公开(公告)号：US20210181799A1

公开(公告)日：2021-06-17

申请号：US16821035

申请日：2020-03-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Ho SHIN ,  Ju Ho KIM

IPC: G06F1/16 ,  G09F9/30

Abstract: The present disclosure relates to a printed circuit board, a display device including the same, and a manufacturing method therefor. The printed circuit board includes a rigid region; and a flexible region comprising a flexible layer having a first surface and a second surface on an opposite side to the first surface, a reinforcing structure disposed on the first surface of the flexible layer, and a conductor pattern disposed on the second surface of the flexible layer. A material of the reinforcing structure has a coefficient of thermal expansion lower than that of a material of the flexible layer.

公开(公告)号：US20180146553A1

公开(公告)日：2018-05-24

申请号：US15876702

申请日：2018-01-22

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Yang Je LEE ,  Jae Ho SHIN ,  Dek Gin YANG

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/28 ,  H05K3/02 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0278 ,  H05K1/0298 ,  H05K1/118 ,  H05K3/0026 ,  H05K3/0058 ,  H05K3/02 ,  H05K3/027 ,  H05K3/285 ,  H05K3/4644 ,  H05K3/4691 ,  H05K2201/0154 ,  Y10T156/10 ,  Y10T156/1064 ,  Y10T156/1082

Abstract: A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.

公开(公告)号：US20170027055A1

公开(公告)日：2017-01-26

申请号：US15285390

申请日：2016-10-04

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Yang Je LEE ,  Jae Ho SHIN ,  Ha Il KIM ,  Dek Gin YANG

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0278 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/0032 ,  H05K3/0047 ,  H05K3/429 ,  H05K3/4652 ,  H05K3/4691

Abstract: The present invention relates to a method of manufacturing a flying tail type rigid-flexible printed circuit board and a flying tail type rigid-flexible printed circuit board manufactured by the same and implement a flying tail type rigid-flexible printed circuit board with improved filling property by providing a method of manufacturing a flying tail type rigid-flexible printed circuit board including: providing a base substrate having a first inner circuit pattern layer on both surfaces; laminating a first insulating layer on a rigid domain R of the base substrate; laminating at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer; and removing a portion of the circuit layer, which corresponds to a flexible domain F, wherein the circuit layer includes a second insulating layer and a flying tail type rigid-flexible printed circuit board manufactured by the same.

Abstract translation: 本发明涉及一种制造飞尾型刚柔柔性印刷电路板的方法及其制造的飞尾型刚柔柔性印刷电路板，并实现具有改善填充性能的飞尾型刚挠性印刷电路板 通过提供一种制造飞尾型刚性 - 柔性印刷电路板的方法，包括：提供在两个表面上具有第一内部电路图案层的基底基板; 在基底基板的刚性区域R上层叠第一绝缘层; 将在基底衬底的整个区域上延伸的至少一个电路层层叠在第一绝缘层上; 并且去除对应于柔性域F的电路层的一部分，其中电路层包括第二绝缘层和由其制造的飞尾型刚柔柔性印刷电路板。

公开(公告)号：US20150027627A1

公开(公告)日：2015-01-29

申请号：US14513421

申请日：2014-10-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yang Je LEE ,  Jae Ho SHIN ,  Dek Gin YANG

IPC: H05K3/00 ,  H05K3/02

CPC classification number: H05K1/0278 ,  H05K1/0298 ,  H05K1/118 ,  H05K3/0026 ,  H05K3/0058 ,  H05K3/02 ,  H05K3/027 ,  H05K3/285 ,  H05K3/4644 ,  H05K3/4691 ,  H05K2201/0154 ,  Y10T156/10 ,  Y10T156/1064 ,  Y10T156/1082

Abstract: A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.

Abstract translation: 一种刚性柔性印刷电路板的制造方法，其特征在于，包括：在一个或两个表面上提供具有第一金属层的第一柔性膜; 通过图案化所述第一金属层形成电路图案; 在所述第一柔性膜的一个或两个表面上形成第二柔性膜，所述第二柔性膜在一个表面上具有第二金属层; 通过在刚性区域R中图案化第二金属层来形成电路图案; 在柔性区域F中的第二金属层上提供抗氧化保护层; 在所述第二柔性膜上层叠至少一个电路层; 并移除柔性区域F中的电路层。

公开(公告)号：US20140021164A1

公开(公告)日：2014-01-23

申请号：US14031779

申请日：2013-09-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yang Je LEE ,  Dek Gin YANG ,  Dong Gi AN ,  Jae Ho SHIN

IPC: H05K3/06

Abstract: A method for manufacturing a multilayer rigid flexible printed circuit board that includes a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region.

Abstract translation: 一种多层刚性柔性印刷电路板的制造方法，其特征在于，包括具有在其一面或两面上形成有电路图案的柔性膜的柔性区域和形成在所述电路图案上的激光阻挡层。 以及刚性区域，其形成在柔性区域附近并且在延伸部分的一个或两个表面上包括延伸到柔性区域的柔性膜的两侧的多个图案层。