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公开(公告)号：US08541829B2
公开(公告)日：2013-09-24
申请号：US13235948
申请日：2011-09-19
IPC分类号： H01L29/76 , H01L29/792
CPC分类号： H01L27/115 , G11C16/0416 , G11C16/0433 , G11C16/0483 , G11C16/30 , H01L27/11521 , H01L27/11524
摘要： A nonvolatile semiconductor memory includes a memory cell transistor including a first floating gate electrode layer formed on a first tunneling insulating film, a first inter-gate insulating film, first and second control gate electrode layers, and a first metallic silicide film; a high voltage transistor including a high voltage gate electrode layer formed on a high voltage gate insulating film, a second inter-gate insulating film having an aperture, third and fourth control gate electrode layers, and a second metallic silicide film; a low voltage transistor including a second floating gate electrode layer formed on a second tunneling insulating film, a third inter-gate insulating film having an aperture, fifth and sixth control gate electrode layers, and a third metallic silicide film; and a liner insulating film directly disposed on source and drain regions of each of the memory cell transistor, the low voltage transistor, and the high voltage transistor.
摘要翻译： 非易失性半导体存储器包括：存储单元晶体管，包括形成在第一隧穿绝缘膜上的第一浮栅电极层，第一栅间绝缘膜，第一和第二控制栅极电极层以及第一金属硅化物膜; 包括形成在高压栅极绝缘膜上的高电压栅极电极层，具有孔径的第二栅极间绝缘膜，第三和第四控制栅极电极层以及第二金属硅化物膜的高压晶体管; 包括形成在第二隧道绝缘膜上的第二浮栅电极层，具有孔的第三栅间绝缘膜，第五和第六控制栅电极层和第三金属硅化物膜的低压晶体管; 以及直接设置在每个存储单元晶体管，低压晶体管和高压晶体管的源极和漏极区域上的衬垫绝缘膜。
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公开(公告)号：US08084324B2
公开(公告)日：2011-12-27
申请号：US12720062
申请日：2010-03-09
IPC分类号： H01L21/8238 , H01L21/336 , H01L21/4763
CPC分类号： H01L27/115 , G11C16/0416 , G11C16/0433 , G11C16/0483 , G11C16/30 , H01L27/11521 , H01L27/11524
摘要： A nonvolatile semiconductor memory includes a memory cell transistor including a first floating gate electrode layer formed on a first tunneling insulating film, a first inter-gate insulating film, a first and a second control gate electrode layer, and a first metallic silicide film; a high voltage transistor including a high voltage gate electrode layer formed on the high voltage gate insulating film, a second inter-gate insulating film having an aperture, a third and a fourth control gate electrode layer, and a second metallic silicide film; a low voltage transistor including a second floating gate electrode layer formed on the second tunneling insulating film, a third inter-gate insulating film having an aperture, a fifth and a sixth control gate electrode layer, and a third metallic silicide film; and a liner insulating film directly disposed on a first source and drain region of the memory cell transistor, a second source and drain region of the low voltage transistor, and a third source and drain region of the high voltage transistor.
摘要翻译： 非易失性半导体存储器包括：存储单元晶体管，包括形成在第一隧道绝缘膜上的第一浮栅电极层，第一栅间绝缘膜，第一和第二控制栅极电极层和第一金属硅化物膜; 包括形成在高压栅极绝缘膜上的高电压栅极电极层，具有孔径的第二栅极间绝缘膜，第三和第四控制栅极电极层和第二金属硅化物膜的高压晶体管; 包括形成在第二隧道绝缘膜上的第二浮栅电极层，具有孔的第三栅间绝缘膜，第五和第六控制栅极电极层和第三金属硅化物膜的低压晶体管; 以及直接设置在存储单元晶体管的第一源极和漏极区域，低压晶体管的第二源极和漏极区域以及高压晶体管的第三源极和漏极区域中的衬垫绝缘膜。
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公开(公告)号：US20120037976A1
公开(公告)日：2012-02-16
申请号：US13235948
申请日：2011-09-19
IPC分类号： H01L27/105
CPC分类号： H01L27/115 , G11C16/0416 , G11C16/0433 , G11C16/0483 , G11C16/30 , H01L27/11521 , H01L27/11524
摘要： A nonvolatile semiconductor memory includes a memory cell transistor including a first floating gate electrode layer formed on a first tunneling insulating film, a first inter-gate insulating film, first and second control gate electrode layers, and a first metallic silicide film; a high voltage transistor including a high voltage gate electrode layer formed on a high voltage gate insulating film, a second inter-gate insulating film having an aperture, third and fourth control gate electrode layers, and a second metallic silicide film; a low voltage transistor including a second floating gate electrode layer formed on a second tunneling insulating film, a third inter-gate insulating film having an aperture, fifth and sixth control gate electrode layers, and a third metallic silicide film; and a liner insulating film directly disposed on source and drain regions of each of the memory cell transistor, the low voltage transistor, and the high voltage transistor.
摘要翻译： 非易失性半导体存储器包括：存储单元晶体管，包括形成在第一隧穿绝缘膜上的第一浮栅电极层，第一栅间绝缘膜，第一和第二控制栅极电极层以及第一金属硅化物膜; 包括形成在高压栅极绝缘膜上的高电压栅极电极层，具有孔径的第二栅极间绝缘膜，第三和第四控制栅极电极层以及第二金属硅化物膜的高压晶体管; 包括形成在第二隧道绝缘膜上的第二浮栅电极层，具有孔的第三栅间绝缘膜，第五和第六控制栅电极层和第三金属硅化物膜的低压晶体管; 以及直接设置在每个存储单元晶体管，低压晶体管和高压晶体管的源极和漏极区域上的衬垫绝缘膜。
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公开(公告)号：US20100173471A1
公开(公告)日：2010-07-08
申请号：US12720062
申请日：2010-03-09
IPC分类号： H01L21/336 , H01L21/762
CPC分类号： H01L27/115 , G11C16/0416 , G11C16/0433 , G11C16/0483 , G11C16/30 , H01L27/11521 , H01L27/11524
摘要： A nonvolatile semiconductor memory includes a memory cell transistor including a first floating gate electrode layer formed on a first tunneling insulating film, a first inter-gate insulating film, a first and a second control gate electrode layer, and a first metallic silicide film; a high voltage transistor including a high voltage gate electrode layer formed on the high voltage gate insulating film, a second inter-gate insulating film having an aperture, a third and a fourth control gate electrode layer, and a second metallic silicide film; a low voltage transistor including a second floating gate electrode layer formed on the second tunneling insulating film, a third inter-gate insulating film having an aperture, a fifth and a sixth control gate electrode layer, and a third metallic silicide film; and a liner insulating film directly disposed on a first source and drain region of the memory cell transistor, a second source and drain region of the low voltage transistor, and a third source and drain region of the high voltage transistor.
摘要翻译： 非易失性半导体存储器包括：存储单元晶体管，包括形成在第一隧道绝缘膜上的第一浮栅电极层，第一栅间绝缘膜，第一和第二控制栅极电极层和第一金属硅化物膜; 包括形成在高压栅极绝缘膜上的高电压栅极电极层，具有孔径的第二栅极间绝缘膜，第三和第四控制栅极电极层和第二金属硅化物膜的高压晶体管; 包括形成在第二隧道绝缘膜上的第二浮栅电极层，具有孔的第三栅间绝缘膜，第五和第六控制栅极电极层和第三金属硅化物膜的低压晶体管; 以及直接设置在存储单元晶体管的第一源极和漏极区域，低压晶体管的第二源极和漏极区域以及高压晶体管的第三源极和漏极区域中的衬垫绝缘膜。
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15.发明授权Nonvolatile semicondutor memory with metallic silicide film electrically connected to a control gate electrode layer 失效非易失性半导体存储器，其与金属硅化物膜电连接到控制栅电极层公开(公告)号：US07705394B2
公开(公告)日：2010-04-27
申请号：US11553661
申请日：2006-10-27
IPC分类号： H01L27/115
CPC分类号： H01L27/115 , G11C16/0416 , G11C16/0433 , G11C16/0483 , G11C16/30 , H01L27/11521 , H01L27/11524
摘要： A nonvolatile semiconductor memory includes a memory cell transistor including a first floating gate electrode layer formed on a first tunneling insulating film, a first inter-gate insulating film, first and second control gate electrode layers, and a first metallic silicide film; a high voltage transistor including a high voltage gate electrode layer formed on the high voltage gate insulating film, a second inter-gate insulating film having an aperture, third and fourth control gate electrode layers, and a second metallic silicide film; a low voltage transistor including a second floating gate electrode layer formed on a second tunneling insulating film, a third inter-gate insulating film having an aperture, fifth and sixth control gate electrode layers, and a third metallic silicide film; and a liner insulating film directly disposed on first, second and third source and drain regions of the memory cell transistor, low voltage transistor, and high voltage transistor, respectively.
摘要翻译： 非易失性半导体存储器包括：存储单元晶体管，包括形成在第一隧穿绝缘膜上的第一浮栅电极层，第一栅间绝缘膜，第一和第二控制栅极电极层以及第一金属硅化物膜; 包括形成在高电压栅极绝缘膜上的高电压栅极电极层，具有孔径的第二栅极间绝缘膜，第三和第四控制栅极电极层以及第二金属硅化物膜的高压晶体管; 包括形成在第二隧道绝缘膜上的第二浮栅电极层，具有孔的第三栅间绝缘膜，第五和第六控制栅电极层和第三金属硅化物膜的低压晶体管; 以及分别直接设置在存储单元晶体管，低压晶体管和高压晶体管的第一，第二和第三源极和漏极区上的衬垫绝缘膜。
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公开(公告)号：US07692252B2
公开(公告)日：2010-04-06
申请号：US11567805
申请日：2006-12-07
申请人： Atsuhiro Sato , Kikuko Sugimae , Masayuki Ichige
发明人： Atsuhiro Sato , Kikuko Sugimae , Masayuki Ichige
CPC分类号： H01L27/11519 , H01L27/0207 , H01L27/105 , H01L27/115 , H01L27/11521 , H01L27/11524 , H01L27/11529
摘要： A semiconductor integrated circuit device includes a cell well, a memory cell array formed on the cell well and having a memory cell area and cell well contact area, first wiring bodies arranged in the memory cell area, and second wiring bodies arranged in the cell well contact area. The layout pattern of the second wiring bodies is the same as the layout pattern of the first wiring bodies. The cell well contact area comprises cell well contacts that have the same dopant type as the cell well and that function as source/drain regions of dummy transistors formed in the cell well contact area.
摘要翻译： 一种半导体集成电路器件，包括：单元阱，形成在单元阱上的存储单元阵列，具有存储单元区域和单元阱接触区域，布置在存储单元区域中的第一布线体以及布置在单元阱中的第二布线体 接触面积 第二布线体的布局图案与第一布线体的布局图形相同。 电池阱接触区域包括具有与电池阱相同的掺杂剂类型的电池阱触点，并且用作在电池阱接触区域中形成的虚拟晶体管的源极/漏极区域。
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公开(公告)号：US20070096218A1
公开(公告)日：2007-05-03
申请号：US11567805
申请日：2006-12-07
申请人： Atsuhiro Sato , Kikuko Sugimae , Masayuki Ichige
发明人： Atsuhiro Sato , Kikuko Sugimae , Masayuki Ichige
IPC分类号： H01L29/94
CPC分类号： H01L27/11519 , H01L27/0207 , H01L27/105 , H01L27/115 , H01L27/11521 , H01L27/11524 , H01L27/11529
摘要： A semiconductor integrated circuit device includes a cell well, a memory cell array formed on the cell well and having a memory cell area and cell well contact area, first wiring bodies arranged in the memory cell area, and second wiring bodies arranged in the cell well contact area. The layout pattern of the second wiring bodies is the same as the layout pattern of the first wiring bodies. The cell well contact area comprises cell well contacts that have the same dopant type as the cell well and that function as source/drain regions of dummy transistors formed in the cell well contact area.
摘要翻译： 一种半导体集成电路器件，包括：单元阱，形成在单元阱上的存储单元阵列，具有存储单元区域和单元阱接触区域，布置在存储单元区域中的第一布线体以及布置在单元阱中的第二布线体 接触面积 第二布线体的布局图案与第一布线体的布局图形相同。 电池阱接触区域包括具有与电池阱相同的掺杂剂类型的电池阱触点，并且用作在电池阱接触区域中形成的虚拟晶体管的源极/漏极区域。
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公开(公告)号：US07919823B2
公开(公告)日：2011-04-05
申请号：US12716322
申请日：2010-03-03
申请人： Atsuhiro Sato , Kikuko Sugimae , Masayuki Ichige
发明人： Atsuhiro Sato , Kikuko Sugimae , Masayuki Ichige
CPC分类号： H01L27/11519 , H01L27/0207 , H01L27/105 , H01L27/115 , H01L27/11521 , H01L27/11524 , H01L27/11529
摘要： A semiconductor integrated circuit device includes a cell well, a memory cell array formed on the cell well and having a memory cell area and cell well contact area, first wiring bodies arranged in the memory cell area, and second wiring bodies arranged in the cell well contact area. The layout pattern of the second wiring bodies is the same as the layout pattern of the first wiring bodies. The cell well contact area comprises cell well contacts that have the same dopant type as the cell well and that function as source/drain regions of dummy transistors formed in the cell well contact area.
摘要翻译： 一种半导体集成电路器件，包括：单元阱，形成在单元阱上的存储单元阵列，具有存储单元区域和单元阱接触区域，布置在存储单元区域中的第一布线体以及布置在单元阱中的第二布线体 接触面积 第二布线体的布局图案与第一布线体的布局图形相同。 电池阱接触区域包括具有与电池阱相同的掺杂剂类型的电池阱触点，并且用作在电池阱接触区域中形成的虚拟晶体管的源极/漏极区域。
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公开(公告)号：US20070109848A1
公开(公告)日：2007-05-17
申请号：US11553661
申请日：2006-10-27
IPC分类号： G11C16/04
CPC分类号： H01L27/115 , G11C16/0416 , G11C16/0433 , G11C16/0483 , G11C16/30 , H01L27/11521 , H01L27/11524
摘要： A nonvolatile semiconductor memory includes a memory cell transistor including a first floating gate electrode layer formed on a first tunneling insulating film, a first inter-gate insulating film, a first and a second control gate electrode layer, and a first metallic silicide film; a high voltage transistor including a high voltage gate electrode layer formed on the high voltage gate insulating film, a second inter-gate insulating film having an aperture, a third and a fourth control gate electrode layer, and a second metallic silicide film; a low voltage transistor including a second floating gate electrode layer formed on the second tunneling insulating film, a third inter-gate insulating film having an aperture, a fifth and a sixth control gate electrode layer, and a third metallic silicide film; and a liner insulating film directly disposed on a first source and drain region of the memory cell transistor, a second source and drain region of the low voltage transistor, and a third source and drain region of the high voltage transistor.
摘要翻译： 非易失性半导体存储器包括：存储单元晶体管，包括形成在第一隧道绝缘膜上的第一浮栅电极层，第一栅间绝缘膜，第一和第二控制栅极电极层和第一金属硅化物膜; 包括形成在高压栅极绝缘膜上的高电压栅极电极层，具有孔径的第二栅极间绝缘膜，第三和第四控制栅极电极层和第二金属硅化物膜的高压晶体管; 包括形成在第二隧道绝缘膜上的第二浮栅电极层，具有孔的第三栅间绝缘膜，第五和第六控制栅极电极层和第三金属硅化物膜的低压晶体管; 以及直接设置在存储单元晶体管的第一源极和漏极区域，低压晶体管的第二源极和漏极区域以及高压晶体管的第三源极和漏极区域中的衬垫绝缘膜。
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公开(公告)号：US20060189092A1
公开(公告)日：2006-08-24
申请号：US11395134
申请日：2006-04-03
申请人： Atsuhiro Sato , Masayuki Ichige , Seiichi Mori , Yuji Takeuchi , Hiroaki Hazama , Yukio Nishiyama , Hirotaka Ogihara , Naruhiko Kaji
发明人： Atsuhiro Sato , Masayuki Ichige , Seiichi Mori , Yuji Takeuchi , Hiroaki Hazama , Yukio Nishiyama , Hirotaka Ogihara , Naruhiko Kaji
IPC分类号： H01L21/76
CPC分类号： H01L21/76224
摘要： Forming of a first silicon oxide film is started on an internal surface of a trench formed on a surface or upwardly of a semiconductor substrate according to an HDP technique. Then, deposition of the first silicon oxide film stops before an opening of the trench closes. Further, the first silicon oxide film deposited in the vicinity of an opening is etched, and a second silicon oxide film is formed on the first silicon oxide film deposited on the bottom of the trench according to the HDP technique. In this manner, the first and second silicon oxide films can be laminated on the bottom of the trench.
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