Abstract:
A memory device is provided. The memory device includes a cell array having memory cells; n word lines sequentially arranged and including a first word line, an n-th word line, and word lines interposed between the first word line and the n-th word line; bit lines; a first power node located adjacent to the first word line; a second power node located adjacent to the n-th word line; a first switch connected between the first power node and the cell array; a write driver located adjacent to the n-th word line and connected to the bit lines; and a switch controller configured to control the first switch to isolate the first power node from the memory cells during a write operation on memory cells connected to the first word line.
Abstract:
A semiconductor device includes a substrate having a plurality of active patterns. A plurality of gate electrodes intersects the plurality of active patterns. An active contact is electrically connected to the active patterns. A plurality of vias includes a first regular via and a first dummy via. A plurality of interconnection lines is disposed on the vias. The plurality of interconnection lines includes a first interconnection line disposed on both the first regular via and the first dummy via. The first interconnection line is electrically connected to the active contact through the first regular via. Each of the vias includes a via body portion and a via barrier portion covering a bottom surface and sidewalls of the via body portion. Each of the interconnection lines includes an interconnection line body portion and an interconnection line barrier portion covering a bottom surface and sidewalls of the interconnection line body portion.
Abstract:
A static random access memory device may include a write driver configured to float one of a first bitline and a second bitline connected to a memory cell and apply a write voltage to the other bitline in response to a logic state of a data signal; a write failure detector configured to receive a voltage of the floated bitline and output a write failure signal; and an assist voltage generator configured to generate a write assist voltage in response to the write failure signal. The write driver may additionally provide the write assist voltage to a bitline to which the write voltage is applied.
Abstract:
A static random access memory device may include a write driver configured to float one of a first bitline and a second bitline connected to a memory cell and apply a write voltage to the other bitline in response to a logic state of a data signal; a write failure detector configured to receive a voltage of the floated bitline and output a write failure signal; and an assist voltage generator configured to generate a write assist voltage in response to the write failure signal. The write driver may additionally provide the write assist voltage to a bitline to which the write voltage is applied.