公开(公告)号：US20140035130A1

公开(公告)日：2014-02-06

申请号：US13845108

申请日：2013-03-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Won Choi ,  Yon Ho You

IPC: H01L21/768 ,  H01L23/498

CPC classification number: H01L24/16 ,  H01L21/76895 ,  H01L23/49816 ,  H01L23/49894 ,  H01L24/81 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Disclosed herein a packaging method including: (A) forming a plurality of pads and another circuit pattern on a substrate; (B) forming a second dry film pattern including opening exposing the pad; (C) mounting a solder coating ball in the opening of the second dry film pattern; (D) performing a reflow process on the solder coating ball in order to allow the solder coating ball to have a modified pattern; (E) delaminating the second dry film pattern; and (F) forming a solder pattern including the modified pattern of the solder coating ball in a solder to mount a chip on the substrate using the solder pattern.

Abstract translation: 本文公开了一种包装方法，包括：（A）在基板上形成多个焊盘和另一电路图案; （B）形成包括露出所述垫的开口的第二干膜图案; （C）将焊锡涂层球安装在第二干膜图案的开口中; （D）对焊料涂层球进行回流处理，以使焊料涂层球具有改性图案; （E）分层第二干膜图案; 和（F）在焊料中形成包括焊料涂覆球的改进图案的焊料图案，以使用焊料图案将芯片安装在基板上。

公开(公告)号：US20140034707A1

公开(公告)日：2014-02-06

申请号：US13664035

申请日：2012-10-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Won Choi ,  Yon Ho You ,  Ki Ju Lee

IPC: B23K3/06

CPC classification number: B23K3/0623

Abstract: Disclosed herein a solder injection head including: a bump material storing part having a bump material stored therein; a discharging part having one side connected to the bump material storing part and discharging the bump material to the outside; a heating part formed at at least one side of the discharging part and heating the bump material passing through the discharging part; and a press-fitting part press-fitting the bump material discharged to the outside and injecting the bump material onto a substrate.

Abstract translation: 本文公开了一种焊料注入头，包括：凸块材料存储部分，其中存储有凸块材料; 排出部分，其一侧连接到凸块材料存储部分，并将凸块材料排出到外部; 加热部，其形成在所述排出部的至少一侧，并加热通过所述排出部的所述凸块材料; 以及压配部件，将排出到外部的凸块材料压入，并将凸块材料注入到基板上。

公开(公告)号：US20130306709A1

公开(公告)日：2013-11-21

申请号：US13894312

申请日：2013-05-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hueng Jae Oh ,  Yon Ho You ,  Jin Won Choi

IPC: B23K3/06

CPC classification number: B23K3/0623

Abstract: Disclosed herein is a solder ball supplying apparatus including: a cartridge formed in a box shape and having a plurality of solder balls embedded therein; a vibration unit coupled to a lower portion of the cartridge; and a metal mask coupled integrally with a lower portion of the vibration unit and having a plurality of holes formed over the entire surface thereof.

Abstract translation: 本发明公开了一种焊球供给装置，其特征在于，包括：盒形状，盒内嵌有多个焊球; 耦合到所述盒的下部的振动单元; 以及金属掩模，与所述振动单元的下部一体地结合，并且在其整个表面上形成有多个孔。