公开(公告)号：US20240170448A1

公开(公告)日：2024-05-23

申请号：US18470082

申请日：2023-09-19

Applicant: SAMSUNG ELECTRONICS CO.,LTD.

Inventor： Sanghyeon Jeong ,  Youngja Kim ,  Junga Lee ,  Donguk Kwon

IPC: H01L23/00

CPC classification number: H01L24/81 ,  H01L23/562 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2924/3511

Abstract: A method of manufacturing a semiconductor package includes applying a plurality of forces to a plurality of points of a semiconductor chip through a plurality of elastic members, and bonding the semiconductor chip to an object while the plurality of forces are applied to the plurality of points of the semiconductor chip through the plurality of elastic members, wherein the plurality of elastic members are configured such that the plurality of forces are different from each other, and the plurality of forces flatten the semiconductor chip.

公开(公告)号：US20230180381A1

公开(公告)日：2023-06-08

申请号：US18071903

申请日：2022-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kanggyune Lee ,  Hyunggil Baek ,  Youngja Kim ,  Seungjin Lee

IPC: H05K1/02 ,  H01L23/544 ,  H01L23/498 ,  H01L25/10

CPC classification number: H05K1/0269 ,  H01L23/544 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L25/105 ,  H01L2223/54426 ,  H05K1/113

Abstract: A printed circuit board includes a substrate base; a plurality of ball lands arranged on a surface of the substrate base; a cutting position identification mark disposed on a corner of the surface of the substrate base; and at least one alignment mark disposed on the surface of the substrate base to be spaced apart from the ball lands and exposed to the outside, wherein top surfaces of the ball lands and a top surface of the at least one alignment mark are at substantially the same vertical level and the ball lands and the at least one alignment mark include the same material.