公开(公告)号：US20230258481A1

公开(公告)日：2023-08-17

申请号：US18307274

申请日：2023-04-26

Applicant: SEIKO EPSON CORPORATION

Inventor： Masayasu SAKUMA ,  Yoshihiro KOBAYASHI ,  Shojiro KITAMURA ,  Taketo CHINO

IPC: G01D11/24 ,  G01C19/5769 ,  G01C21/16 ,  H01R12/72 ,  H05K1/14

CPC classification number: G01D11/245 ,  G01C19/5769 ,  G01C21/166 ,  H01R12/72 ,  H05K1/148 ,  G01D11/30

Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.

公开(公告)号：US20210364330A1

公开(公告)日：2021-11-25

申请号：US17395519

申请日：2021-08-06

Applicant: Seiko Epson Corporation

Inventor： Masayasu SAKUMA ,  Yoshihiro KOBAYASHI ,  Shojiro KITAMURA ,  Taketo CHINO

IPC: G01D11/24 ,  G01C19/5769 ,  G01C21/16

Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.

公开(公告)号：US20190017852A1

公开(公告)日：2019-01-17

申请号：US16135510

申请日：2018-09-19

Applicant: Seiko Epson Corporation

Inventor： Masayasu SAKUMA ,  Yoshihiro KOBAYASHI ,  Shojiro KITAMURA ,  Taketo CHINO

IPC: G01D11/24 ,  G01C21/16 ,  G01C19/5769 ,  G01D11/30

Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.

公开(公告)号：US20170191832A1

公开(公告)日：2017-07-06

申请号：US15325399

申请日：2015-07-13

Applicant: SEIKO EPSON CORPORATION

Inventor： Yusuke KINOSHITA ,  Masayasu SAKUMA

IPC: G01C19/5783 ,  G01P15/125

Abstract: A sensor unit with high reliability and stable detection accuracy against vibrations of an installation target object is to be provided.A sensor unit includes: a sensor module configured including a substrate with inertial sensors mounted thereon, and an inner case in which the substrate is installed; and an outer case accommodating the sensor module. A recessed part is formed in the inner case. The inertial sensors are arranged in an area overlapping with the recessed part as viewed in a plan view seen from the direction of thickness of the substrate, and a filling member is provided to fill a space formed by the substrate and the recessed part. The sensor module is joined to a bottom wall of the outer case via a joining member.

公开(公告)号：US20160195396A1

公开(公告)日：2016-07-07

申请号：US15070943

申请日：2016-03-15

Applicant: Seiko Epson Corporation

Inventor： Masayasu SAKUMA ,  Yoshihiro KOBAYASHI ,  Shojiro KITAMURA ,  Taketo CHINO ,  Michiharu OGAMI

IPC: G01C19/5783

CPC classification number: G01C19/5783

Abstract: A module includes a first rigid substrate including an analog circuit; a second rigid substrate including a digital circuit; a third rigid substrate including an angular velocity sensor; a first connecting portion that connects the first rigid substrate and the second rigid substrate so as to electrically connect the analog circuit and the digital circuit, and that has flexibility; and a second connecting portion that connects the first rigid substrate and the third rigid substrate so as to electrically connect the analog circuit and the angular velocity sensor, and that has flexibility.

Abstract translation: 模块包括包括模拟电路的第一刚性基板; 包括数字电路的第二刚性基板; 包括角速度传感器的第三刚性基板; 第一连接部，其连接第一刚性基板和第二刚性基板，以便电连接模拟电路和数字电路，并且具有柔性; 以及第二连接部，其连接所述第一刚性基板和所述第三刚性基板，以电连接所述模拟电路和所述角速度传感器，并且具有柔性。

公开(公告)号：US20140347823A1

公开(公告)日：2014-11-27

申请号：US14263416

申请日：2014-04-28

Applicant: Seiko Epson Corporation

Inventor： Yusuke KINOSHITA ,  Yoshihiro KOBAYASHI ,  Yoshikuni SAITO ,  Masayasu SAKUMA

IPC: H05K1/18 ,  B23K26/20

CPC classification number: B23K26/211 ,  B23K1/0016 ,  B23K1/0056 ,  H05K1/117 ,  H05K1/18 ,  H05K1/181 ,  H05K3/3405 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10151 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/1053 ,  Y02P70/611

Abstract: A sensor unit is provided with a sensor device. The sensor device has a first electrode disposed on an outer surface. A board is provided with a first surface and a second surface in an obverse-reverse relationship with each other, and a side surface. A first conductive terminal is disposed along a contour of the first surface. The sensor device has the outer surface disposed along the side surface of the board, and has the first electrode connected to the first conductive terminal with a first conductive body, and a first projection length of the outer surface projecting on the first surface side is smaller than a second projection length of the outer surface projecting on the second surface side.

Abstract translation: 传感器单元设置有传感器装置。 传感器装置具有设置在外表面上的第一电极。 板设置有彼此成正交相反关系的第一表面和第二表面以及侧表面。 第一导电端子沿着第一表面的轮廓设置。 传感器装置具有沿着板的侧表面设置的外表面，并且具有与第一导电体连接到第一导电端子的第一电极，并且在第一表面侧上突出的外表面的第一突出长度较小 比在第二表面侧突出的外表面的第二突出长度更大。