公开(公告)号：US20230170229A1

公开(公告)日：2023-06-01

申请号：US17879785

申请日：2022-08-03

Applicant: SEMES CO, LTD.

Inventor： Kyeong Min LEE ,  Tae Keun KIM ,  Kang Sul KIM ,  Min Hee CHO ,  Won Young KANG

IPC: H01L21/67 ,  C23C14/58 ,  C23C14/50

CPC classification number: H01L21/67051 ,  C23C14/5873 ,  C23C14/505

Abstract: Provided are a substrate treatment apparatus and method for treating a substrate by simultaneously providing a stripper for peeling a coating film on the substrate to an entire surface of the substrate. The substrate treatment method includes discharging a first liquid onto a substrate by using a first nozzle, and forming a coating film collecting particles by using the first liquid; spraying a second liquid on the substrate by using a second nozzle, and peeling the coating film from the substrate by using the second liquid; and discharging a third liquid onto the substrate by using a third nozzle, and rinsing the coating film from the substrate by using the third liquid, wherein in the peeling of the coating film, the second liquid is simultaneously sprayed on an entire surface of the substrate.

公开(公告)号：US20190241844A1

公开(公告)日：2019-08-08

申请号：US16250069

申请日：2019-01-17

Applicant: Samsung Electronics Co., Ltd. ,  SEMES Co., Ltd.

Inventor： Mi Hyun PARK ,  Jung-Min OH ,  Young-Hoo KIM ,  Hyo San LEE ,  Tae Keun KIM ,  Ye Rim YEON ,  Hae Rim OH ,  Ji Soo JEONG ,  Min Hee CHO

IPC: C11D11/00 ,  H01L21/67 ,  H01L21/687 ,  H01L21/02 ,  B08B3/10 ,  C11D17/00 ,  C11D1/14 ,  C11D3/20 ,  C11D3/34 ,  C11D3/32 ,  C11D3/28

CPC classification number: C11D11/0047 ,  B08B3/10 ,  C11D1/146 ,  C11D3/201 ,  C11D3/2017 ,  C11D3/2044 ,  C11D3/2096 ,  C11D3/28 ,  C11D3/32 ,  C11D3/3445 ,  C11D17/0008 ,  H01L21/02057 ,  H01L21/67051 ,  H01L21/68764

Abstract: A cleaning composition, a cleaning apparatus, and a method of fabricating a semiconductor device, the cleaning composition including a surfactant; deionized water; and an organic compound, wherein the surfactant is included in the cleaning composition in a concentration of about 0.28M to about 0.39 M or a mole fraction of about 0.01 to about 0.017, and wherein the organic compound is included in the cleaning composition in a concentration of about 7.1 M to about 7.5 M or a mole fraction of about 0.27 to about 0.035.