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公开(公告)号:US20250005214A1
公开(公告)日:2025-01-02
申请号:US18215290
申请日:2023-06-28
Applicant: Nvidia Corporation
Inventor: Siddha Ganju , Aastha Jhunjhunwala , Elad Mentovich , Ryan Albright , Srikanth Cherukuri
Abstract: Systems, computer program products, and methods are described herein for intelligent intelligently designing and reconfiguring data centers. For example, a system may be an artificial-intelligence-based system for designing and reconfiguring data centers based on user inquiries. The system may receive inquiries from users requesting a design for a data center having particular performance characteristics (e.g., selected performance characteristics), changes to an existing design of a data center, information about a data center, and/or the like. The inquiries may be text-based or audio and in the form of natural language questions or commands. The system may use two machine learning models, namely a knowledge base model and a ranking model. The system may use the knowledge base model to determine solutions to user inquiries and then use the ranking model to determine rankings for the solutions.
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公开(公告)号:US20240354618A1
公开(公告)日:2024-10-24
申请号:US18137758
申请日:2023-04-21
Applicant: NVIDIA CORPORATION
Inventor: Hossein Seifoory , Elad Mentovich , Juan Jose Vegas Olmos
IPC: G06N10/40
CPC classification number: G06N10/40
Abstract: Systems, devices, and methods are described herein that generate data packets in DPU assisted quantum metrology. An example quantum device includes a first quantum measurement module operably coupled with a first quantum system. The first quantum measurement module applies one or more measurements to the first quantum system and obtains information associated with the first quantum system based on the one or more measurements. The quantum device includes a first DPU operably coupled with the first quantum measurement module. The first DPU generates a data packet including time-related quantum data based upon at least one of the one or more measurements by the first quantum measurement module or the obtained information associated with the first quantum system.
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公开(公告)号:US20250120052A1
公开(公告)日:2025-04-10
申请号:US18377017
申请日:2023-10-05
Applicant: Nvidia Corporation
Inventor: Ryan Albright , Tahir Cader , Aaron Carkin , Siddha Ganju , Kenneth Misin , William Mecham , William Ryan Weese , Benjamin Goska , Jordan Levy , Michael Thompson , Elad Mentovich , Fred Devoir
IPC: H05K7/20
Abstract: Devices, apparatuses, and systems for thermal management in networking and computing systems are provided. An example in-rack thermal management system includes a cooling distribution unit (CDU) that includes a housing that defines a fluid inlet and a fluid outlet, thermal management components supported by the housing, and direct mechanical connections coupled with the fluid inlet and the fluid outlet. The in-rack thermal management system includes a fluid distribution system that includes a primary fluid channel directly coupled with the direct mechanical connection of the fluid inlet, and a secondary fluid channel directly coupled with the direct mechanical connection of the fluid outlet. In operation, the thermal management components dissipate heat of a fluid received by the CDU via the fluid inlet. The direct mechanical connections directly interface with the fluid distribution system to provide fluid communication between the CDU and the fluid distribution system to maximize dimensions of the housing.
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公开(公告)号:US20250098108A1
公开(公告)日:2025-03-20
申请号:US18369917
申请日:2023-09-19
Applicant: NVIDIA CORPORATION
Inventor: Tahir Cader , David Copeland , Elad Mentovich
Abstract: Devices, apparatuses, systems, and methods are provided for hybrid thermal management in computing modules. An example computing module includes a first computing component having a first operating temperature and a second computing component having a second operating temperature. The first operating temperature is greater than the second operating temperature. The example computing module further includes a hybrid thermal management system including a cooling delivery device configured to receive a cooling fluid. The cooling delivery device defines a first section configured to dissipate heat generated by the first computing component and a second section configured to dissipate heat generated by the second computing component. The first section of the cooling delivery device may be fluidically isolated from the second section of the cooling delivery device or the second section may be in fluid communication with the first section.
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公开(公告)号:US20250081349A1
公开(公告)日:2025-03-06
申请号:US18242290
申请日:2023-09-05
Applicant: NVIDIA CORPORATION
Inventor: Elad Mentovich , Dongji Xie , Ron Chao , Ryan Albright
Abstract: A secure electronic component assembly is described herein for ensuring the physical integrity of an integrated circuit (IC). The secure electronic component assembly may comprise a printed circuit board (PCB), an integrated circuit (IC) mounted on the PCB, and an underfill material disposed between the IC and the PCB. The underfill material comprises a detection agent that is configured to change a state of the IC in response to exposure to an external environment, wherein the change in the state of the IC is indicative of a tamper condition.
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公开(公告)号:US12245360B2
公开(公告)日:2025-03-04
申请号:US17879620
申请日:2022-08-02
Applicant: NVIDIA Corporation
Inventor: David Mohr , Tahir Cader , Elad Mentovich , Boaz Atias , Chong Tan
Abstract: A power arrangement and cooling system for electronic devices includes a processing unit electrically interconnected and disposed to a first side of a printed circuit board and a power converter electrically interconnected and disposed on a second side of the printed circuit board. The power converter includes a thermally conductive material layer that transfers heat generated by the power converter during operation away from the power converter toward a heatsink that is disposed adjacent the second side of the printed circuit board. Heat generated by the processing unit is absorbed by a heatsink disposed adjacent the first side of the printed circuit board. Power for the processing unit is provided, by the power converter, through a thickness of the printed circuit board.
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公开(公告)号:US20240264588A1
公开(公告)日:2024-08-08
申请号:US18113217
申请日:2023-02-23
Applicant: NVIDIA CORPORATION
Inventor: Ron Chao , Liang-I Lin , Tuan Ong , Elad Mentovich , Siddha Ganju , Dinesh Krishnaswamy , Fisher Liu , Lei Huang , Nicholas Girard Page
IPC: G05B19/418
CPC classification number: G05B19/41885 , G05B19/41805
Abstract: Methods are described herein for artificial-intelligence-based manufacturing. The present invention may include performing an initial step in a series of steps to achieve a target value of an attribute, where the series of steps is for manufacturing an object, and, after performing the initial step, measuring an actual value of the attribute achieved by the initial step. The method may include, for each subsequent step in the series, providing actual values of attributes achieved by preceding steps in the series to a respective machine learning model to determine a respective target value for a respective attribute to be achieved by the respective step. The method may also include, for each step, performing the respective step to achieve the respective target value of the respective attribute and, after performing the respective step, measuring a respective actual value of the respective attribute achieved by the respective step.
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公开(公告)号:US20240061388A1
公开(公告)日:2024-02-22
申请号:US17888834
申请日:2022-08-16
Applicant: Nvidia Corporation
Inventor: Siddha Ganju , Elad Mentovich , James Stephen Fields, JR. , Nathan D. Ratliff , Ryan Kelsey Albright
CPC classification number: G05B17/02 , G05B23/0283
Abstract: A virtual representation of a physical environment can be generated through simulation, which can include one or more virtual agents to represent robots, or at least semi-automated devices, that can operate and perform various tasks in the physical environment. Various component failures, or other potential problems, can be simulated that can be analyzed by one or more deep learning models associated with the virtual agents. These deep learning models can attempt to diagnose the simulated problem, as well as determine one or more potential solutions. The virtual agents can help to gather information for these determinations, as well as to perform tasks for these potential solutions. Once these deep learning models are trained in this simulated environment, these models can be used by one or more robots to perform tasks that may relate to maintenance or operation of a physical environment.
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公开(公告)号:US12206748B2
公开(公告)日:2025-01-21
申请号:US17958139
申请日:2022-09-30
Applicant: NVIDIA Corporation
Inventor: Siddha Ganju , Elad Mentovich , Michael Balint , Eitan Zahavi , Michael Sabotta , Michael Norman , Ryan Wells
Abstract: A method includes receiving, using a processing device, a first condition associated with an operation at a data center, where the operation at the data center pertains to a first location at the data center, the first location corresponding to a first parameter value. The method further includes providing the first condition as an input to a machine learning model. The method also includes performing one or more reinforcement learning techniques using the machine learning model to cause the machine learning model to output an indication of a final location associated with the operation, where the final location corresponds to a final parameter value that is closer to a target than the first parameter value corresponding to the first location at the data center.
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公开(公告)号:US20240353238A1
公开(公告)日:2024-10-24
申请号:US18137737
申请日:2023-04-21
Applicant: NVIDIA CORPORATION
Inventor: Hossein Seifoory , Elad Mentovich , Juan Jose Vegas Olmos
IPC: G01D3/036
CPC classification number: G01D3/036
Abstract: Systems, devices, and methods are described herein that are employed in quantum metrology. An example quantum device includes a weak measurement module operably coupled with a quantum system. The weak measurement module is configured to apply one or more measurements to the quantum system and obtain information associated with the quantum system based on the one or more measurements. A strength of the one or more measurements by the weak measurement module is configured to prevent a wave function collapse associated with the quantum system. The quantum device further includes a data processing unit (DPU) operably coupled with the weak measurement module that performs one or more operations on the obtained information associated with the quantum system and provides improved time synchronization and networking features.
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