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公开(公告)号：US11557624B2
公开(公告)日：2023-01-17
申请号：US16953525
申请日：2020-11-20
申请人： NIKON CORPORATION
发明人： Shigeru Matsumoto
IPC分类号： H01L27/146 , H04N5/3745 , H04N5/361 , H04N5/378 , H04N5/357 , H04N5/369 , H01L31/02
摘要： An image sensor includes: a pixel substrate that includes a plurality of pixels each having a photoelectric conversion unit that generates an electric charge through photoelectric conversion executed on light having entered therein and an output unit that generates a signal based upon the electric charge and outputs the signal; and an arithmetic operation substrate that is laminated on the pixel substrate and includes an operation unit that generates a corrected signal by using a reset signal generated after the electric charge in the output unit is reset and a photoelectric conversion signal generated based upon an electric charge generated in the photoelectric conversion unit and executes an arithmetic operation by using corrected signals each generated in correspondence to one of the pixels.
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公开(公告)号：US11418731B2
公开(公告)日：2022-08-16
申请号：US16475329
申请日：2018-01-31
申请人： NIKON CORPORATION
发明人： Shigeru Matsumoto
摘要： An image sensor includes a pixel, the pixel has: a first photoelectric conversion unit and a second photoelectric conversion unit that photoelectrically convert light to generate a charge; an accumulation unit that accumulates at least one of the charge generated by the first photoelectric conversion unit and the charge generated by the second photoelectric conversion unit; a first output unit and a second output unit that output a signal based on the charge accumulated in the accumulation unit; and an adjustment unit that adjusts a capacitance of the accumulation unit if a signal based on the charges generated by the first photoelectric conversion unit and the second photoelectric conversion unit is output from the first output unit.
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公开(公告)号：US20190034748A1
公开(公告)日：2019-01-31
申请号：US16145875
申请日：2018-09-28
申请人： NIKON CORPORATION
摘要： A feature extracting element including: a light-receiving substrate where a plurality of light-receiving elements for photoelectrically converting received light are two-dimensionally arrayed; and one or more other substrates that are laminated on the light-receiving substrate, wherein the other substrate has: a convolution processor which has a plurality of multiplying circuits that are correspondingly provided per the light-receiving element or per a block that is configured of a plurality of the light-receiving elements, and performs convolution operation on signals that are output from the plurality of light-receiving elements using the plurality of multiplying circuits; a pooling processing unit to sample a signal that is output from the convolution processor, based on a predetermined condition; and a connection wiring to pass the sampled signal to the plurality of multiplying circuits.
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公开(公告)号：US11889214B2
公开(公告)日：2024-01-30
申请号：US17043160
申请日：2019-03-29
申请人： NIKON CORPORATION
发明人： Daiki Ogura , Masahiro Juen , Tomoki Hirata , Shigeru Matsumoto
IPC分类号： H04N25/75 , H01L27/146 , H04N25/704 , H04N25/772
CPC分类号： H04N25/75 , H01L27/14612 , H01L27/14621 , H01L27/14623 , H01L27/14636 , H04N25/704 , H04N25/772
摘要： An image sensor, includes: a first pixel and a second pixel, in a first direction, each including a first photoelectric conversion unit and a light-shielding unit and outputting a signal; a third pixel and a fourth pixel, in the first direction, each including a second photoelectric conversion unit and outputting a signal; a first signal line and a second signal line, in the first direction, each of which can be connected to the first pixel, the second pixel, the third pixel and the fourth pixel; and a control unit that performs a first control in which a signal of the first pixel is output to the first signal line and a signal of the second pixel is output to the second signal line, and a second control in which a signal of the third pixel and a signal of the fourth pixel are output to the first signal line.
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公开(公告)号：US11682690B2
公开(公告)日：2023-06-20
申请号：US17484535
申请日：2021-09-24
申请人： NIKON CORPORATION
发明人： Shigeru Matsumoto , Toru Takagi
IPC分类号： H01L27/146 , H04N25/75 , H04N25/76 , H04N25/79 , H04N25/771 , H04N25/772
CPC分类号： H01L27/14643 , H01L27/146 , H01L27/1464 , H01L27/14603 , H01L27/14627 , H01L27/14636 , H01L27/14687 , H04N25/75 , H04N25/76 , H04N25/771 , H04N25/772 , H04N25/79
摘要： A first circuit layer including a first semiconductor substrate with photoelectric conversion unit that photoelectrically converts incident light and generates charge, and a first wiring layer with wiring that reads out signal based upon charge generated by the photoelectric conversion unit; second circuit layer including a second wiring layer with wiring connected to the wiring of the first wiring layer, and a second semiconductor substrate with a through electrode connected to the wiring of the second wiring layer; third circuit layer including a third semiconductor substrate with a through electrode connected to the through electrode of the second circuit layer, and third wiring layer with wiring connected to the through electrode of the third semiconductor substrate; and a fourth circuit layer including a fourth wiring layer with wiring connected to the wiring of the third wiring layer, and fourth semiconductor substrate connected to the wiring of the fourth wiring layer.
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16.发明授权公开(公告)号：US11108978B2
公开(公告)日：2021-08-31
申请号：US16475261
申请日：2018-01-31
申请人： NIKON CORPORATION
发明人： Shigeru Matsumoto
摘要： An image sensor includes: a first pixel having a first photoelectric conversion unit that photoelectrically converts light to generate a charge, a first accumulation unit that accumulates the charge generated by the first photoelectric conversion unit, and a first output unit that is connected to the first accumulation unit; a second pixel having a second photoelectric conversion unit that photoelectrically converts light to generate a charge, a second accumulation unit that accumulates the charge generated by the second photoelectric conversion unit, and a second output unit that is connected to and disconnected from the second accumulation unit via a second connection unit; and an adjustment unit that adjusts capacitances of the first accumulation unit and the second accumulation unit if a signal based on the charges generated by the first photoelectric conversion unit and the second photoelectric conversion unit is output from the first output unit.
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公开(公告)号：US10904471B2
公开(公告)日：2021-01-26
申请号：US16145875
申请日：2018-09-28
申请人： NIKON CORPORATION
IPC分类号： H04N5/369 , G06N3/04 , H04N5/3745 , H01L27/146 , G06N3/063 , G06K9/20 , G06K9/46 , G06K9/78 , H04N5/378
摘要： A feature extracting element including: a light-receiving substrate where a plurality of light-receiving elements for photoelectrically converting received light are two-dimensionally arrayed; and one or more other substrates that are laminated on the light-receiving substrate, wherein the other substrate has: a convolution processor which has a plurality of multiplying circuits that are correspondingly provided per the light-receiving element or per a block that is configured of a plurality of the light-receiving elements, and performs convolution operation on signals that are output from the plurality of light-receiving elements using the plurality of multiplying circuits; a pooling processing unit to sample a signal that is output from the convolution processor, based on a predetermined condition; and a connection wiring to pass the sampled signal to the plurality of multiplying circuits.
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公开(公告)号：US10720465B2
公开(公告)日：2020-07-21
申请号：US16084908
申请日：2017-02-28
申请人： NIKON CORPORATION
发明人： Shigeru Matsumoto , Toru Takagi
IPC分类号： H01L27/146 , H04N5/374 , H04N5/3745 , H04N5/369 , H04N5/378
摘要： A first circuit layer including a first semiconductor substrate with photoelectric conversion unit that photoelectrically converts incident light and generates charge, and a first wiring layer with wiring that reads out signal based upon charge generated by the photoelectric conversion unit; second circuit layer including a second wiring layer with wiring connected to the wiring of the first wiring layer, and a second semiconductor substrate with a through electrode connected to the wiring of the second wiring layer; third circuit layer including a third semiconductor substrate with a through electrode connected to the through electrode of the second circuit layer, and third wiring layer with wiring connected to the through electrode of the third semiconductor substrate; and a fourth circuit layer including a fourth wiring layer with wiring connected to the wiring of the third wiring layer, and fourth semiconductor substrate connected to the wiring of the fourth wiring layer.
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