公开(公告)号：US20240153831A1

公开(公告)日：2024-05-09

申请号：US18382042

申请日：2023-10-19

Applicant: SEMES CO., LTD.

Inventor： Yong Jun SEO ,  Su Jin CHAE ,  Sang Hyun SON ,  Sang Min HA ,  Young Sik BANG ,  Jeong Mo HWANG ,  Dong Ok AHN

IPC: H01L21/66 ,  G01F1/684 ,  G01F1/688 ,  G01F1/696

CPC classification number: H01L22/34 ,  G01F1/6845 ,  G01F1/6888 ,  G01F1/6965

Abstract: An apparatus and method for measuring air currents on the surface of a substrate, which can accurately measure the magnitude and direction of air currents on the surface of a wafer with wafer-type air current measurement sensors, are provided. The apparatus includes: a first air current measurement module measuring a magnitude of air currents on a surface of a first substrate, which is processed in accordance with a semiconductor manufacturing process; a second air current measurement module measuring a movement direction of the air currents; and a power module supplying power to the first and second air current measurement modules, wherein the first air current measurement module, the second air current measurement module, and the power module are mounted on a second substrate, which has the same shape as the first substrate.

公开(公告)号：US20230205235A1

公开(公告)日：2023-06-29

申请号：US18147798

申请日：2022-12-29

Applicant: SEMES CO., LTD.

Inventor： Jae Hong KIM ,  Hyeong Jun CHO ,  Sang Hyun SON ,  Sang Min HA

IPC: G05D7/06 ,  G01F1/667 ,  B08B3/02 ,  B08B13/00

CPC classification number: G05D7/0623 ,  G01F1/667 ,  G05D7/0635 ,  B08B3/02 ,  B08B13/00 ,  H01L21/02057

Abstract: The present invention provides a method for treating a substrate. The method for treating a substrate comprises: a monitoring step of calculating a flow rate of a liquid, comparing the calculated measurement flow rate of the liquid with a set flow rate of the liquid in a normal state, and determining whether an error occurs in the measurement flow rate; and when an error is determined to occur in the measurement flow rate in the monitoring step, a feedback step of performing feedback control of a discharge flow rate of the liquid discharged to the substrate, wherein the feedback step determines a type of the error, and differently performs the feedback control according to the determined type of the error.

公开(公告)号：US20230201860A1

公开(公告)日：2023-06-29

申请号：US18147353

申请日：2022-12-28

Applicant: SEMES CO., LTD.

Inventor： Sang Min HA ,  Hyeong Jun CHO ,  Jae Hong KIM ,  Sang Hyun SON ,  Young-Joo SEO

IPC: B05C5/02

CPC classification number: B05C5/0225 ,  B05C5/0291

Abstract: The present invention provides a substrate processing device. An aspect of the present disclosure is to a substrate processing device and a control method for substrate processing device which can improve a resolution of a printer by determining a discharge time of an ink discharge controller with a higher resolution than a pulse wave generated by an encoder.

公开(公告)号：US20220091150A1

公开(公告)日：2022-03-24

申请号：US17482845

申请日：2021-09-23

Applicant: SEMES CO., LTD.

Inventor： Yong-Jun SEO ,  Sang Hyun SON ,  Ji Su HONG ,  Jae Myoung LEE ,  Dong Ok AHN

IPC: G01P5/12 ,  G01P13/04

Abstract: The inventive concept provides a wafer type sensor unit which acquires data on a wind direction and a wind velocity of an air flow during processing, the wafer type sensor unit supported by a supporting unit of a substrate processing apparatus. The unit comprising a wafer-shaped circuit board and a hot-wired wind velocity sensor placed apart from an upper surface of the circuit board.