公开(公告)号：US20200083179A1

公开(公告)日：2020-03-12

申请号：US16203053

申请日：2018-11-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Doo Hwan LEE ,  Yong Hoon KIM ,  Tae Je CHO ,  Jin Won LEE

IPC: H01L23/00 ,  H01L23/498

Abstract: A substrate having an embedded interconnect structure includes an interconnect structure including a circuit member including circuit layers and a passive device disposed in parallel with the circuit member and including an external electrode, and a printed circuit board including an insulating layer covering the interconnect structure, a first wiring layer disposed on the insulating layer, a first wiring via penetrating through at least a portion of the insulating layer and electrically connecting the first wiring layer to an uppermost circuit layer, among the circuit layers, and a second wiring via penetrating through at least a portion of the insulating layer and electrically connecting the first wiring layer to the external electrode of the passive device. A top surface of the uppermost circuit layer, contacting the first wiring via, is coplanar with a top surface of the external electrode, contacting the second wiring via.

公开(公告)号：US20240172368A1

公开(公告)日：2024-05-23

申请号：US18202808

申请日：2023-05-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yun Je JI ,  Yong Hoon KIM ,  Seung Eun LEE ,  Joo Hwan JUNG

IPC: H05K1/18 ,  H01L23/00 ,  H01L25/065 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K1/185 ,  H01L24/16 ,  H01L25/0657 ,  H05K1/112 ,  H05K3/4697 ,  H01L2224/16227 ,  H01L2225/06503 ,  H01L2924/12 ,  H05K2201/096

Abstract: A printed circuit board includes: a first board unit including a plurality of first insulating layers and a plurality of first wiring layers respectively disposed on or in the plurality of first insulating layers; a second board unit including one or more second insulating layers and one or more second wiring layers respectively disposed on or in the one or more second insulating layers; and a first passive device embedded in at least one of the first and second board units. The second board unit is disposed on the first board unit, and the first board unit has a second cavity passing through at least a portion of the plurality of first insulating layers on the first passive device based on a stacking direction of the plurality of first wiring layers.

公开(公告)号：US20230178902A1

公开(公告)日：2023-06-08

申请号：US17718708

申请日：2022-04-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Moon Hee YI ,  Hae Kyo SEO ,  Yong Hoon KIM ,  Seung Eun LEE

IPC: H01Q21/08 ,  H01Q1/24 ,  H01Q9/04 ,  H01Q1/48

CPC classification number: H01Q21/08 ,  H01Q1/243 ,  H01Q9/0407 ,  H01Q1/48

Abstract: An antenna substrate includes a skin layer containing an insulating material, a ground layer containing a conductive material, an insulating layer disposed between the skin layer and the ground layer and including an insulating material different from the insulating material of the skin layer, a plurality of patch antennas disposed between the ground layer and the skin layer, a shielding member disposed between the ground layer and the skin layer, spaced apart from the plurality of patch antennas, and connected to the ground layer, and a shielding post connected to the shielding member, and protruding further than an outer surface of the skin layer, from the shielding member in a direction facing the skin layer, at least a portion of the shielding post being disposed between the plurality of patch antennas.

公开(公告)号：US20210289629A1

公开(公告)日：2021-09-16

申请号：US16902738

申请日：2020-06-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Eun LEE ,  Yong Hoon KIM ,  Jin Won LEE

IPC: H05K1/18 ,  H05K1/14 ,  H05K1/11 ,  H01L23/498

Abstract: A substrate structure includes a first printed circuit board having a first side and a second side opposing each other, and a plurality of passive components connected to the first side of the first printed circuit board. The plurality of passive components includes a first group, including a plurality of first passive components disposed adjacent to each other, and a second group, including a plurality of second passive components disposed adjacent to each other. A smallest distance between the first and second groups is greater than at least one of a smallest distance between adjacent first passive components of the plurality of first passive components and a smallest distance between adjacent second passive components of the plurality of second passive components. An electronic device includes a first printed circuit board disposed on a mainboard and having, on opposite sides thereof, a semiconductor chip and a plurality of passive components.