SOLID-STATE IMAGING DEVICE AND METHOD OF MANUFACTURING THE DEVICE
    13.
    发明申请
    SOLID-STATE IMAGING DEVICE AND METHOD OF MANUFACTURING THE DEVICE 有权
    固态成像装置及其制造方法

    公开(公告)号:US20150123180A1

    公开(公告)日:2015-05-07

    申请号:US14556093

    申请日:2014-11-28

    Abstract: Each unit pixel includes a photoelectric converter, an n-type impurity region forming an accumulation diode together with the semiconductor region, the accumulation diode accumulating a signal charge generated by the photoelectric converter, an amplifier transistor including a gate electrode electrically connected to the impurity region, and an isolation region formed around the amplifier transistor and implanted with p-type impurities. The amplifier transistor includes an n-type source/drain region formed between the gate electrode and the isolation region, and a channel region formed under the gate electrode. A gap in the isolation region is, in a gate width direction, wider at a portion including the channel region than at a portion including the source/drain region.

    Abstract translation: 每个单位像素包括光电转换器,与半导体区域一起形成累积二极管的n型杂质区域,累积二极管累积由光电转换器产生的信号电荷;放大器晶体管,包括电连接到杂质区的栅电极 以及形成在放大晶体管周围并注入p型杂质的隔离区域。 放大器晶体管包括形成在栅极电极和隔离区域之间的n型源极/漏极区域和形成在栅电极下方的沟道区域。 在包括沟道区域的部分中,隔离区域中的间隙在栅极宽度方向上比在包括源极/漏极区域的部分处更宽。

    IMAGING DEVICE
    14.
    发明申请

    公开(公告)号:US20230097421A1

    公开(公告)日:2023-03-30

    申请号:US18061233

    申请日:2022-12-02

    Abstract: An exemplary imaging device according to the present disclosure includes: an imaging region including a plurality of pixels; a peripheral region located outside of the imaging region; and a blockade region located between the imaging region and the peripheral region. Each of the plurality of pixels includes a photoelectric conversion layer, a pixel electrode to collect a charge generated in the photoelectric conversion layer, and a first doped region electrically connected to the pixel electrode. In the peripheral region, a circuit to drive the plurality of pixels is provided. The blockade region includes a second doped region of a first conductivity type located between the imaging region and the peripheral region and a plurality of first contact plugs connected to the second doped region.

    IMAGING DEVICE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20190244959A1

    公开(公告)日:2019-08-08

    申请号:US16384575

    申请日:2019-04-15

    Abstract: An imaging device includes: a semiconductor substrate including a first impurity region and a second impurity region; a first insulating layer on a portion of a surface of the semiconductor substrate; a second insulating layer on another portion of the surface of the semiconductor substrate, a thickness of the first insulating layer being greater than a thickness of the second insulating layer; a first transistor including: a first gate electrode facing the surface of the semiconductor substrate via the first insulating layer; the first impurity region as one of a source and a drain; and the second impurity region as the other of the source and the drain; and a photoelectric converter electrically connected to the first impurity region. The first insulating layer covers the first impurity region, and the second insulating layer covers the second impurity region.

    IMAGING DEVICE
    18.
    发明申请
    IMAGING DEVICE 审中-公开

    公开(公告)号:US20180114812A1

    公开(公告)日:2018-04-26

    申请号:US15851238

    申请日:2017-12-21

    Abstract: An imaging device including a unit pixel cell including a semiconductor substrate having a surface including a first area and a second area surrounded by the first area. The semiconductor substrate including a first region of a first conductivity type exposed to the surface in the first area, and a second region of a second conductivity type directly adjacent to the first region and exposed to the surface in the second area; a photoelectric converter; an amplifier; a contact plug connected to the second region; a first transistor including a first electrode; a second electrode covering a second portion of the first area; and a second insulation layer between the second electrode and the semiconductor substrate. When viewed in a direction perpendicular to the surface of the semiconductor substrate, a contact between the second region and the contact plug is located between the first electrode and the second electrode.

    SOLID-STATE IMAGING DEVICE
    20.
    发明申请
    SOLID-STATE IMAGING DEVICE 有权
    固态成像装置

    公开(公告)号:US20150137199A1

    公开(公告)日:2015-05-21

    申请号:US14572046

    申请日:2014-12-16

    Abstract: A solid-state imaging device according to the present disclosure includes: a charge storage region that stores a signal charge obtained through photoelectric conversion in a photoelectric conversion film; an amplification transistor that amplifies the signal charge stored in the charge storage region in a corresponding pixel; a contact plug that is electrically connected to the charge storage region and contains a semiconductor material; and a line that is disposed above the contact plug and contains a semiconductor material. The contact plug and the charge storage region are electrically connected, and the contact plug and a gate electrode of the amplification transistor are electrically connected via the line.

    Abstract translation: 根据本公开的固态成像装置包括:电荷存储区域,其在光电转换膜中存储通过光电转换获得的信号电荷; 放大晶体管,其放大存储在相应像素中的电荷存储区域中的信号电荷; 接触插塞,其电连接到电荷存储区域并且包含半导体材料; 以及设置在接触塞上方并包含半导体材料的线。 接触插塞和电荷存储区域电连接,并且放大晶体管的接触插塞和栅电极经由线电连接。

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