公开(公告)号：US20140054773A1

公开(公告)日：2014-02-27

申请号：US13944188

申请日：2013-07-17

Applicant: Shinko Electric Industries Co., Ltd.

Inventor： Nobuyuki KURASHIMA ,  Tetsuya KOYAMA ,  Hajime IIZUKA ,  Koichi TANAKA

IPC: H01L23/28 ,  H01L23/498

CPC classification number: H01L23/28 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/562 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/14 ,  H05K1/186 ,  H05K3/284 ,  H05K3/462 ,  H05K3/4697 ,  H05K2201/10234 ,  H05K2203/1327 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An electronic component built-in substrate, includes a lower wiring substrate, an electronic component mounted on the lower wiring substrate, an intermediate wiring substrate including an opening portion in which the electronic component is mounted, and arranged in a periphery of the electronic component, and connected to the lower wiring substrate via a first conductive ball, an upper wiring substrate arranged over the electronic component and the intermediate wiring substrate, and connected to the intermediate wiring substrate via a second conductive ball, and a resin filled into respective areas between the lower wiring substrate, the intermediate wiring substrate, and the upper wiring substrate, and sealing the electronic component, wherein the first conductive ball and the second conductive ball are arranged in displaced positions mutually.

Abstract translation: 电子部件内置基板包括下布线基板，安装在下布线基板上的电子部件，包括安装有电子部件的开口部并配置在电子部件的周围的中间布线基板， 并且经由第一导电球，布置在电子部件上的上部布线基板和中间布线基板连接到下部布线基板，并且经由第二导电球与中间布线基板连接，并且将树脂填充到第二导电球之间的各个区域中 下布线基板，中间布线基板和上布线基板，并且密封电子部件，其中第一导电球和第二导电球相互布置在位移​​位置。