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公开(公告)号:US11978757B2
公开(公告)日:2024-05-07
申请号:US18080865
申请日:2022-12-14
申请人: NIKON CORPORATION
发明人: Shigeru Matsumoto
IPC分类号: H01L27/146 , H04N25/616 , H04N25/63 , H04N25/75 , H04N25/77 , H04N25/771 , H04N25/772 , H04N25/79 , H01L31/02
CPC分类号: H01L27/1464 , H01L27/146 , H01L27/14605 , H01L27/14621 , H01L27/14629 , H01L27/14643 , H04N25/616 , H04N25/63 , H04N25/75 , H04N25/77 , H04N25/771 , H04N25/772 , H04N25/79 , H01L31/02005
摘要: An image sensor includes: a pixel substrate that includes a plurality of pixels each having a photoelectric conversion unit that generates an electric charge through photoelectric conversion executed on light having entered therein and an output unit that generates a signal based upon the electric charge and outputs the signal; and an arithmetic operation substrate that is laminated on the pixel substrate and includes an operation unit that generates a corrected signal by using a reset signal generated after the electric charge in the output unit is reset and a photoelectric conversion signal generated based upon an electric charge generated in the photoelectric conversion unit and executes an arithmetic operation by using corrected signals each generated in correspondence to one of the pixels.
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公开(公告)号:US11152420B2
公开(公告)日:2021-10-19
申请号:US16861592
申请日:2020-04-29
申请人: NIKON CORPORATION
发明人: Shigeru Matsumoto , Toru Takagi
IPC分类号: H01L27/146 , H04N5/374 , H04N5/3745 , H04N5/369 , H04N5/378
摘要: A first circuit layer including a first semiconductor substrate with photoelectric conversion unit that photoelectrically converts incident light and generates charge, and a first wiring layer with wiring that reads out signal based upon charge generated by the photoelectric conversion unit; second circuit layer including a second wiring layer with wiring connected to the wiring of the first wiring layer, and a second semiconductor substrate with a through electrode connected to the wiring of the second wiring layer; third circuit layer including a third semiconductor substrate with a through electrode connected to the through electrode of the second circuit layer, and third wiring layer with wiring connected to the through electrode of the third semiconductor substrate; and a fourth circuit layer including a fourth wiring layer with wiring connected to the wiring of the third wiring layer, and fourth semiconductor substrate connected to the wiring of the fourth wiring layer.
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公开(公告)号:US12040342B2
公开(公告)日:2024-07-16
申请号:US18130940
申请日:2023-04-05
申请人: NIKON CORPORATION
发明人: Shigeru Matsumoto
IPC分类号: H01L27/146 , H01L23/48 , H03M1/56 , H04N25/75 , H04N25/76 , H04N25/771 , H04N25/772 , H04N25/79
CPC分类号: H01L27/14636 , H01L23/481 , H01L27/146 , H01L27/14621 , H01L27/14627 , H03M1/56 , H04N25/75 , H04N25/76 , H04N25/771 , H04N25/772 , H04N25/79
摘要: An image sensor includes: (A) a first circuit layer provided with a comparison unit that (i) compares a first signal caused by an electric charge generated by a photoelectric conversion unit that photoelectrically converts light to generate the electric charge with a first reference signal, and (ii) compares a second signal for correcting the first signal with a second reference signal; and (B) a second circuit layer provided with (i) a first storage unit that stores a third signal that is based on a result of the comparison between the first signal and the first reference signal, and (ii) a second storage unit that stores a fourth signal that is based on a result of the comparison between the second signal and the second reference signal.
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公开(公告)号:US12010445B2
公开(公告)日:2024-06-11
申请号:US17442911
申请日:2020-03-27
申请人: NIKON CORPORATION
发明人: Shigeru Matsumoto
IPC分类号: H04N25/75 , H04N25/704
CPC分类号: H04N25/75 , H04N25/704
摘要: An imaging element includes a first photoelectric conversion unit and a second photoelectric conversion unit that generates electric charges by photoelectric conversion, a first comparison unit that outputs a first signal based on a result of comparing a signal based on electric charges generated by the first photoelectric conversion unit and a reference signal, a first storage unit that stores a signal based on the first signal that is output by the first comparison unit, a second comparison unit that outputs a second signal based on a result of comparing a signal based on electric charges generated by the second photoelectric conversion unit and a reference signal, a second storage unit that stores a signal based on the second signal that is output from the second comparison unit, and a connection unit that connects or disconnect the first comparison unit and the second storage unit.
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公开(公告)号:US10998367B2
公开(公告)日:2021-05-04
申请号:US16082901
申请日:2017-02-27
申请人: NIKON CORPORATION
发明人: Shigeru Matsumoto
IPC分类号: H04N5/378 , H01L27/146 , H03M1/56 , H04N5/369 , H01L23/48 , H04N5/3745 , H04N5/374
摘要: An image sensor includes a photoelectric conversion unit that photoelectrically converts incident light to generate an electric charge; and an AD conversion unit having a comparison unit that compares a signal caused by an electric charge generated by the photoelectric conversion unit with a reference signal, a first storage unit in a first circuit layer, the first storage unit storing a first signal based on a signal output from the comparison unit, and a second storage unit in a second circuit layer that is stacked on the first circuit layer, the second storage unit storing a second signal based on the signal output from the comparison unit.
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公开(公告)号:US10680031B2
公开(公告)日:2020-06-09
申请号:US16084908
申请日:2017-02-28
申请人: NIKON CORPORATION
发明人: Shigeru Matsumoto , Toru Takagi
IPC分类号: H01L27/146 , H04N5/374 , H04N5/3745 , H04N5/369 , H04N5/378
摘要: A first circuit layer including a first semiconductor substrate with photoelectric conversion unit that photoelectrically converts incident light and generates charge, and a first wiring layer with wiring that reads out signal based upon charge generated by the photoelectric conversion unit; second circuit layer including a second wiring layer with wiring connected to the wiring of the first wiring layer, and a second semiconductor substrate with a through electrode connected to the wiring of the second wiring layer; third circuit layer including a third semiconductor substrate with a through electrode connected to the through electrode of the second circuit layer, and third wiring layer with wiring connected to the through electrode of the third semiconductor substrate; and a fourth circuit layer including a fourth wiring layer with wiring connected to the wiring of the third wiring layer, and fourth semiconductor substrate connected to the wiring of the fourth wiring layer.
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公开(公告)号:US11917310B2
公开(公告)日:2024-02-27
申请号:US17381444
申请日:2021-07-21
申请人: NIKON CORPORATION
发明人: Shigeru Matsumoto
摘要: An image sensor includes: a first pixel having a first photoelectric conversion unit that photoelectrically converts light to generate a charge, a first accumulation unit that accumulates the charge generated by the first photoelectric conversion unit, and a first output unit that is connected to the first accumulation unit; a second pixel having a second photoelectric conversion unit that photoelectrically converts light to generate a charge, a second accumulation unit that accumulates the charge generated by the second photoelectric conversion unit, and a second output unit that is connected to and disconnected from the second accumulation unit via a second connection unit; and an adjustment unit that adjusts capacitances of the first accumulation unit and the second accumulation unit if a signal based on the charges generated by the first photoelectric conversion unit and the second photoelectric conversion unit is output from the first output unit.
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公开(公告)号:US11791363B2
公开(公告)日:2023-10-17
申请号:US17125415
申请日:2020-12-17
申请人: NIKON CORPORATION
IPC分类号: H04N5/369 , H01L27/146 , G06N3/045 , G06N3/048 , G06N3/065 , H04N25/79 , H04N25/70 , H04N25/75 , H04N25/77 , H04N25/772
CPC分类号: H01L27/14636 , G06N3/045 , G06N3/048 , G06N3/065 , H01L27/14634 , H04N25/70 , H04N25/75 , H04N25/77 , H04N25/772 , H04N25/79
摘要: An element includes a plurality of light-receiving elements to photoelectrically convert light received from an object, a convolution processing unit to perform convolution operation on signals that are output from the plurality of light-receiving elements, and a pooling processing unit to sample a signal that is output from the convolution processing unit, based on a predetermined condition. The convolution operation of the convolution processing unit and the sampling of the pooling processing unit are repeated.
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公开(公告)号:US11177312B2
公开(公告)日:2021-11-16
申请号:US16861592
申请日:2020-04-29
申请人: NIKON CORPORATION
发明人: Shigeru Matsumoto , Toru Takagi
IPC分类号: H01L27/146 , H04N5/374 , H04N5/3745 , H04N5/369 , H04N5/378
摘要: A first circuit layer including a first semiconductor substrate with photoelectric conversion unit that photoelectrically converts incident light and generates charge, and a first wiring layer with wiring that reads out signal based upon charge generated by the photoelectric conversion unit; second circuit layer including a second wiring layer with wiring connected to the wiring of the first wiring layer, and a second semiconductor substrate with a through electrode connected to the wiring of the second wiring layer; third circuit layer including a third semiconductor substrate with a through electrode connected to the through electrode of the second circuit layer, and third wiring layer with wiring connected to the through electrode of the third semiconductor substrate; and a fourth circuit layer including a fourth wiring layer with wiring connected to the wiring of the third wiring layer, and fourth semiconductor substrate connected to the wiring of the fourth wiring layer.
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公开(公告)号:US11652128B2
公开(公告)日:2023-05-16
申请号:US17191852
申请日:2021-03-04
申请人: NIKON CORPORATION
发明人: Shigeru Matsumoto
IPC分类号: H01L27/146 , H03M1/56 , H01L23/48 , H04N25/75 , H04N25/76 , H04N25/79 , H04N25/771 , H04N25/772
CPC分类号: H01L27/14636 , H01L23/481 , H01L27/146 , H01L27/14621 , H01L27/14627 , H03M1/56 , H04N25/75 , H04N25/76 , H04N25/771 , H04N25/772 , H04N25/79
摘要: An image sensor includes a photoelectric conversion unit that photoelectrically converts incident light to generate an electric charge; and an AD conversion unit having a comparison unit that compares a signal caused by an electric charge generated by the photoelectric conversion unit with a reference signal, a first storage unit in a first circuit layer, the first storage unit storing a first signal based on a signal output from the comparison unit, and a second storage unit in a second circuit layer that is stacked on the first circuit layer, the second storage unit storing a second signal based on the signal output from the comparison unit.
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