公开(公告)号：US10169273B2

公开(公告)日：2019-01-01

申请号：US15403559

申请日：2017-01-11

Applicant: QUALCOMM Incorporated

Inventor： Inyoung Woo ,  Young Hoon Kang

IPC: G06F13/364 ,  G06F13/42 ,  G06F13/40

Abstract: Systems, methods, and apparatus are described that enable a physical layer interface of a device coupled to a serial bus to combine two or more single-byte write transactions to obtain a multi-byte write transaction. A method includes buffering a first single-byte transaction addressed to a first register at a first address of a slave device in a first-in-first-out buffer of the physical layer, receiving at the physical layer a second single-byte transaction addressed to a second register at a second address of the slave device coupled to the serial bus, determining in the physical layer whether the second address is incrementally greater than the first address, combining the second single-byte transaction with the first single-byte transaction to obtain a multi-byte transaction, replacing the first single-byte transaction with the multi-byte transaction in the first-in-first-out buffer, and transmitting a sequence of transactions output by the first-in-first-out buffer over the serial bus.

公开(公告)号：US09823673B2

公开(公告)日：2017-11-21

申请号：US14280631

申请日：2014-05-18

Applicant: QUALCOMM INCORPORATED

Inventor： Hee Jun Park ,  Young Hoon Kang ,  Ronald Frank Alton ,  Christopher Lee Medrano ,  Jon James Anderson

IPC: G05D23/19 ,  G05B15/02 ,  G06F1/20 ,  G06F1/32 ,  G06F1/26 ,  G06F11/30 ,  G06F11/34

CPC classification number: G05D23/1917 ,  G05B15/02 ,  G06F1/203 ,  G06F1/206 ,  G06F1/26 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3296 ,  G06F11/30 ,  G06F11/34 ,  Y02D10/16

Abstract: Various embodiments of methods and systems for energy efficiency aware thermal management in a portable computing device that contains a heterogeneous, multi-processor system on a chip (“SoC”) are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different processing efficiencies at a given temperature, energy efficiency aware thermal management techniques that compare performance data of the individual processing components at their measured operating temperatures can be leveraged to optimize quality of service (“QoS”) by adjusting the power supplies to, reallocating workloads away from, or transitioning the power mode of, the least energy efficient processing components. In these ways, embodiments of the solution optimize the average amount of power consumed across the SoC to process a MIPS of workload.