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16 条记录 (耗时 0.012 秒)

    Distributed fan control
    11.
    发明授权
    Distributed fan control 有权
    分布式风扇控制

    公开(公告)号：US09213379B2

    公开(公告)日：2015-12-15

    申请号：US14056781

    申请日：2013-10-17

    申请人： NVIDIA Corporation

    发明人： Kevin Wong ,  Thomas Dewey ,  Craig Ross ,  Andrew Bell ,  John Lam ,  Gabriele Gorla

    IPC分类号： G06F1/20 ,  F04D27/00 ,  F04D25/06

    CPC分类号： G06F1/206 ,  F04D25/0613 ,  F04D27/004

    摘要： A device for processing graphics data may include a plurality of graphics processing units. The device may include a fan to dissipate thermal energy generated during the operation of the plurality of graphics processing units. Each of the plurality of graphics processing units may generate a pulse width modulated signal to control the speed of the fan. The device may include one or more monitoring units configured to monitor a signal controlling the speed of the fan. One or more of the plurality of pulse width modulated signals may be adjusted based on the monitored signal. One or more of the plurality of pulse width modulated signals may be adjusted such that a signal controlling the fan maintains a desired duty cycle.

    摘要翻译： 用于处理图形数据的设备可以包括多个图形处理单元。 该装置可以包括风扇以消散在多个图形处理单元的操作期间产生的热能。 多个图形处理单元中的每一个可以产生脉宽调制信号来控制风扇的速度。 设备可以包括被配置为监视控制风扇速度的信号的一个或多个监视单元。 可以基于所监视的信号来调整多个脉冲宽度调制信号中的一个或多个。 可以调整多个脉冲宽度调制信号中的一个或多个，使得控制风扇的信号保持期望的占空比。

    Blow-through axial fan for a graphics processing unit
    15.
    发明授权
    Blow-through axial fan for a graphics processing unit 有权

    公开(公告)号：US11681340B2

    公开(公告)日：2023-06-20

    申请号：US17121565

    申请日：2020-12-14

    申请人： NVIDIA CORPORATION

    发明人： David Haley ,  Xiang Sun ,  Gabriele Gorla ,  Andrew Bell ,  Boris Landwehr

    IPC分类号： G06F1/20 ,  H05K7/20

    CPC分类号： G06F1/20 ,  H05K7/2039 ,  H05K7/20154 ,  G06F2200/201

    摘要： A graphics subsystem includes a printed circuit board (PCB), a set of one or more fans, and a heat sink. A graphics processing unit (GPU) is integrated into the PCB. The PCB is shortened to occupy a portion of the width of the graphics subsystem. The heat sink is coupled to the PCB and/or GPU and configured to extend beyond an edge of the PCB, thereby occupying a larger portion of the width of the graphics subsystem compared to the PCB. A first fan is disposed partially or fully beyond the edge of the PCB and is configured to direct air through the portion of the heat sink that extends beyond the edge of the PCB, along a first airflow path, and out of the graphics subsystem. A second fan is configured to direct air through the heat sink, along a second airflow path, towards the GPU.