公开(公告)号：US20180068952A1

公开(公告)日：2018-03-08

申请号：US15799624

申请日：2017-10-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Moon Hee YI ,  Joo Hwan JUNG ,  Yul Kyo CHUNG

IPC: H01L23/538 ,  H01L23/367 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/5389 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/14 ,  H01L24/20 ,  H01L2224/02311 ,  H01L2224/02379 ,  H01L2224/0239 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/13023 ,  H01L2224/13024 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/14131 ,  H01L2224/14177 ,  H01L2224/19 ,  H01L2224/215 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1579 ,  H01L2924/186 ,  H01L2924/19105 ,  H01L2924/3025

Abstract: A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first connection member and the inactive surface of the semiconductor chip; a pattern layer disposed on the encapsulant and covering at least portions of the encapsulant adjacent to the inactive surface of the semiconductor chip; vias penetrating through the encapsulant and connecting the pattern layer and the inactive surface of the semiconductor chip to each other; and a second connection member disposed on the first connection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads of the semiconductor chip.

公开(公告)号：US20180053732A1

公开(公告)日：2018-02-22

申请号：US15667315

申请日：2017-08-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong Ho BAEK ,  Moon Hee YI ,  Kyung Sang LIM

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/538 ,  H01L23/13

CPC classification number: H01L23/552 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/20 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00012

Abstract: A fan-out semiconductor package includes a semiconductor chip disposed in a through-hole of a first connection member having the through-hole and a second connection member disposed on an active surface of the semiconductor chip. A plurality of dummy vias surrounding the semiconductor chip are disposed in the first connection member.

公开(公告)号：US20180182691A1

公开(公告)日：2018-06-28

申请号：US15647961

申请日：2017-07-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jung Hyun CHO ,  Yong Ho BAEK ,  Jun Oh HWANG ,  Joo Hwan JUNG ,  Moon Hee YI

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L23/522 ,  H01L23/367

CPC classification number: H01L23/49503 ,  H01L23/3107 ,  H01L23/3677 ,  H01L23/5226 ,  H01L23/525 ,  H01L23/5389 ,  H01L24/09 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24195 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15172 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/37001

Abstract: A fan-out semiconductor package includes: a first connection member having a through-hole and having a passive component disposed in the first connection member; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface having connection pads disposed therein and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first connection member and the inactive surface of the semiconductor chip; and a second connection member disposed on the first connection member and the active surface of the semiconductor chip. The first connection member and the second connection member include, respectively, redistribution layers electrically connected to the connection pads of the semiconductor chip, and the passive component is electrically connected to the connection pads of the semiconductor chip through the redistribution layer of the second connection member.

公开(公告)号：US20180145033A1

公开(公告)日：2018-05-24

申请号：US15663042

申请日：2017-07-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Moon Hee YI ,  Byoung Chan KIM ,  Yong Ho BAEK ,  Jung Hyun CHO

IPC: H01L23/538 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L23/5389 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/5384 ,  H01L24/02 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/25 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/13024 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/25171 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/18162 ,  H01L2924/19105 ,  H01L2924/00

Abstract: A fan-out semiconductor package includes a first connection member having a through-hole, a semiconductor chip disposed in the through-hole, at least one component-embedded substrate disposed adjacent the semiconductor chip in the through-hole and spaced apart from the semiconductor chip by a predetermined distance and having a plurality of passive components embedded therein, an encapsulant encapsulating at least portions of the first connection member, the at least one component-embedded substrate, and the semiconductor chip, and a second connection member disposed on the first connection member, the at least one component-embedded substrate, and the semiconductor chip. The first and second connection members each include redistribution layers electrically connected to the connection pads of the semiconductor chip, and the plurality of passive components embedded in the at least one component-embedded substrate are electrically connected to the connection pads of the semiconductor chip through the redistribution layer of the second connection member.

公开(公告)号：US20240055767A1

公开(公告)日：2024-02-15

申请号：US18383165

申请日：2023-10-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Moon Hee YI ,  Tae Seong KIM

IPC: H01Q9/04 ,  H01Q1/24 ,  H01Q1/42

CPC classification number: H01Q9/045 ,  H01Q1/243 ,  H01Q1/422

Abstract: An antenna substrate and an antenna module including the same are provided. The antenna substrate includes an antenna unit including first and second pattern layers adjacent to each other and disposed on different levels and a first insulating layer providing a first insulating region between the first and second pattern layers, and a feed unit including third and fourth pattern layers adjacent to each other and disposed on different levels and a second insulating layer providing a second insulating region between the third and fourth pattern layers. Each of the first and second pattern layers includes an antenna pattern, and each of the third and fourth pattern layers includes a feed pattern. The antenna unit is disposed on the feed unit. The first insulating region is thicker than the second insulating region.

公开(公告)号：US20180286790A1

公开(公告)日：2018-10-04

申请号：US16001430

申请日：2018-06-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jung Hyun CHO ,  Yong Ho BAEK ,  Jun Oh HWANG ,  Joo Hwan JUNG ,  Moon Hee YI

IPC: H01L23/495 ,  H01L23/367 ,  H01L23/00 ,  H01L23/31 ,  H01L23/522

CPC classification number: H01L23/49503 ,  H01L23/3107 ,  H01L23/3677 ,  H01L23/5226 ,  H01L23/525 ,  H01L23/5389 ,  H01L24/09 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24195 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15172 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/37001

Abstract: A fan-out semiconductor package includes: a first connection member having a through-hole and having a passive component disposed in the first connection member; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface having connection pads disposed therein and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first connection member and the inactive surface of the semiconductor chip; and a second connection member disposed on the first connection member and the active surface of the semiconductor chip. The first connection member and the second connection member include, respectively, redistribution layers electrically connected to the connection pads of the semiconductor chip, and the passive component is electrically connected to the connection pads of the semiconductor chip through the redistribution layer of the second connection member.

公开(公告)号：US20170309571A1

公开(公告)日：2017-10-26

申请号：US15413713

申请日：2017-01-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Moon Hee YI ,  Joo Hwan JUNG ,  Yul Kyo CHUNG

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L23/367

CPC classification number: H01L23/5389 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/14 ,  H01L24/20 ,  H01L2224/02311 ,  H01L2224/02379 ,  H01L2224/0239 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/13023 ,  H01L2224/13024 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/14131 ,  H01L2224/14177 ,  H01L2224/19 ,  H01L2224/215 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1579 ,  H01L2924/186 ,  H01L2924/19105 ,  H01L2924/3025

Abstract: A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first connection member and the inactive surface of the semiconductor chip; a pattern layer disposed on the encapsulant and covering at least portions of the encapsulant adjacent to the inactive surface of the semiconductor chip; vias penetrating through the encapsulant and connecting the pattern layer and the inactive surface of the semiconductor chip to each other; and a second connection member disposed on the first connection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads of the semiconductor chip.

公开(公告)号：US20230178902A1

公开(公告)日：2023-06-08

申请号：US17718708

申请日：2022-04-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Moon Hee YI ,  Hae Kyo SEO ,  Yong Hoon KIM ,  Seung Eun LEE

IPC: H01Q21/08 ,  H01Q1/24 ,  H01Q9/04 ,  H01Q1/48

CPC classification number: H01Q21/08 ,  H01Q1/243 ,  H01Q9/0407 ,  H01Q1/48

Abstract: An antenna substrate includes a skin layer containing an insulating material, a ground layer containing a conductive material, an insulating layer disposed between the skin layer and the ground layer and including an insulating material different from the insulating material of the skin layer, a plurality of patch antennas disposed between the ground layer and the skin layer, a shielding member disposed between the ground layer and the skin layer, spaced apart from the plurality of patch antennas, and connected to the ground layer, and a shielding post connected to the shielding member, and protruding further than an outer surface of the skin layer, from the shielding member in a direction facing the skin layer, at least a portion of the shielding post being disposed between the plurality of patch antennas.

公开(公告)号：US20210175627A1

公开(公告)日：2021-06-10

申请号：US16789039

申请日：2020-02-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Moon Hee YI ,  Tae Seong KIM

IPC: H01Q9/04 ,  H01Q1/42 ,  H01Q1/24

Abstract: An antenna substrate and an antenna module including the same are provided. The antenna substrate includes an antenna unit including first and second pattern layers adjacent to each other and disposed on different levels and a first insulating layer providing a first insulating region between the first and second pattern layers, and a feed unit including third and fourth pattern layers adjacent to each other and disposed on different levels and a second insulating layer providing a second insulating region between the third and fourth pattern layers. Each of the first and second pattern layers includes an antenna pattern, and each of the third and fourth pattern layers includes a feed pattern. The antenna unit is disposed on the feed unit. The first insulating region is thicker than the second insulating region.

公开(公告)号：US20190013282A1

公开(公告)日：2019-01-10

申请号：US15807075

申请日：2017-11-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Moon Hee YI ,  Yong Ho BAEK ,  Tae Seong KIM

IPC: H01L23/00

Abstract: A fan-out semiconductor package includes: a support member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the support member and the semiconductor chip; and a connection member disposed on the support member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads. The support member includes a glass plate and an insulating layer connected to the glass plate.