公开(公告)号：US20210244836A1

公开(公告)日：2021-08-12

申请号：US17167938

申请日：2021-02-04

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Young Woon JEON ,  Min Woo CHOI

IPC: A61L2/10

Abstract: Proposed is a UV sterilizer. In a UV sterilizer according to an embodiment of the present disclosure, a light source module that emits ultraviolet (UV) light is provided between an upper body and a lower body where a fluid flows, thereby sterilizing a fluid by irradiating the flowing fluid with UV light.

公开(公告)号：US20210238763A1

公开(公告)日：2021-08-05

申请号：US17128770

申请日：2020-12-21

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Sung Hyun BYUN ,  Dong Hyeok SEO

IPC: C25D11/24 ,  C25D11/12 ,  B32B15/01 ,  B32B7/12

Abstract: Proposed is a laminated anodic oxide film structure in which a plurality of anodic oxide films are stacked. More particularly, proposed is a laminated anodic oxide film structure having a high degree of strength.

公开(公告)号：US20210115584A1

公开(公告)日：2021-04-22

申请号：US17070057

申请日：2020-10-14

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN

IPC: C25D11/12 ,  C23C16/44 ,  C25D11/04

Abstract: Proposed are a metal part for a process chamber and a method of forming a thin film layer of the metal part for the process chamber. More particularly, proposed are a metal part for a process chamber and a method of forming a thin film layer of the metal part for the process chamber, wherein the metal part is installed in a process chamber used in a display or semiconductor manufacturing process or constitutes a part of the process chamber, and a large thickness of the thin film layer of the metal part for the process chamber is easily secured, thereby achieving an extended lifespan by preventing cracks of the metal part for the process chamber, while preventing outgassing due to pores.

公开(公告)号：US20200335680A1

公开(公告)日：2020-10-22

申请号：US16904102

申请日：2020-06-17

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: H01L33/62 ,  H01L25/075 ,  H01L27/12 ,  H01L23/00

Abstract: The present invention relates to a micro LED structure and a method of manufacturing the same. More particularly, the present invention relates to a micro LED structure and a method of manufacturing the same, the micro LED structure including: a micro LED; a circuit board driving the micro LED; and an anisotropic conductive anodic oxide film provided between the micro LED and the circuit board to electrically connect the circuit board and the micro LED. According to the present invention, without applying an external force (thermocompression bonding) to the anisotropic conductive anodic oxide film, it is possible to electrically connect the circuit board and the micro LED. In addition, it is possible to obtain characteristics such as uniform conductivity in a vertical direction and heat dissipation.

公开(公告)号：US20200258762A1

公开(公告)日：2020-08-13

申请号：US16783013

申请日：2020-02-05

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN

IPC: H01L21/67 ,  G05D23/01 ,  H01L21/768

Abstract: The present invention relates generally to a temperature control apparatus capable of controlling the temperature of a product using a temperature control material. More particularly, the present invention relates to a temperature control apparatus capable of uniformly controlling the temperature of a product by reducing a temperature deviation of a temperature control material flowing inside the product.

公开(公告)号：US20200070364A1

公开(公告)日：2020-03-05

申请号：US16551566

申请日：2019-08-26

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: B25J15/06 ,  B25J7/00

Abstract: The present invention relates to a transfer head gripping and transferring micro LEDs from a first substrate to a second substrate. More particularly, the present invention relates to a transfer head gripping and transferring micro LEDs in a batch manner without any error even when there is a height difference of the micro LEDs.

公开(公告)号：US20200044127A1

公开(公告)日：2020-02-06

申请号：US16526702

申请日：2019-07-30

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01L33/62

Abstract: The present invention relates generally to a micro LED structure and a method of manufacturing the same, and more particularly to a micro LED structure having an anisotropic conductive film between a micro LED and a target substrate to which the micro LED is bonded for electrically connect the micro LED and the target substrate together, and a method of manufacturing the same.

公开(公告)号：US20200043771A1

公开(公告)日：2020-02-06

申请号：US16529407

申请日：2019-08-01

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01L21/677 ,  H01L33/00 ,  H01L21/683

Abstract: The present invention relates to provide a hot air supplying head for transferring a micro LED and a micro LED transfer system using the same, the hot air supplying head effectively transferring micro LEDs.

公开(公告)号：US20190178862A1

公开(公告)日：2019-06-13

申请号：US16201891

申请日：2018-11-27

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: G01N33/00 ,  G01N21/88

Abstract: The present invention relates to an air quality measuring apparatus. The air quality measuring apparatus measures air quality using air flow generated therein using a variable and restorable pumping means, thereby reducing power consumption and a volume of the air quality measuring apparatus so as to be portable.

公开(公告)号：US20170162754A1

公开(公告)日：2017-06-08

申请号：US15363261

申请日：2016-11-29

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: H01L33/48

CPC classification number: H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A chip substrate includes conductive layers, an insulation layer configured to electrically isolate the conductive layers, and a cavity composed of a groove formed at a predetermined depth in a region including the insulation layer. One side of the cavity includes a first surface and a second surface continuously extending from the first surface, the first surface is formed to vertically extend from a lower portion of the cavity and the second surface is formed so as to have the same slope as the other side of the cavity, whereby the distance between one side of the lower portion of the cavity and the insulation layer is increased.