公开(公告)号：US20180364439A1

公开(公告)日：2018-12-20

申请号：US15625089

申请日：2017-06-16

Applicant: OBSIDIAN SENSORS, INC.

Inventor： Yaoling PAN ,  Jian MA ,  John HONG ,  Tallis CHANG

IPC: G02B7/02 ,  G02B3/00 ,  H04N5/225

Abstract: Conventional optical lens assembly typically require a capping window, which is expensive, to protect the optical sensor. Also, each conventional optical lens assembly is discretely assembled, and thus incurs additional costs. To address these and other disadvantages, it is proposed to assemble a plurality of imaging sensors, a plurality of spacers, and a plurality of lenses at a panel. The resulting lens assembly array can be individualized into separate lens assemblies.

公开(公告)号：US20230343130A1

公开(公告)日：2023-10-26

申请号：US17763591

申请日：2020-09-23

Applicant: Obsidian Sensors, Inc.

Inventor： John HONG ,  Bing WEN

IPC: G06V40/13

CPC classification number: G06V40/1318

Abstract: Methods and systems for sensing a user interaction (e.g., a fingerprint) with a display of an electronic device are disclosed. In some embodiments, the method includes illuminating, with a light source, a position of a user interaction on the display. In some embodiments, the method includes detecting, with a detector, a backscattered light from the position. In some embodiments, the light source and the detector are located on a same layer of the display.

公开(公告)号：US20230314228A1

公开(公告)日：2023-10-05

申请号：US18132773

申请日：2023-04-10

Applicant: Obsidian Sensors, Inc.

Inventor： John HONG ,  Bing WEN ,  Edward CHAN ,  Tallis CHANG ,  Sean ANDREWS

IPC: G01J5/02 ,  B81B3/00 ,  G01J5/20 ,  H04N23/11

CPC classification number: G01J5/024 ,  B81B3/0029 ,  G01J5/20 ,  H04N23/11 ,  B81B2201/047

Abstract: Disclosed herein are MEMS devices and systems and methods of manufacturing or operating the MEMS devices and systems. In some embodiments, the MEMS devices and systems are used in imaging applications.

公开(公告)号：US20220411261A1

公开(公告)日：2022-12-29

申请号：US17801230

申请日：2021-02-19

Applicant: Obsidian Sensors, Inc.

Inventor： John HONG ,  Tallis CHANG ,  Sean ANDREWS ,  Jan BOS ,  Jia-Wei MA

IPC: B81C1/00 ,  B81B7/00

Abstract: In some embodiments, electromechanical systems including a semiconductor layer that has a planar surface and includes conductive and adjacent non-conductive regions and a hermetic seal applied above the planar surface and methods of manufacturing the systems are disclosed. In some embodiments, electromechanical devices that include first and second planar semiconductor layers are disclosed. Each of the semiconductor layers includes conductive regions, and at least one conductive region from each of the layers is electrically coupled to each other. Methods of manufacturing the electromechanical devices are also disclosed.

公开(公告)号：US20210306535A1

公开(公告)日：2021-09-30

申请号：US17214635

申请日：2021-03-26

Applicant: Obsidian Sensors, Inc.

Inventor： John HONG ,  Bing WEN ,  Tallis CHANG

IPC: H04N5/225

Abstract: An imaging device comprising two camera apertures and a method of capturing two fields of view using two camera apertures are disclosed.

公开(公告)号：US20210164839A1

公开(公告)日：2021-06-03

申请号：US17267789

申请日：2019-08-09

Applicant: Obsidian Sensors, Inc.

Inventor： John HONG ,  Bing WEN ,  Edward CHAN ,  Tallis CHANG ,  Sean ANDREWS

IPC: G01J5/02 ,  G01J5/20 ,  B81B3/00

Abstract: Disclosed herein are MEMS devices and systems and methods of manufacturing or operating the MEMS devices and systems for transmitting and detecting radiation. The devices and methods described herein are applicable to terahertz radiation. In some embodiments, the MEMS devices and systems are used in imaging applications. In some embodiments, a microelectromechanical system comprises a glass substrate configured to pass radiation from a first surface of the glass substrate through a second surface of the glass substrate, the glass substrate comprising TFT circuitry; a lid comprising a surface; spacers separating the lid and glass substrate; a cavity defined by the spacers, surface of the lid, and second surface of the glass substrate; a pixel in the cavity, positioned on the second surface of the glass substrate, electrically coupled to the TFT circuitry, and comprising an absorber to detect the radiation; and a reflector to direct the radiation to the absorbers and positioned on the lid.

公开(公告)号：US20210102844A1

公开(公告)日：2021-04-08

申请号：US17048046

申请日：2019-04-17

Applicant: Obsidian Sensors, Inc.

Inventor： Edward CHAN ,  Bing WEN ,  John HONG ,  Tallis CHANG ,  Seung-Tak RYU

IPC: G01J5/24 ,  G01J5/02 ,  G01J1/42 ,  H04N5/33 ,  G01J1/46

Abstract: Methods of sensor readout and calibration and circuits for performing the methods are disclosed. In some embodiments, the methods include driving an active sensor at a voltage. In some embodiments, the methods include use of a calibration sensor, and the circuits include the calibration sensor. In some embodiments, the methods include use of a calibration current source and circuits include the calibration current source. In some embodiments, a sensor circuit includes a Sigma-Delta ADC. In some embodiments, a column of sensors is readout using first and second readout circuits during a same row time.

公开(公告)号：US20210002130A1

公开(公告)日：2021-01-07

申请号：US16982519

申请日：2019-03-20

Applicant: Obsidian Sensors, Inc.

Inventor： John HONG ,  Tallis CHANG ,  Edward CHAN ,  Bing WEN ,  Yaoling PAN ,  Kenji NOMURA

IPC: B81C1/00

Abstract: A method of manufacturing MEMS housings includes: providing glass spacers; providing a window plate; attaching the window plate to the glass spacers; aligning the glass spacers with a device glass plate having MEMS devices thereon; bonding the glass spacers to the device glass plate; and singulating the glass spacers, window plate, and device glass plate to produce the MEMS housings.