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公开(公告)号：US20240178010A1
公开(公告)日：2024-05-30
申请号：US18242003
申请日：2023-09-05
Applicant: SEMES CO., LTD.
Inventor： Kang Sul KIM , Tae Keun KIM , Kyeong Min LEE
IPC: H01L21/67
CPC classification number: H01L21/67051
Abstract: A liquid supply apparatus is provided. The liquid supply apparatus includes: a base unit having an operating space, an inlet port, through which a treatment liquid is introduced, and an outlet port, through which the treatment liquid is discharged, formed therein; bellows having the operating space formed on its outside within the base unit, including an inlet and an outlet, which form ends of the inlet and outlet ports, respectively, of the base unit and communicate to create a storage space that the treatment liquid flows in and out of, and expanding or contracting to increase or reduce the volume of the storage space; an operating unit supplying operating fluid into or discharging the operating fluid from the operating space; and a drain line communicating with the storage space, from below the base unit, and discharging the treatment liquid, wherein the operating unit supplies the operating fluid into the operating space to enable the bellows to contract, or discharges the operating fluid from the operating space to enable the bellows to expand, and the drain line discharges residual treatment liquid remaining in the storage space to replace the treatment liquid.
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公开(公告)号：US20240173752A1
公开(公告)日：2024-05-30
申请号：US18516821
申请日：2023-11-21
Applicant: SEMES CO., LTD.
Inventor： Junhee CHOI , Tae-keun KIM , Kang Sul KIM , Kyeong Min LEE , Yong Jun KIM
CPC classification number: B08B3/08 , B08B3/02 , B08B3/12 , B08B5/02 , B08B13/00 , H01L21/02057 , H01L21/67051 , B08B2203/02
Abstract: Disclosed are a substrate processing apparatus and a substrate processing method that allow a chemical liquid to penetrate deeply into a gap between patterns of a substrate. The substrate processing apparatus includes a chamber having a processing space defined therein in which a substrate is processed; a chuck installed in the processing space and configured to support the substrate thereon; a chemical liquid supply formed on top of the chuck and configured to supply a chemical liquid droplet toward an upper surface of the substrate supported on the chuck; and a pressurizer formed on top of the chuck and configured to pressurize the chemical liquid droplet supplied on the upper surface of the substrate so that the pressed chemical liquid droplet fills a gap between patterns formed on the substrate.
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公开(公告)号：US20230170229A1
公开(公告)日：2023-06-01
申请号：US17879785
申请日：2022-08-03
Applicant: SEMES CO, LTD.
Inventor： Kyeong Min LEE , Tae Keun KIM , Kang Sul KIM , Min Hee CHO , Won Young KANG
CPC classification number: H01L21/67051 , C23C14/5873 , C23C14/505
Abstract: Provided are a substrate treatment apparatus and method for treating a substrate by simultaneously providing a stripper for peeling a coating film on the substrate to an entire surface of the substrate. The substrate treatment method includes discharging a first liquid onto a substrate by using a first nozzle, and forming a coating film collecting particles by using the first liquid; spraying a second liquid on the substrate by using a second nozzle, and peeling the coating film from the substrate by using the second liquid; and discharging a third liquid onto the substrate by using a third nozzle, and rinsing the coating film from the substrate by using the third liquid, wherein in the peeling of the coating film, the second liquid is simultaneously sprayed on an entire surface of the substrate.
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公开(公告)号：US20240198399A1
公开(公告)日：2024-06-20
申请号：US18525975
申请日：2023-12-01
Applicant: SEMES CO., LTD.
Inventor： Kyeong Min LEE , Tae-keun KIM , Kang Sul KIM
CPC classification number: B08B13/00 , B08B3/02 , B08B2203/02
Abstract: The present invention relates to a treatment liquid discharge assembly and a treatment liquid discharge method, and the treatment liquid discharge assembly includes a drain manifold connected to at least one discharge line of the substrate treatment apparatus and configured to define a predetermined accommodation space to temporarily accommodate a treatment liquid, and a drain pipe connected to a bottom surface of the accommodation space, in which the drain pipe defines a level difference with a predetermined height in the accommodation space of the drain manifold, and the drain pipe protrudes by the predetermined height from a bottom surface of the accommodation space toward an upper side of the accommodation space to define a buffer space in which the treatment liquid.
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公开(公告)号：US20230364656A1
公开(公告)日：2023-11-16
申请号：US17740772
申请日：2022-05-10
Applicant: SEMES CO., LTD.
Inventor： Tae-Keun KIM , Kyeong Min LEE , Min Hee CHO , Won Young KANG
CPC classification number: B08B7/0014 , H01L21/02057
Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes discharging a treating liquid including a polymer and a solvent onto a substrate; and solidifying a liquid film of the treating liquid by volatilizing the solvent from the treating liquid on the substrate, and wherein the solidifying a liquid film comprises a first period of stopping the rotation of the substrate or rotating the substrate at a first speed for a first time period.
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Patent Agency Ranking
公开(公告)号：US20230207338A1
公开(公告)日：2023-06-29
申请号：US17978328
申请日：2022-11-01
Applicant: SEMES CO., LTD.
Inventor： Min Hee CHO , Kyeong Min LEE , Won Young KANG , Kang Sul KIM , Tae-Keun KIM
CPC classification number: H01L21/67051 , H01L21/02052
Abstract: An exemplary embodiment of the present invention provides a substrate treating method including removing particles formed on a substrate by continuously performing a process of supplying a treatment liquid including a polymer and a solvent onto the substrate, forming a solidified liquid film by volatilizing the solvent in the treatment liquid, removing the solidified liquid film from the substrate by supplying a stripping liquid onto the substrate; and supplying a rinse liquid onto the substrate.
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公开(公告)号：US20240178009A1
公开(公告)日：2024-05-30
申请号：US18495180
申请日：2023-10-26
Applicant: SEMES CO., LTD.
Inventor： Kang Sul KIM , Tae-keun KIM , Junhee CHOI , Kyeong Min LEE , Yong Jun KIM
CPC classification number: H01L21/67028 , G03F7/162
Abstract: Disclosed are a substrate processing apparatus that allow a chemical liquid to penetrate deeply into a gap between patterns of a substrate. The substrate processing apparatus includes a housing having a processing space defined therein in which a substrate is processed; a substrate support installed in the processing space so as to be rotatable about a rotation axis and configured to support the substrate; a chemical liquid supply disposed on top of the substrate support and configured to spray a chemical liquid toward an upper surface of the substrate supported on the substrate support; and a controller configured to repeatedly apply a first rotation control signal and a second rotation control signal indicating different rotation speeds to the substrate support so as to generate an inertial behavior of the chemical liquid coated on the substrate.
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公开(公告)号：US20230405645A1
公开(公告)日：2023-12-21
申请号：US17826729
申请日：2022-05-27
Applicant: SEMES CO., LTD.
Inventor： Kyeong Min LEE , Tae-Keun KIM , Min Hee CHO , Won Young KANG
CPC classification number: B08B7/0014 , B08B3/10
Abstract: The inventive concept provides a substrate treating method. The substrate treating method includes supplying a dissolving solution onto a rotating substrate; and supplying, after the supplying a dissolution solution, a treating liquid including a polymer onto the rotating substrate to form a liquid film.
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公开(公告)号：US20250166987A1
公开(公告)日：2025-05-22
申请号：US18954889
申请日：2024-11-21
Applicant: SEMES CO., LTD.
Inventor： Yong Jun KIM , Tae Keun KIM , Kang Sul KIM , Jun Hee CHOI , Kyeong Min LEE
Abstract: Disclosed is a method of treating a substrate, the method including: a liquid treatment operation of treating a substrate by supplying a treatment solution to a rotating substrate to form a liquid film on the substrate; after the liquid treatment operation, a gas treatment operation of discharging gas to the substrate and removing an upper layer of the liquid film from the substrate; and after the gas treatment operation, a liquid film removal operation of removing a lower layer in the liquid film on the substrate.
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公开(公告)号：US20250140576A1
公开(公告)日：2025-05-01
申请号：US18921283
申请日：2024-10-21
Applicant: SEMES CO., LTD.
Inventor： Jun Hee CHOI , Tae Keun KIM , Kang Sul KIM , Kyeong Min LEE , Yong Jun KIM , Hyeong Soo PARK
IPC: H01L21/67 , H01L21/02 , H01L21/304
Abstract: Disclosed is a method of processing a substrate, the method including: a coating operation of supplying a coating liquid containing a volatile component to a top surface of the substrate to form a cleaning film; and a cleaning film processing operation of processing the cleaning film, in which the cleaning film processing operation includes: a crack formation operation of generating a crack in the cleaning film formed on the substrate to form film flakes; and a delamination operation of delaminating the film flakes from the top surface of the substrate by volatilizing the volatile component contained in the film flake.
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