公开(公告)号：US08883016B2

公开(公告)日：2014-11-11

申请号：US14042616

申请日：2013-09-30

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Joon Lee ,  Jin Yong Ahn ,  Suk Hyeon Cho ,  Ki Hwan Kim ,  Seok Kyu Lee

IPC: H01B13/00 ,  H05K3/00 ,  B32B15/00 ,  B32B7/04 ,  H05K3/20

CPC classification number: H05K3/007 ,  B32B3/10 ,  B32B3/14 ,  B32B3/18 ,  B32B7/04 ,  B32B15/00 ,  B32B15/043 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B2457/08 ,  H05K3/0097 ,  H05K3/205 ,  H05K2201/0355 ,  Y10T156/10 ,  Y10T156/1052 ,  Y10T428/12 ,  Y10T428/12229 ,  Y10T428/12264 ,  Y10T428/12271 ,  Y10T428/161 ,  Y10T428/19 ,  Y10T428/192 ,  Y10T428/239 ,  Y10T428/24917

Abstract: Disclosed is a carrier for manufacturing a printed circuit board, which includes a first carrier including a first binder having a first opening and a first metal layer formed in the first opening of the first binder, and a second carrier, stacked with the first carrier and including a second binder having a second opening and a second metal layer which is formed in the second opening of the second binder and which partially overlaps with the first metal layer, so that the carrier is simply configured and the binders are formed not only on the lateral surfaces of the metal layers but also on the upper surfaces thereof, thus improving the reliability of bonding of the carrier at the periphery. A method of manufacturing the carrier and a method of manufacturing a printed circuit board using the carrier are also provided.

Abstract translation: 公开了一种用于制造印刷电路板的载体，其包括第一载体，其包括具有第一开口的第一粘合剂和形成在第一粘合剂的第一开口中的第一金属层，以及与第一载体堆叠的第二载体， 包括具有第二开口的第二粘合剂和形成在第二粘合剂的第二开口中并且与第一金属层部分重叠的第二金属层，使得载体被简单地构造，并且粘结剂不仅形成在 金属层的侧面，也在其上表面，从而提高载体在周边的接合的可靠性。 还提供了制造载体的方法和使用该载体制造印刷电路板的方法。

公开(公告)号：US20140166348A1

公开(公告)日：2014-06-19

申请号：US14106135

申请日：2013-12-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Suk Hyeon Cho

IPC: H05K1/02

CPC classification number: H05K1/0271 ,  H05K1/0373 ,  H05K3/285 ,  H05K3/4655 ,  H05K2201/068

Abstract: Disclosed herein is a printed circuit board capable of suppressing warpage due to a difference in thermal expansion coefficients with circuit patterns in the same layer by way of forming a filling material having a thermal expansion coefficient similar to that of the circuit pattern between the circuit patterns and on the surface. Further, on a surface of the filling material, a laminate having a thermal expansion amount lower than that of the filling material so that overall thermal expansion coefficients of the printed circuit board is lowered, and an insulation material having a lower thermal expansion coefficient and thus rarely flowing is easily attached.

Abstract translation: 这里公开了一种印刷电路板，其能够通过形成具有与电路图案和电路图案之间的电路图案的热膨胀系数相似的热膨胀系数的填充材料，来抑制由于与同一层中的电路图案的热膨胀系数的差异而产生的翘曲 在表面上。 此外，在填充材料的表面上，具有低于填充材料的热膨胀量的层压体，使得印刷电路板的整体热膨胀系数降低，并且具有较低热膨胀系数的绝缘材料 很少流动很容易附着。