公开(公告)号：US20160013091A1

公开(公告)日：2016-01-14

申请号：US14723642

申请日：2015-05-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji-hwang Kim ,  Un-byoung Kang ,  Cha-jea Jo ,  Tae-je Cho

IPC: H01L21/768 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L21/486 ,  H01L21/563 ,  H01L23/147 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/17 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A method of manufacturing a semiconductor package includes forming a bonding layer on a carrier substrate, bonding an inner substrate to the carrier substrate, removing the carrier substrate, and forming a gap-filling portion by removing a portion of the bonding layer to expose a portion of a solder ball provided in the inner substrate. The inner substrate may be mounted on a package substrate and a semiconductor chip may be mounted on the inner substrate.

Abstract translation: 一种半导体封装的制造方法，其特征在于，在载体基板上形成接合层，将内部基板与载体基板接合，除去载体基板，通过除去接合层的一部分而形成间隙填充部， 设置在内部基板中的焊球。 内部基板可以安装在封装基板上，半导体芯片可以安装在内部基板上。