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    Selectively-pliable chemical vapor deposition (CVD) diamond or other heat spreader
    12.
    发明授权
    Selectively-pliable chemical vapor deposition (CVD) diamond or other heat spreader 有权

    公开(公告)号：US11476178B2

    公开(公告)日：2022-10-18

    申请号：US16901922

    申请日：2020-06-15

    Applicant: Raytheon Company

    Inventor： David H. Altman ,  Susan C. Trulli ,  Avram Bar-Cohen

    IPC: H01L23/367 ,  H01L21/48 ,  H01L23/373

    Abstract: A system includes at least one component configured to generate thermal energy, a heat spreader configured to remove thermal energy from the at least one component, and at least one substrate configured to remove thermal energy from the heat spreader. The heat spreader includes a first portion and a second portion. The first portion of the heat spreader is coupled to the substrate, and the second portion of the heat spreader is coupled to the at least one component. The first portion of the heat spreader includes high aspect-ratio structures that are separated from one another. The high aspect-ratio structures cause the first portion of the heat spreader to be pliable and able to accommodate a mismatch in coefficients of thermal expansion between a material in the heat spreader and a material in the substrate.

    Radio frequency (RF) energy transmission line transition structure
    13.
    发明授权
    Radio frequency (RF) energy transmission line transition structure 有权

    公开(公告)号：US11406007B2

    公开(公告)日：2022-08-02

    申请号：US16794487

    申请日：2020-02-19

    Applicant: Raytheon Company

    Inventor： Christopher M. Laighton ,  Susan C. Trulli ,  Elicia K. Harper

    IPC: H01L23/367 ,  H05K1/02

    Abstract: A radio frequency (RF) energy transmission line transition for coupling RF energy between a pair of RF transmission line sections disposed on intersecting surfaces of a corresponding one of a pair of conductive members, a first one of the pair of conductive members having a wall with a jog therein for receiving an end portion of a second one of the pair of conductive members, the end portion of an electrically conductive strip of the first one of the pair of radio frequency transmission line sections being disposed on, and electrically connected to, an electrically conductive strip of a second one of the pair of radio frequency transmission line sections.

    HIGH POWER RADIO FREQUENCY (RF) AMPLIFIERS
    15.
    发明申请
    HIGH POWER RADIO FREQUENCY (RF) AMPLIFIERS 有权

    公开(公告)号：US20210006213A1

    公开(公告)日：2021-01-07

    申请号：US16458902

    申请日：2019-07-01

    Applicant: Raytheon Company

    Inventor： Christopher M. Laighton ,  Susan C. Trulli ,  Elicia K. Harper

    IPC: H03F3/21 ,  H03F1/32

    Abstract: A power amplifier having: a plurality of N amplifier modules, where N is an integer greater than one; an M:N power splitter having M inputs, where M is an integer less than N, and N outputs, each one of the N outputs being coupled to an input of a corresponding one of the plurality of N power amplifiers; a plurality of M delay lines, each one the M delay lines having an output coupled to a corresponding one of the M inputs of the M:N power splitter, each one of the plurality of M delay lines being coupled to a common input of the power amplifier.

    MONOLITHIC MICROWAVE INTEGRATED CIRCUIT (MMIC) COOLING STRUCTURE
    16.
    发明申请
    MONOLITHIC MICROWAVE INTEGRATED CIRCUIT (MMIC) COOLING STRUCTURE 审中-公开

    公开(公告)号：US20190295918A1

    公开(公告)日：2019-09-26

    申请号：US15935622

    申请日：2018-03-26

    Applicant: Raytheon Company

    Inventor： Susan C. Trulli ,  Anurag Gupta

    IPC: H01L23/367 ,  H01L23/46 ,  H01L23/66 ,  H01L23/00 ,  H01L23/373

    Abstract: A Monolithic Integrated Circuit (MMIC) cooling structure having a heat spreader thermally comprising a anisotropic material, such material having anisotropic heat conducting properties for conducing heat therethrough along a preferred plane, a surface of the MMIC being thermally coupled to the heat spreader, the preferred plane intersecting the surface of the MMIC; and, a thermally conductive base having a side portion thermally coupled to the heat spreader, the side portion being disposed in a plane intersecting the preferred plane.

    Printed circuit board based RF circuit module
    17.
    发明授权
    Printed circuit board based RF circuit module 有权

    公开(公告)号：US10321555B1

    公开(公告)日：2019-06-11

    申请号：US16121007

    申请日：2018-09-04

    Applicant: Raytheon Company

    Inventor： Susan C. Trulli ,  Christopher M. Laighton ,  Elicia K. Harper

    IPC: H05K1/14 ,  H05K1/18 ,  H05K1/02 ,  H01P3/08 ,  H05K1/11

    Abstract: An RF circuit module having RF and DC contacts on a surface of a circuit board. An RF component having RF and DC contacts is disposed in a cavity of the circuit board. Electrical connectors bridge the cavity to connect the RF contacts on the circuit board to the RF contacts on the RE component and the DC, contacts on the circuit board to the DC contacts on the RF component. A plug member is disposed in the cavity which has a dielectric member with an outer portion disposed over the RF and DC contacts on the circuit board and an inner portion elevated above the RF and DC contacts the RF component. The plug member has one portion of electrical conductors disposed on an upper surface of the inner portion and another portion disposed under the outer portion on, and electrically connected to, the DC contacts on the circuit board.

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