公开(公告)号：US20200335680A1

公开(公告)日：2020-10-22

申请号：US16904102

申请日：2020-06-17

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: H01L33/62 ,  H01L25/075 ,  H01L27/12 ,  H01L23/00

Abstract: The present invention relates to a micro LED structure and a method of manufacturing the same. More particularly, the present invention relates to a micro LED structure and a method of manufacturing the same, the micro LED structure including: a micro LED; a circuit board driving the micro LED; and an anisotropic conductive anodic oxide film provided between the micro LED and the circuit board to electrically connect the circuit board and the micro LED. According to the present invention, without applying an external force (thermocompression bonding) to the anisotropic conductive anodic oxide film, it is possible to electrically connect the circuit board and the micro LED. In addition, it is possible to obtain characteristics such as uniform conductivity in a vertical direction and heat dissipation.

公开(公告)号：US20200070364A1

公开(公告)日：2020-03-05

申请号：US16551566

申请日：2019-08-26

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: B25J15/06 ,  B25J7/00

Abstract: The present invention relates to a transfer head gripping and transferring micro LEDs from a first substrate to a second substrate. More particularly, the present invention relates to a transfer head gripping and transferring micro LEDs in a batch manner without any error even when there is a height difference of the micro LEDs.

公开(公告)号：US20200044127A1

公开(公告)日：2020-02-06

申请号：US16526702

申请日：2019-07-30

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01L33/62

Abstract: The present invention relates generally to a micro LED structure and a method of manufacturing the same, and more particularly to a micro LED structure having an anisotropic conductive film between a micro LED and a target substrate to which the micro LED is bonded for electrically connect the micro LED and the target substrate together, and a method of manufacturing the same.

公开(公告)号：US20200043771A1

公开(公告)日：2020-02-06

申请号：US16529407

申请日：2019-08-01

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01L21/677 ,  H01L33/00 ,  H01L21/683

Abstract: The present invention relates to provide a hot air supplying head for transferring a micro LED and a micro LED transfer system using the same, the hot air supplying head effectively transferring micro LEDs.

公开(公告)号：US20190178862A1

公开(公告)日：2019-06-13

申请号：US16201891

申请日：2018-11-27

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: G01N33/00 ,  G01N21/88

Abstract: The present invention relates to an air quality measuring apparatus. The air quality measuring apparatus measures air quality using air flow generated therein using a variable and restorable pumping means, thereby reducing power consumption and a volume of the air quality measuring apparatus so as to be portable.

公开(公告)号：US20170162754A1

公开(公告)日：2017-06-08

申请号：US15363261

申请日：2016-11-29

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: H01L33/48

CPC classification number: H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A chip substrate includes conductive layers, an insulation layer configured to electrically isolate the conductive layers, and a cavity composed of a groove formed at a predetermined depth in a region including the insulation layer. One side of the cavity includes a first surface and a second surface continuously extending from the first surface, the first surface is formed to vertically extend from a lower portion of the cavity and the second surface is formed so as to have the same slope as the other side of the cavity, whereby the distance between one side of the lower portion of the cavity and the insulation layer is increased.

公开(公告)号：US20160049251A1

公开(公告)日：2016-02-18

申请号：US14825538

申请日：2015-08-13

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK

IPC: H01G4/26 ,  H01G4/06 ,  H01G4/005 ,  H01G4/30

CPC classification number: H01G4/26 ,  H01G4/005 ,  H01G4/10 ,  H01G4/30 ,  H01G4/38

Abstract: A folding type capacitor includes a metal substrate wherein a through hole penetrates an inside thereof; at least one dielectric layer formed on a surface of the metal substrate and an inner peripheral surface of the through hole; and an electrode layer formed on the at least one dielectric layer, wherein the metal substrate has bending portions whose surfaces are facing each other. Thus, manufacturing process is more simplified since Al2O3 insulation layers are formed by anodizing the aluminum layer without forming the extra dielectric layers after forming the aluminum layer, so that the manufacturing cost can be reduced, and also a multi-stacked capacitor having a high capacitance and a high reliability can be provided by stacking capacitors including a plurality of aluminum oxide layers using a more simplified process.

Abstract translation: 折叠式电容器包括：金属基板，其中通孔穿透其内部; 形成在所述金属基板的表面上的至少一个电介质层和所述通孔的内周面; 以及形成在所述至少一个电介质层上的电极层，其中所述金属基板具有表面彼此相对的弯曲部。 因此，制造工艺更加简化，因为通过在形成铝层之后不形成额外的电介质层来阳极氧化铝层来形成Al 2 O 3绝缘层，从而可以降低制造成本，并且还具有高电容的多层电容器 并且可以通过使用更简化的工艺堆叠包括多个氧化铝层的电容器来提供高可靠性。

公开(公告)号：US20250166876A1

公开(公告)日：2025-05-22

申请号：US18840071

申请日：2023-02-16

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: H01F5/02 ,  H01F41/06

Abstract: The present invention relates to an inductor and a manufacturing method therefor, and, particularly, the objective of the present invention is to provide an inductor and a manufacturing method therefor, the inductor satisfying needs of small size and low resistance and, simultaneously, having a simplified manufacturing process such that mass production thereof is possible.

公开(公告)号：US20250035670A1

公开(公告)日：2025-01-30

申请号：US18710173

申请日：2022-11-08

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Chang Hee HONG

IPC: G01R1/067

Abstract: The present invention provides an electrically conductive contact pin and an inspection device having improved inspection reliability for an inspection object. The electrically conductive contact pin is characterized in that a first connection portion contacts a support portion to form a current path when a first elastic portion is compressed, and a second connection portion contacts the support portion to form a current path when a second elastic portion is compressed. The inspection device comprises an installation member having a through hole for receiving the electrically conductive contact pin.

公开(公告)号：US20250020691A1

公开(公告)日：2025-01-16

申请号：US18274455

申请日：2022-01-25

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: G01R1/067 ,  G01R1/073

Abstract: Proposed is an electro-conductive contact pin which can implement a narrow pitch between electro-conductive contact pins and prevent the electro-conductive contact pins from being short-circuited even upon contact between center portions of the electro-conductive contact pins, through a manufacturing method for an electro-conductive contact pin, the manufacturing method including a step of forming a module area including pin bodies and a support frame supporting the pin bodies through connecting portions, and a coating layer forming step of forming a coating layer on the pin bodies.