SYSTEMS AND METHODS FOR INTELLIGENTLY DESIGNING AND RECONFIGURING DATA CENTERS

    公开(公告)号:US20250005214A1

    公开(公告)日:2025-01-02

    申请号:US18215290

    申请日:2023-06-28

    Abstract: Systems, computer program products, and methods are described herein for intelligent intelligently designing and reconfiguring data centers. For example, a system may be an artificial-intelligence-based system for designing and reconfiguring data centers based on user inquiries. The system may receive inquiries from users requesting a design for a data center having particular performance characteristics (e.g., selected performance characteristics), changes to an existing design of a data center, information about a data center, and/or the like. The inquiries may be text-based or audio and in the form of natural language questions or commands. The system may use two machine learning models, namely a knowledge base model and a ranking model. The system may use the knowledge base model to determine solutions to user inquiries and then use the ranking model to determine rankings for the solutions.

    DATA PACKET IN DATA PROCESSING UNIT ASSISTED QUANTUM METROLOGY

    公开(公告)号:US20240354618A1

    公开(公告)日:2024-10-24

    申请号:US18137758

    申请日:2023-04-21

    CPC classification number: G06N10/40

    Abstract: Systems, devices, and methods are described herein that generate data packets in DPU assisted quantum metrology. An example quantum device includes a first quantum measurement module operably coupled with a first quantum system. The first quantum measurement module applies one or more measurements to the first quantum system and obtains information associated with the first quantum system based on the one or more measurements. The quantum device includes a first DPU operably coupled with the first quantum measurement module. The first DPU generates a data packet including time-related quantum data based upon at least one of the one or more measurements by the first quantum measurement module or the obtained information associated with the first quantum system.

    COOLING DISTRIBUTION UNITS AND IN-RACK THERMAL MANAGEMENT SYSTEMS

    公开(公告)号:US20250120052A1

    公开(公告)日:2025-04-10

    申请号:US18377017

    申请日:2023-10-05

    Abstract: Devices, apparatuses, and systems for thermal management in networking and computing systems are provided. An example in-rack thermal management system includes a cooling distribution unit (CDU) that includes a housing that defines a fluid inlet and a fluid outlet, thermal management components supported by the housing, and direct mechanical connections coupled with the fluid inlet and the fluid outlet. The in-rack thermal management system includes a fluid distribution system that includes a primary fluid channel directly coupled with the direct mechanical connection of the fluid inlet, and a secondary fluid channel directly coupled with the direct mechanical connection of the fluid outlet. In operation, the thermal management components dissipate heat of a fluid received by the CDU via the fluid inlet. The direct mechanical connections directly interface with the fluid distribution system to provide fluid communication between the CDU and the fluid distribution system to maximize dimensions of the housing.

    COMPUTING MODULES WITH HYBRID THERMAL MANAGEMENT

    公开(公告)号:US20250098108A1

    公开(公告)日:2025-03-20

    申请号:US18369917

    申请日:2023-09-19

    Abstract: Devices, apparatuses, systems, and methods are provided for hybrid thermal management in computing modules. An example computing module includes a first computing component having a first operating temperature and a second computing component having a second operating temperature. The first operating temperature is greater than the second operating temperature. The example computing module further includes a hybrid thermal management system including a cooling delivery device configured to receive a cooling fluid. The cooling delivery device defines a first section configured to dissipate heat generated by the first computing component and a second section configured to dissipate heat generated by the second computing component. The first section of the cooling delivery device may be fluidically isolated from the second section of the cooling delivery device or the second section may be in fluid communication with the first section.

    SECURE ELECTRONIC COMPONENT ASSEMBLY

    公开(公告)号:US20250081349A1

    公开(公告)日:2025-03-06

    申请号:US18242290

    申请日:2023-09-05

    Abstract: A secure electronic component assembly is described herein for ensuring the physical integrity of an integrated circuit (IC). The secure electronic component assembly may comprise a printed circuit board (PCB), an integrated circuit (IC) mounted on the PCB, and an underfill material disposed between the IC and the PCB. The underfill material comprises a detection agent that is configured to change a state of the IC in response to exposure to an external environment, wherein the change in the state of the IC is indicative of a tamper condition.

    Power arrangement and cooling system for electronic devices

    公开(公告)号:US12245360B2

    公开(公告)日:2025-03-04

    申请号:US17879620

    申请日:2022-08-02

    Abstract: A power arrangement and cooling system for electronic devices includes a processing unit electrically interconnected and disposed to a first side of a printed circuit board and a power converter electrically interconnected and disposed on a second side of the printed circuit board. The power converter includes a thermally conductive material layer that transfers heat generated by the power converter during operation away from the power converter toward a heatsink that is disposed adjacent the second side of the printed circuit board. Heat generated by the processing unit is absorbed by a heatsink disposed adjacent the first side of the printed circuit board. Power for the processing unit is provided, by the power converter, through a thickness of the printed circuit board.

    ARTIFICIAL-INTELLIGENCE-BASED MANUFACTURING
    17.
    发明公开

    公开(公告)号:US20240264588A1

    公开(公告)日:2024-08-08

    申请号:US18113217

    申请日:2023-02-23

    CPC classification number: G05B19/41885 G05B19/41805

    Abstract: Methods are described herein for artificial-intelligence-based manufacturing. The present invention may include performing an initial step in a series of steps to achieve a target value of an attribute, where the series of steps is for manufacturing an object, and, after performing the initial step, measuring an actual value of the attribute achieved by the initial step. The method may include, for each subsequent step in the series, providing actual values of attributes achieved by preceding steps in the series to a respective machine learning model to determine a respective target value for a respective attribute to be achieved by the respective step. The method may also include, for each step, performing the respective step to achieve the respective target value of the respective attribute and, after performing the respective step, measuring a respective actual value of the respective attribute achieved by the respective step.

    TRAINING MAINTENANCE SCENARIOS THOUGH ENVIRONMENT SIMULATION

    公开(公告)号:US20240061388A1

    公开(公告)日:2024-02-22

    申请号:US17888834

    申请日:2022-08-16

    CPC classification number: G05B17/02 G05B23/0283

    Abstract: A virtual representation of a physical environment can be generated through simulation, which can include one or more virtual agents to represent robots, or at least semi-automated devices, that can operate and perform various tasks in the physical environment. Various component failures, or other potential problems, can be simulated that can be analyzed by one or more deep learning models associated with the virtual agents. These deep learning models can attempt to diagnose the simulated problem, as well as determine one or more potential solutions. The virtual agents can help to gather information for these determinations, as well as to perform tasks for these potential solutions. Once these deep learning models are trained in this simulated environment, these models can be used by one or more robots to perform tasks that may relate to maintenance or operation of a physical environment.

    Data center job scheduling using machine learning

    公开(公告)号:US12206748B2

    公开(公告)日:2025-01-21

    申请号:US17958139

    申请日:2022-09-30

    Abstract: A method includes receiving, using a processing device, a first condition associated with an operation at a data center, where the operation at the data center pertains to a first location at the data center, the first location corresponding to a first parameter value. The method further includes providing the first condition as an input to a machine learning model. The method also includes performing one or more reinforcement learning techniques using the machine learning model to cause the machine learning model to output an indication of a final location associated with the operation, where the final location corresponds to a final parameter value that is closer to a target than the first parameter value corresponding to the first location at the data center.

    WEAK MEASUREMENT BASED SYSTEMS AND DEVICES FOR QUANTUM METROLOGY

    公开(公告)号:US20240353238A1

    公开(公告)日:2024-10-24

    申请号:US18137737

    申请日:2023-04-21

    CPC classification number: G01D3/036

    Abstract: Systems, devices, and methods are described herein that are employed in quantum metrology. An example quantum device includes a weak measurement module operably coupled with a quantum system. The weak measurement module is configured to apply one or more measurements to the quantum system and obtain information associated with the quantum system based on the one or more measurements. A strength of the one or more measurements by the weak measurement module is configured to prevent a wave function collapse associated with the quantum system. The quantum device further includes a data processing unit (DPU) operably coupled with the weak measurement module that performs one or more operations on the obtained information associated with the quantum system and provides improved time synchronization and networking features.

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