead, and a cover film. The package is arranged to form at least part of an inner peripheral face of a recess portion. The light emitting element is housed in the recess portion. The lead is disposed on a bottom face of the recess portion. The lead is electrically connected to the light emitting element. The cover film is arranged to cover the inner peripheral face of the recess portion. The cover film has light transmissive and electrical insulation. The package includes a base material and a plurality of particles. The base material includes a resin. A coefficient of thermal expansion of the particles is different from a coefficient of thermal expansion of the base material. The particles are disposed at least near the inner peripheral face of the recess portion.

公开(公告)号：US09835310B2

公开(公告)日：2017-12-05

申请号：US14590520

申请日：2015-01-06

Applicant: NICHIA CORPORATION

Inventor： Hiroto Tamaki ,  Takayoshi Wakaki ,  Tadao Hayashi ,  Yoshiki Sato ,  Daisuke Oyamatsu ,  Takafumi Sugiyama ,  Takao Kosugi

IPC: H01L33/50 ,  F21V9/16 ,  B05D5/06 ,  F21V7/00 ,  H01L31/055 ,  H05B33/12 ,  C23C16/455 ,  F21V13/08 ,  F21K9/60 ,  F21Y115/30 ,  F21Y115/10

CPC classification number: F21V9/30 ,  B05D5/06 ,  C23C16/45525 ,  F21K9/60 ,  F21V7/00 ,  F21V13/08 ,  F21Y2115/10 ,  F21Y2115/30 ,  H01L31/055 ,  H01L33/502 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H05B33/12 ,  Y02E10/52 ,  Y10T428/24364 ,  Y10T428/24372 ,  Y10T428/24413 ,  Y10T428/24421 ,  H01L2924/00014

Abstract: A wave-length conversion inorganic member can includes a base body and an inorganic particle layer on the base body. The inorganic particle layer can include particles of an inorganic wave-length conversion substance which is configured to absorb light of a first wave-length and to emit light of a second wave-length different from the first wave-length. The inorganic particle layer can include an agglomerate of a plurality of the particles. Each of the plurality of the particles are in contact with at least one of the other particles or the base body. A cover layer comprises an inorganic material, and the cover layer continuously covers a surface of the base body and surfaces of the particles. The inorganic particle layer has an interstice enclosed by the particles, or by the particles and one of the base body and the cover layer.

公开(公告)号：US11380817B2

公开(公告)日：2022-07-05

申请号：US16774614

申请日：2020-01-28

Applicant: NICHIA CORPORATION

Inventor： Yoshiki Sato ,  Masaaki Katsumata ,  Shinichi Daikoku ,  Yoshikazu Matsuda ,  Ryuma Marume ,  Eiko Minato

IPC: H01L33/00 ,  H01L25/075 ,  H01L23/00 ,  H01L33/48 ,  H01L33/58 ,  H01L33/62 ,  H01L33/10 ,  H01L33/36 ,  H01L33/44 ,  H01L33/60

Abstract: A method for manufacturing a light-emitting device includes preparing an intermediate product; the product includes a light-emitting element provided with paired electrodes at a first surface and a first covering member covering the light-emitting element such that portions of surfaces of the paired electrodes are exposed. A metal paste layer is formed, continuously covering the exposed portion of the paired electrodes and the first covering member. Paired wirings are formed for preventing the paired electrodes from being short-circuited. The metal paste layer on the paired electrodes and the metal paste layer on the first covering member are irradiated with laser light to remove the metal paste layer between the paired electrodes and a portion of the metal paste layer on the first covering member.

公开(公告)号：US10263166B2

公开(公告)日：2019-04-16

申请号：US15943432

申请日：2018-04-02

Applicant: NICHIA CORPORATION

Inventor： Masakazu Sakamoto ,  Yoshiki Sato ,  Yasuo Kato

IPC: H01L33/44 ,  H01L33/60 ,  H01L33/62

Abstract: A light emitting device includes a light emitting element; a light reflecting member having an Ag-containing layer on a surface thereof; and a protective film having a thickness of 1 nm to 300 nm and covering a surface of the light reflecting member, the protective film covering a surface of the light reflecting member, in which the Ag-containing layer has a thickness of 0.1 μm to 0.5 μm.

公开(公告)号：US09614135B2

公开(公告)日：2017-04-04

申请号：US15169747

申请日：2016-06-01

Applicant: NICHIA CORPORATION

Inventor： Yoshiki Sato

IPC: H01L33/54 ,  H01L33/56 ,  H01L33/44 ,  H01L33/50

CPC classification number: H01L33/56 ,  H01L33/44 ,  H01L33/507 ,  H01L33/54 ,  H01L2933/0041 ,  H01L2933/005

Abstract: A method for producing a light emitting device includes: spraying a resin mixture onto a light emitting element to deposit the resin mixture on the light emitting element, the resin mixture including a thixotropy imparting agent; and curing the resin mixture to form an outermost layer of a light transmissive member and to have an outermost surface having protrusions and recesses on the outermost layer, light emitted from the light emitting element being capable to transmit to an outside of the light emitting device via the light transmissive member.