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公开(公告)号：US20180302979A1
公开(公告)日：2018-10-18
申请号：US16018430
申请日：2018-06-26
发明人： Yang Je LEE , Jae Ho SHIN , Ha Il KIM , Dek Gin YANG
摘要： The present invention relates to a method of manufacturing a flying tail type rigid-flexible printed circuit board and a flying tail type rigid-flexible printed circuit board manufactured by the same and implement a flying tail type rigid-flexible printed circuit board with improved filling property by providing a method of manufacturing a flying tail type rigid-flexible printed circuit board including: providing a base substrate having a first inner circuit pattern layer on both surfaces; laminating a first insulating layer on a rigid domain R of the base substrate; laminating at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer; and removing a portion of the circuit layer, which corresponds to a flexible domain F, wherein the circuit layer includes a second insulating layer and a flying tail type rigid-flexible printed circuit board manufactured by the same.
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公开(公告)号：US20160345431A1
公开(公告)日：2016-11-24
申请号：US15228304
申请日：2016-08-04
发明人： Yang Je LEE , Jae Ho SHIN , Dek Gin YANG
CPC分类号： H05K1/0278 , H05K1/0298 , H05K1/118 , H05K3/0026 , H05K3/0058 , H05K3/02 , H05K3/027 , H05K3/285 , H05K3/4644 , H05K3/4691 , H05K2201/0154 , Y10T156/10 , Y10T156/1064 , Y10T156/1082
摘要： A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.
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公开(公告)号：US20150253909A1
公开(公告)日：2015-09-10
申请号：US14341096
申请日：2014-07-25
发明人： Gyu Seok KIM , Hee Suk CHUNG , Dong Yong KIM , Dek Gin YANG , Mi Yang KIM , Tae Young KIM
IPC分类号： G06F3/047
CPC分类号： G06F3/047
摘要： Embodiments of the invention provide a touch sensor including a base substrate, and an electrode pattern formed on the base substrate. The electrode pattern is formed by continuously connecting one or more unit patterns, and each unit pattern has closed figures formed to be irregularly arranged therein.
摘要翻译： 本发明的实施例提供一种触摸传感器，其包括基底基板和形成在基底基板上的电极图案。 电极图案通过连续地连接一个或多个单元图案而形成，并且每个单元图案具有形成为不规则地布置在其中的封闭图形。
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公开(公告)号：US20180376584A1
公开(公告)日：2018-12-27
申请号：US16118558
申请日：2018-08-31
发明人： Yang Je LEE , Jae Ho SHIN , Dek Gin YANG
摘要： A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.
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公开(公告)号：US20170118833A1
公开(公告)日：2017-04-27
申请号：US15398803
申请日：2017-01-05
发明人： Yang Je LEE , Dek Gin YANG , Dong Gi AN , Jae Ho SHIN
CPC分类号： H05K3/06 , H05K1/0218 , H05K1/0278 , H05K1/028 , H05K1/09 , H05K3/0035 , H05K3/281 , H05K3/386 , H05K3/4644 , H05K3/4652 , H05K3/4691 , H05K2201/0154 , H05K2201/0187 , H05K2201/0707 , H05K2203/0554 , H05K2203/1152 , Y10T29/49128 , Y10T29/49165
摘要： The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.
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公开(公告)号：US20130220535A1
公开(公告)日：2013-08-29
申请号：US13771834
申请日：2013-02-20
发明人： Yang Je LEE , Jae Ho SHIN , Dek Gin YANG
IPC分类号： H05K3/00
CPC分类号： H05K1/0278 , H05K1/0298 , H05K1/118 , H05K3/0026 , H05K3/0058 , H05K3/02 , H05K3/027 , H05K3/285 , H05K3/4644 , H05K3/4691 , H05K2201/0154 , Y10T156/10 , Y10T156/1064 , Y10T156/1082
摘要： The present invention relates to a method of manufacturing a rigid-flexible printed circuit board including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.
摘要翻译： 本发明涉及制造刚柔柔性印刷电路板的方法，包括：在一个或两个表面上提供具有第一金属层的第一柔性膜; 通过图案化所述第一金属层形成电路图案; 在所述第一柔性膜的一个或两个表面上形成第二柔性膜，所述第二柔性膜在一个表面上具有第二金属层; 通过在刚性区域R中图案化第二金属层来形成电路图案; 在柔性区域F中的第二金属层上提供抗氧化保护层; 在所述第二柔性膜上层叠至少一个电路层; 并移除柔性区域F中的电路层。
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公开(公告)号：US20180146553A1
公开(公告)日：2018-05-24
申请号：US15876702
申请日：2018-01-22
发明人： Yang Je LEE , Jae Ho SHIN , Dek Gin YANG
CPC分类号： H05K1/0278 , H05K1/0298 , H05K1/118 , H05K3/0026 , H05K3/0058 , H05K3/02 , H05K3/027 , H05K3/285 , H05K3/4644 , H05K3/4691 , H05K2201/0154 , Y10T156/10 , Y10T156/1064 , Y10T156/1082
摘要： A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.
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公开(公告)号：US20170027055A1
公开(公告)日：2017-01-26
申请号：US15285390
申请日：2016-10-04
发明人： Yang Je LEE , Jae Ho SHIN , Ha Il KIM , Dek Gin YANG
CPC分类号： H05K1/0278 , H05K1/0298 , H05K1/115 , H05K3/0032 , H05K3/0047 , H05K3/429 , H05K3/4652 , H05K3/4691
摘要： The present invention relates to a method of manufacturing a flying tail type rigid-flexible printed circuit board and a flying tail type rigid-flexible printed circuit board manufactured by the same and implement a flying tail type rigid-flexible printed circuit board with improved filling property by providing a method of manufacturing a flying tail type rigid-flexible printed circuit board including: providing a base substrate having a first inner circuit pattern layer on both surfaces; laminating a first insulating layer on a rigid domain R of the base substrate; laminating at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer; and removing a portion of the circuit layer, which corresponds to a flexible domain F, wherein the circuit layer includes a second insulating layer and a flying tail type rigid-flexible printed circuit board manufactured by the same.
摘要翻译： 本发明涉及一种制造飞尾型刚柔柔性印刷电路板的方法及其制造的飞尾型刚柔柔性印刷电路板，并实现具有改善填充性能的飞尾型刚挠性印刷电路板 通过提供一种制造飞尾型刚性 - 柔性印刷电路板的方法，包括：提供在两个表面上具有第一内部电路图案层的基底基板; 在基底基板的刚性区域R上层叠第一绝缘层; 将在基底衬底的整个区域上延伸的至少一个电路层层叠在第一绝缘层上; 并且去除对应于柔性域F的电路层的一部分，其中电路层包括第二绝缘层和由其制造的飞尾型刚柔柔性印刷电路板。
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公开(公告)号：US20150027627A1
公开(公告)日：2015-01-29
申请号：US14513421
申请日：2014-10-14
发明人： Yang Je LEE , Jae Ho SHIN , Dek Gin YANG
CPC分类号： H05K1/0278 , H05K1/0298 , H05K1/118 , H05K3/0026 , H05K3/0058 , H05K3/02 , H05K3/027 , H05K3/285 , H05K3/4644 , H05K3/4691 , H05K2201/0154 , Y10T156/10 , Y10T156/1064 , Y10T156/1082
摘要： A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.
摘要翻译： 一种刚性柔性印刷电路板的制造方法，其特征在于，包括：在一个或两个表面上提供具有第一金属层的第一柔性膜; 通过图案化所述第一金属层形成电路图案; 在所述第一柔性膜的一个或两个表面上形成第二柔性膜，所述第二柔性膜在一个表面上具有第二金属层; 通过在刚性区域R中图案化第二金属层来形成电路图案; 在柔性区域F中的第二金属层上提供抗氧化保护层; 在所述第二柔性膜上层叠至少一个电路层; 并移除柔性区域F中的电路层。
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10.发明申请公开(公告)号：US20140021164A1
公开(公告)日：2014-01-23
申请号：US14031779
申请日：2013-09-19
发明人： Yang Je LEE , Dek Gin YANG , Dong Gi AN , Jae Ho SHIN
IPC分类号： H05K3/06
摘要： A method for manufacturing a multilayer rigid flexible printed circuit board that includes a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region.
摘要翻译： 一种多层刚性柔性印刷电路板的制造方法，其特征在于，包括具有在其一面或两面上形成有电路图案的柔性膜的柔性区域和形成在所述电路图案上的激光阻挡层。 以及刚性区域，其形成在柔性区域附近并且在延伸部分的一个或两个表面上包括延伸到柔性区域的柔性膜的两侧的多个图案层。
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