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公开(公告)号:US20230288258A1
公开(公告)日:2023-09-14
申请号:US18121446
申请日:2023-03-14
Applicant: Obsidian Sensors, Inc.
Inventor: John HONG , Bing WEN , Sean ANDREWS , Heesun SHIN , Edward CHAN , Tallis CHANG , Ming YING
CPC classification number: G01J3/45 , G01J3/0297 , G02B6/2935
Abstract: Systems and methods for spectrometry are disclosed. In some embodiments, the system comprises a Fourier Transform Spectrometer (FTS) comprising a waveguide and a delay element. In some embodiments, the method comprises determining a power spectral density of an input optical signal via the FTS.
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公开(公告)号:US20240379694A1
公开(公告)日:2024-11-14
申请号:US18689802
申请日:2022-09-07
Applicant: OBSIDIAN SENSORS, INC.
Inventor: Heesun SHIN , Bing WEN , Edward CHAN , Sean ANDREWS , Tallis CHANG , John HONG
IPC: H01L27/146
Abstract: Electronic devices comprising pixels for sensing, methods for operating the electronic devices, and methods for manufacturing the electronic devices are disclosed. In some embodiments, the electronic devices comprise hinges for supporting the pixels. In some embodiments, the electronic devices are configured to provide a bias voltage to the pixels.
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公开(公告)号:US20230236067A1
公开(公告)日:2023-07-27
申请号:US18097138
申请日:2023-01-13
Applicant: Obsidian Sensors, Inc.
Inventor: Edward CHAN , Bing WEN , John HONG , Tallis CHANG , Seung-Tak RYU
CPC classification number: G01J5/24 , G01J1/4228 , G01J1/46 , G01J5/024 , H04N5/33 , G01J2001/444
Abstract: Methods of sensor readout and calibration and circuits for performing the methods are disclosed. In some embodiments, the methods include driving an active sensor at a voltage. In some embodiments, the methods include use of a calibration sensor, and the circuits include the calibration sensor. In some embodiments, the methods include use of a calibration current source and circuits include the calibration current source. In some embodiments, a sensor circuit includes a Sigma-Delta ADC. In some embodiments, a column of sensors is readout using first and second readout circuits during a same row time.
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公开(公告)号:US20230061174A1
公开(公告)日:2023-03-02
申请号:US17896978
申请日:2022-08-26
Applicant: Obsidian Sensors, Inc.
Inventor: John HONG , Tallis CHANG , Bing WEN , Edward CHAN , Sean ANDREWS , Heesun SHIN
Abstract: Microelectromechanical system (MEMS) devices, methods of operating the MEMS device, and methods of manufacturing the MEMS device are disclosed. In some embodiments, the MEMS device includes a glass substrate; an electrode on the glass substrate; a hinge mechanically coupled to the electrode; a membrane mirror mechanically coupled to the hinge; a TFT on the glass substrate and electrically coupled to the electrode; and a control circuit comprising: a multiplexer configured to turn on or turn off the TFT; and a drive source configured to provide a drive signal for charging the electrode through the TFT. An amplitude of the drive signal corresponds to an amount of charge, and the amount of charge generates an electrostatic force for actuating the hinge and a portion of the membrane mirror mechanically coupled to the hinge. In some embodiments, the MEMS devices comprise a charge transfer circuit for providing the amount of charge.
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公开(公告)号:US20210294093A1
公开(公告)日:2021-09-23
申请号:US17207433
申请日:2021-03-19
Applicant: Obsidian Sensors, Inc.
Inventor: John HONG , Tallis CHANG , Bing WEN , Edward CHAN , Sean ANDREWS , Heesun SHIN
Abstract: Microelectromechanical system (MEMS) devices, methods of operating the MEMS device, and methods of manufacturing the MEMS device are disclosed. In some embodiments, the MEMS device includes a glass substrate; an electrode on the glass substrate; a hinge mechanically coupled to the electrode; a membrane mirror mechanically coupled to the hinge; a TFT on the glass substrate and electrically coupled to the electrode; and a control circuit comprising: a multiplexer configured to turn on or turn off the TFT; and a drive source configured to provide a drive signal for charging the electrode through the TFT. An amplitude of the drive signal corresponds to an amount of charge, and the amount of charge generates an electrostatic force for actuating the hinge and a portion of the membrane mirror mechanically coupled to the hinge.
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公开(公告)号:US20250123444A1
公开(公告)日:2025-04-17
申请号:US18915202
申请日:2024-10-14
Applicant: Obsidian Sensors, Inc.
Inventor: Karl JOHNSON , John HONG , Bing WEN , Sean ANDREWS , Heesun SHIN , Edward CHAN , Tallis CHANG
IPC: G02B6/35
Abstract: An integrated MEMS waveguide modulator, including: a static, non-suspended waveguide to guide light traveling through the waveguide; and a dielectric slab movable into and out of an evanescent field surrounding the waveguide using an actuation mechanism, wherein the dielectric slab is movable between a first position that is farthest away possible for the slab from the waveguide and a second position that is closest possible for the slab from the waveguide, wherein dispersion characteristic of the light is controlled by moving the dielectric slab from an unactuated mode that is at the first position to an actuated mode that is at the second position, and wherein the dielectric slab is layered to include non-uniform refractive index profile.
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公开(公告)号:US20250042727A1
公开(公告)日:2025-02-06
申请号:US18737611
申请日:2024-06-07
Applicant: OBSIDIAN SENSORS, INC.
Inventor: John HONG , Tallis CHANG , Edward CHAN , Bing WEN , Yaoling PAN , Sean ANDREWS
Abstract: An electromechanical systems structure including: providing a stack, including a structural layer extending in a plane, a sidewall layer including a first portion lying in a plane parallel to the structural layer plane and a second portion lying in a plane transverse to the structural layer plane, an etch-stop layer, positioned between the sidewall layer and the structural layer, including an etch-selectivity different from an etch-selectivity of the structural layer and an etch-selectivity of the sidewall layer, and a mold comprising a wall parallel to the sidewall layer's second portion; etching the sidewall layer's first portion to expose the etch-stop layer; removing the mold; etching the etch-stop layer such that the sidewall layer's second portion masks a portion of the etch-stop layer; removing the sidewall layer's second portion; and etching the structural layer such that the portion of the etch-stop layer masks a portion of the structural layer.
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公开(公告)号:US20240359974A1
公开(公告)日:2024-10-31
申请号:US18750995
申请日:2024-06-21
Applicant: OBSIDIAN SENSORS, INC.
Inventor: John HONG , Tallis CHANG , Bing WEN , Edward CHAN , Sean ANDREWS , Heesun SHIN
IPC: B81C1/00
CPC classification number: B81C1/00373 , B81C1/00158
Abstract: Membrane fabrication including: depositing a bottom Molybdenum (Mo) layer; depositing a polyimide (PI) layer and defining a first release hole; curing the PI layer; depositing a top Mo layer; and defining and etching a second release hole within the first release hole.
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公开(公告)号:US20240056094A1
公开(公告)日:2024-02-15
申请号:US18269247
申请日:2021-12-28
Applicant: Obsidian Sensors, Inc.
Inventor: Bing WEN , John HONG , Edward CHAN
IPC: H03M3/00
Abstract: Data converter circuits and methods of operating the data converter circuits are disclosed. In some embodiments, a data converter circuit includes a charge measurement circuit. In some embodiments, the charge measurement circuit is a capacitive transimpedance amplifier (CTIA). In some embodiments, the data converter circuit includes the CTIA, a quantizer, a digital-to-analog converter, a summer, and a digital filter. In some embodiments, the data converter circuit includes an analog-to-digital converter electrically coupled to the CTIA and the digital filter. In some embodiment, a method includes integrating an input signal with a CTIA, determining whether a CTIA output signal is greater than a threshold, and reducing the CTIA output signal or forgoing the reducing based on the determination of whether the CTIA output signal is greater than the threshold.
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公开(公告)号:US20230314228A1
公开(公告)日:2023-10-05
申请号:US18132773
申请日:2023-04-10
Applicant: Obsidian Sensors, Inc.
Inventor: John HONG , Bing WEN , Edward CHAN , Tallis CHANG , Sean ANDREWS
CPC classification number: G01J5/024 , B81B3/0029 , G01J5/20 , H04N23/11 , B81B2201/047
Abstract: Disclosed herein are MEMS devices and systems and methods of manufacturing or operating the MEMS devices and systems. In some embodiments, the MEMS devices and systems are used in imaging applications.
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